利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

30 条记录 (耗时 0.022 秒)

    Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing
    1.
    发明授权
    Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing 失效
    用于适用于用于老化测试的不同厚度的IC模块的插座的盖组件

    公开(公告)号：US6086387A

    公开(公告)日：2000-07-11

    申请号：US78769

    申请日：1998-05-14

    申请人： Ethan E. Gallagher ,  David L. Gardell ,  Paul M. Gaschke

    发明人： Ethan E. Gallagher ,  David L. Gardell ,  Paul M. Gaschke

    IPC分类号： G01R1/04 ,  G01R31/28 ,  H05K7/10 ,  H01R9/09

    CPC分类号： H05K7/1061 ,  G01R1/0483 ,  G01R31/2863

    摘要： A cover assembly for a socket suitable to accommodate modules of varying thicknesses which can be advantageously used for final test and burn-in test is described. The assembly is characterized by having a low profile and includes a hinged lid; a floating shaft coupled to two cams pivoting on the floating shaft; a locking member positioned between the two cams for locking the hinged lid when in a closed position, the locking member pivoting about the floating shaft; a pressure plate for forcing the module into the socket; and stiffening members integral to the hinged lid located on opposing sides of the hinged lid and below the surface of the pressure plate for providing added strength to the assembly. The assembly also includes a heatsink inserted through an aperture located in the pressure plate, to directly contact the chip which is mounted on the module. The force applied to the chip is independent of the force applied to the module.

    摘要翻译： 描述了一种用于插座的盖组件，其适于容纳可用于最终测试和老化测试的不同厚度的模块。 组件的特征在于具有低轮廓并且包括铰接盖; 联接到在浮动轴上枢转的两个凸轮的浮动轴; 定位在所述两个凸轮之间的锁定构件，用于在处于关闭位置时锁定所述铰接盖，所述锁定构件围绕所述浮动轴枢转; 用于迫使模块进入插座的压板; 以及加强构件，其与位于铰接盖的相对侧上的铰接盖成一体，并且在压板的表面下方，用于为组件增加强度。 组件还包括通过位于压力板中的孔插入的散热器，以直接接触安装在模块上的芯片。 施加到芯片的力与施加到模块的力无关。

    Apparatus for temporary thermal coupling of an electronic device to a heat sink during test
    2.
    发明授权
    Apparatus for temporary thermal coupling of an electronic device to a heat sink during test 失效
    用于在测试期间将电子设备临时热耦合到散热器的装置

    公开(公告)号：US07332927B2

    公开(公告)日：2008-02-19

    申请号：US11743899

    申请日：2007-05-03

    申请人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis D. Turcotte

    发明人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis D. Turcotte

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

    摘要： A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

    摘要翻译： 一种用于测试集成电路芯片的方法，系统和装置。 该系统包括：用于在集成电路芯片的底表面上形成液体聚α-烯烃层的装置，集成电路芯片的顶表面和没有信号和功率垫的底表面; 用于将散热器的表面放置成与聚α-烯烃精细层的底表面物理接触的装置; 用于将集成电路芯片电耦合到测试器的装置; 用于电测试集成电路芯片的装置; 用于将集成电路芯片与测试器电耦合的装置; 用于去除所述散热器与所述聚α-烯烃精氢层接触的装置，所述或部分所述聚α-烯烃精矿层残留在所述集成电路芯片的底表面上; 以及用于从集成电路芯片的底表面去除聚α-烯烃精细层的装置。

    Segmented architecture for wafer test and burn-in
    4.
    发明授权
    Segmented architecture for wafer test and burn-in 有权
    用于晶圆测试和老化的分段架构

    公开(公告)号：US06275051B1

    公开(公告)日：2001-08-14

    申请号：US09240121

    申请日：1999-01-29

    申请人： Thomas W. Bachelder ,  Dennis R. Barringer ,  Dennis R. Conti ,  James M. Crafts ,  David L. Gardell ,  Paul M. Gaschke ,  Mark R. Laforce ,  Charles H. Perry ,  Roger R. Schmidt ,  Joseph J. Van Horn ,  Wade H. White

    发明人： Thomas W. Bachelder ,  Dennis R. Barringer ,  Dennis R. Conti ,  James M. Crafts ,  David L. Gardell ,  Paul M. Gaschke ,  Mark R. Laforce ,  Charles H. Perry ,  Roger R. Schmidt ,  Joseph J. Van Horn ,  Wade H. White

    IPC分类号： G01R1073

    CPC分类号： G01R31/2863

    摘要： An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.

