Control of semiconductor processing
    1.
    发明授权
    Control of semiconductor processing 有权
    半导体处理控制

    公开(公告)号:US06641746B2

    公开(公告)日:2003-11-04

    申请号:US09967435

    申请日:2001-09-28

    IPC分类号: H01L2100

    摘要: An integrated metrology and lithography/etch system and method (10) for micro-electronics device manufacturing. A process control neural network (30) is used to develop an estimated process control parameter (32) for controlling an etching process (28). The process control neural network is responsive to a multi-parameter characterization of a patterned resist feature MPC(PR) (16) developed on a substrate. The process control parameter is used as a feed-forward control for the etching process to develop an actual final mask feature. A multi-parameter characterization of the actual final mask feature MPC(HM) (36) is used as an input to a training neural network (40) for mapping to an ideal process control parameter. The ideal process control parameter is compared to the estimated control parameter to develop an error parameter (46), which is then used to train the process control neural network.

    摘要翻译: 用于微电子器件制造的综合测量和光刻/蚀刻系统和方法(10)。 过程控制神经网络(30)用于开发用于控制蚀刻过程(28)的估计过程控制参数(32)。 过程控制神经网络响应于在衬底上显影的图案化抗蚀剂特征MPC(PR)(16)的多参数表征。 过程控制参数用作蚀刻过程的前馈控制以开发实际的最终掩模特征。 使用实际最终掩模特征MPC(HM)(36)的多参数表征作为训练神经网络(40)的输入,用于映射到理想的过程控制参数。 将理想的过程控制参数与估计的控制参数进行比较,以开发误差参数(46),然后将其用于训练过程控制神经网络。

    Calibration standard for high resolution electron microscopy
    2.
    发明授权
    Calibration standard for high resolution electron microscopy 失效
    高分辨率电子显微镜的校准标准

    公开(公告)号:US06750447B2

    公开(公告)日:2004-06-15

    申请号:US10122645

    申请日:2002-04-12

    IPC分类号: G12B1300

    摘要: A method and apparatus used to calibrate high-resolution electron microscopes where a single standard provides multiple samples, each having a different atomic structure, permits rapid accurate calibration of the entire range of magnifications. The different atomic structure dimensions possess known reference measurement data. The S/TEM is adjusted to focus onto the crystal lattice structure of each sample in a selected sequence. Measurements of these lattice spacings are compared to known dimensions. If S/TEM measurements do not agree with the lattice spacing dimensions, the S/TEM magnification is adjusted to reflect known dimensions. Typical standard exchange and associated processing steps are eliminated by the use of the single standard comprising of a plurality of samples.

    摘要翻译: 用于校准高分辨率电子显微镜的方法和装置,其中单个标准提供多个样品,每个样品具有不同的原子结构,允许快速精确校准整个放大倍数。 不同的原子结构尺寸具有已知的参考测量数据。 调整S / TEM以选择的顺序聚焦到每个样品的晶格结构上。 将这些晶格间距的测量与已知尺寸进行比较。 如果S / TEM测量与晶格间距尺寸不一致,则调整S / TEM放大倍率以反映已知尺寸。 通过使用包含多个样品的单一标准来消除典型的标准交换和相关处理步骤。

    Three dimensional reconstruction metrology
    3.
    发明授权
    Three dimensional reconstruction metrology 有权
    三维重建计量学

    公开(公告)号:US06714892B2

    公开(公告)日:2004-03-30

    申请号:US09967119

    申请日:2001-09-28

    IPC分类号: G06F1500

    摘要: A system and method of metrology (10) whereby a three dimensional shape profile is defined (16) for a surface feature on a substrate by applying (38) a transform function F(x) to an image intensity map I(x,y) obtained (40) by inspecting the substrate with a scanning electron microscope (12). The transform function F(x) is developed (34) by correlating the image intensity map of a first wafer (18) to a height vector (32) obtained by inspecting the first wafer with a more accurate metrology tool, for example a stylus nanoprofilometer (14). A simple ratio-based transform may be used to develop F(x). An asymmetric multiple parameter characterization of the three dimensional shape profile may be developed (74) by plotting critical space and width dimensions (SL, SR, W1, WR) from a vertical axis (C—C) as a function of height of the feature.