    摘要翻译： 用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片，连接两个板的电连接器。 测试器芯片用于向产品芯片分配电力或用于测试产品芯片。 其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。 第一板和第二板的基座对于产品系列中的所有晶片都保持不变。 使用两个电路板提供了测试器芯片在燃烧期间保持在比产品芯片基本上更低的温度，以延长测试器芯片的寿命。 间隙可以用作板之间的绝热，并将间隙密封并抽真空以进行进一步的隔热。 疏散还提供大气压力增加的接触，用于连接板和与晶片的接触。 用于平行测试芯片的探针被布置成月牙形条纹，以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。

    LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLYMER DOPED CROSSLINKED NETWORKS AND RELATED METHOD
    6.
    发明申请
    LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLYMER DOPED CROSSLINKED NETWORKS AND RELATED METHOD 失效
    具有线性结构聚合物掺杂交联网络的混合物的液体热界面及相关方法

    公开(公告)号：US20090281254A1

    公开(公告)日：2009-11-12

    申请号：US12115809

    申请日：2008-05-06

    申请人： Randall J. Bertrand ,  Mark S. Chace ,  David L. Gardell ,  George J. Lawson ,  Yvonne Morris ,  Charles L. Reynolds ,  Jiali Wu

    发明人： Randall J. Bertrand ,  Mark S. Chace ,  David L. Gardell ,  George J. Lawson ,  Yvonne Morris ,  Charles L. Reynolds ,  Jiali Wu

    IPC分类号： C08G77/38

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00

    摘要： A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment of the method includes mixing a crosslinker with a linearly structured polymer to form a mixture, wherein the crosslinker includes a base agent including a vinyl-terminated or branched polydimethylsiloxane, and a curing agent including a hydrogen-terminated polydimethylsiloxane; and curing the mixture. The crosslinker functions as cages to block linear or branched linear macromolecules and prevents them from sliding into each other, thus increasing surface tension of the resulting LTI.

    摘要翻译： 提出了包含掺杂有交联网络的线性结构聚合物的混合物的液体热界面（LTI）和相关方法。 LTI表现出降低的液体聚合物大分子迁移率，从而增加表面张力。 该方法的一个实施方案包括将交联剂与线形结构聚合物混合以形成混合物，其中交联剂包括包含乙烯基封端或支化聚二甲基硅氧烷的基础试剂和包含氢封端的聚二甲基硅氧烷的固化剂; 并固化混合物。 交联剂用作笼子以阻断线性或分支的线性大分子并防止它们彼此滑动，从而增加所得LTI的表面张力。

    Method for wafer test and wafer test system for implementing the method
    7.
    发明授权
    Method for wafer test and wafer test system for implementing the method 失效
    晶圆测试方法及实施该方法的晶圆测试系统

    公开(公告)号：US06720789B1

    公开(公告)日：2004-04-13

    申请号：US10366157

    申请日：2003-02-13

    申请人： David M. Audette ,  David L. Gardell ,  John F. Hagios

    发明人： David M. Audette ,  David L. Gardell ,  John F. Hagios

    IPC分类号： G01R3102

    CPC分类号： G01R31/2886

    摘要： A method and system for testing wafers, and particularly a wafer test system employing probes to provide for electrical contact with a device under test (DUT) which is located on a wafer. More particularly, also provided is a method and system for implementing wafer tests where the probes first contact a simulated wafer which incorporates an array of spaced load cells to determine the optimum probe overdrive. The DUT is then tested at the optimum overdrive.

    摘要翻译： 一种用于测试晶片的方法和系统，特别是采用探针来提供与被测器件（DUT）的电接触的晶片测试系统。 更具体地，还提供了一种用于实施晶片测试的方法和系统，其中探针首先接触包含间隔开的负载传感器阵列的模拟晶片以确定最佳探针过驱动。 然后在最佳过驱动下测试DUT。

    Actively controlled heat sink for convective burn-in oven
    8.
    发明授权
    Actively controlled heat sink for convective burn-in oven 失效
    主动控制的散热器，用于对流老化烤箱

    公开(公告)号：US06504392B2

    公开(公告)日：2003-01-07

    申请号：US09277233

    申请日：1999-03-26

    申请人： John A. Fredeman ,  David L. Gardell ,  Marc D. Knox ,  Mark R. LaForce

    发明人： John A. Fredeman ,  David L. Gardell ,  Marc D. Knox ,  Mark R. LaForce

    IPC分类号： G01R3102

    CPC分类号： G01R1/0458

    摘要： A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink. The heat transferring device uses input from the sensor to provide heat or cooling to each heat sink to individually control the temperature of each component. The heat transferring device can be an electric heater or a cooling device, such as a fan. Both can also be used. A plurality of these sockets are used in a forced air convective oven for burning-in a plurality of electronic components at one time. The oven provides oven heating and cooling for all components while the socket heater and sensor provide individual temperature control for each component.

    摘要翻译： 用于测试或燃烧电子部件的插座具有包括散热器和传感器的盖。 散热器和传感器是弹簧加载的，因此它们在老化期间与插座中的电子部件直接临时接触。 传热装置连接到每个散热器。 传热装置使用来自传感器的输入来向每个散热器提供热量或冷却，以分别控制每个部件的温度。 传热装置可以是电加热器或诸如风扇的冷却装置。 两者也可以使用。 多个这样的插座用于强制空气对流烘箱，用于一次燃烧多个电子部件。 烤箱为所有组件提供烤箱加热和冷却，而插座加热器和传感器为每个组件提供单独的温度控制。

    Thermal processing furnace
    10.
    发明授权
    Thermal processing furnace 失效
    热处理炉

    公开(公告)号：US5252062A

    公开(公告)日：1993-10-12

    申请号：US961290

    申请日：1992-10-15

    申请人： Robert F. Groves ,  Lynda L. Eaton ,  David L. Gardell ,  Paul H. Boileau

    发明人： Robert F. Groves ,  Lynda L. Eaton ,  David L. Gardell ,  Paul H. Boileau

    IPC分类号： F27D17/00 ,  F27B5/05 ,  F27B11/00 ,  F27D99/00 ,  H01L21/22 ,  F27B5/04

    CPC分类号： F27D99/0073 ,  F27B11/00

    摘要： The subject invention encompasses a thermal processing furnace having an elongated cylindrical processing chamber surrounding a tower assembly capable of receiving one or more articles to be processed. A pedestal assembly supports the tower assembly and contains a quartz door thereon which is axially translatable relative to the processing chamber into an inserted position where the tower assembly is inserted into the processing chamber. A quartz flange located along the perimeter of an opening at the end of the processing chamber contacts the quartz door forming a quartz seal therewith when the pedestal assembly is moved into the inserted position. A scavenger cavity is located at the end of the chamber having the opening therein and is in fluid flow relationship with the contact area between the quartz flange and the quartz door forming a quartz seal. Gas from within the processing chamber which may leak through the quartz seal is captured by the scavenger cavity and evacuated by an evacuation means.

    摘要翻译： 本发明包括一种热处理炉，其具有围绕能够接收一个或多个待处理物品的塔架组件的细长圆柱形处理室。 基座组件支撑塔架组件并且在其上包含石英门，其上相对于处理室可轴向平移到塔架组件插入处理室中的插入位置。 在基座组件移动到插入位置时，位于处理室端部处的开口周边的石英凸缘与石英门接触，形成石英密封。 清除腔位于其中具有开口的室的端部处，并且与石英凸缘和石英门之间的接触面积形成流体流动关系，形成石英密封。 来自处理室内的可能通过石英密封泄漏的气体被清除腔捕获并被抽空装置排空。