    摘要翻译: 一种计量系统和方法(10),其中通过将变换函数F(x)应用于图像强度图I(x,y)(38)来定义(16)用于衬底上的表面特征的三维形状轮廓, 通过用扫描电子显微镜(12)检查基板得到(40)。 通过将第一晶片(18)的图像强度图与通过用更精确的计量工具检查第一晶片获得的高度矢量(32)相关联来开发变换函数F(x),例如,触笔纳米玻璃体计 (14)。 可以使用简单的基于比例的变换来开发F(x)。 可以通过从垂直轴(C-C)绘制关键空间和宽度尺寸(SL,SR,W1,WR)作为特征的高度的函数来开发三维形状轮廓的不对称多参数表征(74)。

    Monitoring system for determining progress in a fabrication activity
    4.
    发明授权
    Monitoring system for determining progress in a fabrication activity 有权
    用于确定制造活动进展的监测系统

    公开(公告)号:US06569690B1

    公开(公告)日:2003-05-27

    申请号:US09653364

    申请日:2000-08-31

    IPC分类号: H01L2100

    摘要: Method for fabricating a structure. According to an exemplary embodiment, a structure is made by forming a layer of removable material with a first surface spaced a part from a second surface. The first surface is formed along a first region from which the material is removable. The first surface is altered by removal of material from the layer. Removed material from the first surface is monitored to detect fluctuations in a variable of composition in the layer, and removal of material from the first surface is terminated when the composition of monitored material meets a predetermined criterion. In an alternate embodiment a variable characteristic is imparted to a layer of material as a function of layer thickness and an operation is performed on the layer resulting in removal of material. Samples of removed material are monitored for variation in the characteristic and the operation is modified when a variation conforms with a criterion.

    摘要翻译: 制造结构的方法。 根据示例性实施例,通过形成具有与第二表面间隔一部分的第一表面的可移除材料层来制造结构。 第一表面沿着第一区域形成,材料可从该第一区域移除。 通过从层中去除材料来改变第一表面。 监测来自第一表面的去除材料以检测该层中组成变量的波动,并且当所监测材料的组成符合预定标准时,从第一表面去除材料终止。 在替代实施例中,可变特性被赋予作为层厚度的函数的材料层,并且在层上进行操作,导致材料的去除。 监测去除材料的样品的特性变化,并且当变化符合标准时修改操作。

    Abnormal photoresist line/space profile detection through signal processing of metrology waveform
    6.
    发明授权
    Abnormal photoresist line/space profile detection through signal processing of metrology waveform 有权
    通过信号处理计量波形的异常光刻胶线/空间轮廓检测

    公开(公告)号:US06708574B2

    公开(公告)日:2004-03-23

    申请号:US10156242

    申请日:2002-05-24

    IPC分类号: G01M1900

    摘要: A semiconductor manufacturing automation method for analyzing a patterned feature formed on a semiconductor layer is disclosed. At least one patterned feature is scanned to generate an amplitude modulated waveform signal of the line and neighboring space characteristics. Signal processing is automatically performed on this waveform by an in-line computational source to extract known patterned features based on the profile of the amplitude modulated waveform signal. The extracted waveform segments are subjected to known geometric shapes to determine if the waveform indicates a normal or abnormal patterned feature on a semiconductor layer.

    摘要翻译: 公开了一种用于分析形成在半导体层上的图案特征的半导体制造自动化方法。 扫描至少一个图案化特征以产生线和相邻空间特征的幅度调制波形信号。 通过在线计算源自动对该波形执行信号处理,以基于幅度调制波形信号的轮廓来提取已知的图案特征。 提取的波形段经历已知的几何形状以确定波形是否指示半导体层上的正常或异常图案化特征。

    Process control using three dimensional reconstruction metrology

    公开(公告)号:US06651226B2

    公开(公告)日:2003-11-18

    申请号:US09967114

    申请日:2001-09-28

    IPC分类号: G06F1750

    CPC分类号: G03F7/70491 G03F7/70625

    摘要: In-line process control for 120 nm and 100 nm lithography using the installed scanning electron microscope (SEM) equipment base. A virtual three-dimensional representation of a photoresist feature is developed by applying a transform function to SEM intensity data representing the feature. The transform function correlates highly accurate height vector data, such as provided by a stylus nanoprofilometer or scatterometer, with the highly precise intensity data from the SEM. A multiple parameter characterization of at least one critical dimension of the virtual feature is compared to an acceptance pattern template, with the results being used to control a downstream etch process or an upstream lithography process. A multiple parameter characteristic of a three dimensional representation of the resulting post-etch final feature may be compared to device performance data to further refine the acceptance pattern template.

    X-ray system
    8.
    发明授权
    X-ray system 有权
    X光系统

    公开(公告)号:US06606371B2

    公开(公告)日:2003-08-12

    申请号:US09745236

    申请日:2000-12-19

    IPC分类号: G21K106

    摘要: A reflective lens with at least one curved surface formed of polycrystalline material. In one embodiment, a lens structure includes a substrate having a surface of predetermined curvature and a film formed along a surface of the substrate with multiple individual members each having at least one similar orientation relative to the portion of the substrate surface adjacent the member such that collectively the members provide predictable angles for diffraction of x-rays generated from a common source. A system is also provided for performing an operation with x-rays. In one embodiment, a system includes a source for generating the x-rays, a polycrystalline surface region having crystal spacing suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, and transmitting the reflected x-rays to a reference position. An associated method includes providing x-rays to polycrystalline surface region having crystal spacings suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, transmitting the reflected x-rays to a reference position and positioning a sample between the surface region and the reference position so that the x-rays are transmitted through the sample.

    摘要翻译: 具有由多晶材料形成的至少一个曲面的反射透镜。 在一个实施例中,透镜结构包括具有预定曲率的表面的基底和沿着基底的表面形成的膜,多个单独的构件各自具有相对于邻近构件的基底表面的部分的至少一个相似的取向,使得 共同地,这些构件为从公共源产生的x射线的衍射提供可预测的角度。 还提供了一种用于使用X射线进行操作的系统。 在一个实施例中,系统包括用于产生x射线的源,具有适合于沿着该区域以相同的布拉格角反射多个x射线的晶体间距的多晶表面区域,以及将反射的x射线透射到 参考位置。 相关联的方法包括向具有晶体间距的多晶表面区域提供x射线,该晶体间距适于沿着该区域以相同的布拉格角反射多个x射线,将反射的x射线透射到参考位置,并将样品定位在表面 区域和参考位置,使得x射线透射通过样品。

    Chemical mechanical polishing of dual orientation polycrystalline materials
    9.
    发明授权
    Chemical mechanical polishing of dual orientation polycrystalline materials 失效
    双取向多晶材料的化学机械抛光

    公开(公告)号:US06899596B2

    公开(公告)日:2005-05-31

    申请号:US10121370

    申请日:2002-04-12

    CPC分类号: C09G1/02 B24B37/044

    摘要: A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.

    摘要翻译: 使用具有极性的化学活性浆料的化学机械抛光(CMP)方法,其选择为影响被抛光的多晶表面的各个晶面的相对氧化速率。 控制浆料极性以在CMP过程期间平衡来自相应结晶平面的材料去除速率。 可以将极性溶质加入到碱性溶剂中以获得所需的极性。 用于钨膜的CMP方法可以使用含有研磨剂,氧化剂和极性小于水的极性溶质的水基浆料。 研磨剂可以是胶体二氧化硅,氧化剂可以是过氧化氢,溶质可以是苯。

    Apparatus for scanning a crystalline sample and associated methods
    10.
    发明授权
    Apparatus for scanning a crystalline sample and associated methods 有权
    用于扫描结晶样品和相关方法的装置

    公开(公告)号:US06825467B2

    公开(公告)日:2004-11-30

    申请号:US10180221

    申请日:2002-06-25

    IPC分类号: G01N23203

    CPC分类号: G01N23/20

    摘要: The present invention provides and apparatus and method for scanning a crystalline sample comprising a sample holder, an electron source for generating an electron beam and a scanning actuator for controlling the relative movement between the electron beam and the crystalline sample. In addition, an image processor is provided for processing images from electrons from the crystalline sample and a controller for controlling the scanning actuator to space points on the crystalline sample, at which the electron beam is directed. The points are preferably spaced apart a distance that is at least as large as a known grain size of the crystalline sample. The controller determines a grain orientation with respect to each point within a series of points within a scan area of the crystalline sample. The controller determines an average grain orientation for the crystalline sample for current image and a previously processed image. The controller monitors a variance in the average deviation and terminates the scanning when the variance in the average grain orientation approaches a predetermined value.

    摘要翻译: 本发明提供了用于扫描包括样品架,用于产生电子束的电子源和用于控制电子束和结晶样品之间的相对运动的扫描致动器的结晶样品的装置和方法。 此外,提供了一种用于处理来自结晶样品的电子的图像的图像处理器和用于控制扫描致动器以在电子束被引导的结晶样品上的空间点的控制器。 这些点优选间隔开至少与已知晶体尺寸的结晶样品一样大的距离。 控制器确定相对于晶体样品的扫描区域内的一系列点内的每个点的晶粒取向。 控制器确定当前图像和先前处理的图像的晶体样本的平均晶粒取向。 控制器监视平均偏差的变化,并且当平均晶粒取向的变化接近预定值时终止扫描。