摘要:
In the present method of fabricating a semiconductor device, initially, a semiconductor substrate is provided. An oxide layer is provided on and in contact with the substrate, and a polysilicon layer is provided on and in contact with the oxide layer. A layer of photoresist is provided on the polysilicon layer, and the photoresist is patterned to provide a photoresist body, which is used as a mask to etch away polysilicon and oxide, forming a polysilicon element thereunder. The photoresist body is then removed. A nickel layer is provided on the resulting structure, and a reaction step is undertaken to provide that nickel diffuses into the exposed top and side portions of the polysilicon body, forming nickel silicide. After the reaction step, the remaining nickel is removed, and a chemical-mechanical polishing step is undertaken to remove nickel silicide so that a pair of nickel silicide bodies remain, separated by polysilicon. Using the nickel silicide bodies as masks, the polysilicon and oxide thereunder are etched away.
摘要:
In the present method of fabricating a semiconductor device, initially, a semiconductor substrate is provided. An oxide layer is provided on and in contact with the substrate, and a polysilicon layer is provided on and in contact with the oxide layer. A layer of photoresist is provided on the polysilicon layer, and the photoresist is patterned to provide a photoresist body, which is used as a mask to etch away polysilicon and oxide, forming a polysilicon element thereunder. The photoresist body is then removed. A nickel layer is provided on the resulting structure, and a reaction step is undertaken to provide that nickel diffuses into the exposed top and side portions of the polysilicon body, forming nickel silicide. After the reaction step, the remaining nickel is removed, and a chemical-mechanical polishing step is undertaken to remove nickel silicide so that a pair of nickel silicide bodies remain, separated by polysilicon. Using the nickel silicide bodies as masks, the polysilicon and oxide thereunder are etched away.
摘要:
A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.
摘要:
A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.
摘要:
A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.
摘要:
Methods and structures for reducing resistance in wordlines of an integrated circuit memory device are disclosed. In one embodiment, the method includes forming multiple columns of polycrystalline silicon for respective number of wordlines, forming core transistor junctions and periphery transistor junctions associated with the wordlines, performing a salicidation process for the periphery transistor junction and performing a salicidation process for the columns of polycrystalline silicon to from the wordlines with low resistance.
摘要:
An apparatus is disclosed for studying an object based on at least one of polarization, space, position or angle of light that has reflected from the object. An optical tomographic instrumentation of the apparatus includes a light source coupled to a source path, a sample path, a reference path, and a detection path, wherein the light source generates a spectrally resolved bandwidth. The spectrally resolved bandwidth includes a plurality of spectrally resolved cells and a detector in the detection path for analyzing light reflected from an object in the sample path and the light reflected in the reference path based upon at least one of the polarization, spatial relationship, position or angle domains.
摘要:
The embodiments disclosed herein is related to a system for optical coherence tomographic imaging of turbid (i.e., scattering) materials utilizing multiple channels of information. The multiple channels of information may be comprised and encompass spatial, angle, spectral and polarization domains. More specifically, the embodiments disclosed herein is related to methods and apparatus for utilizing optical sources, systems or receivers capable of providing (source), processing (system) or recording (receiver) a multiplicity of channels of spectral information for optical coherence tomographic imaging of turbid materials. In these methods and apparatus the multiplicity of channels of spectral information that can be provided by the source, processed by the system, or recorded by the receiver are used to convey simultaneously spatial, spectral or polarimetric information relating to the turbid material being imaged tomographically. The multichannel optical coherence tomographic methods can be incorporated into an endoscopic probe for imaging a patient. The endoscope comprises an optical fiber array and can comprise a plurality of optical fibers adapted to be disposed in the patient. The optical fiber array transmits the light from the light source into the patient, and transmits the light reflected by the patient out of the patient. The plurality of optical fibers in the array is in optical communication with the light source. The multichannel optical coherence tomography system comprises a detector for receiving the light from the array and analyzing the light. The methods and apparatus may be applied for imaging a vessel, biliary, GU and/or GI tract of a patient.
摘要:
A polarization sensitive spectral interferometer apparatus and method for analyzing a sample. The polarization sensitive spectral interferometer apparatus and method determines polarization properties of the sample.
摘要:
A semiconductor fabrication system and method are presented. A three dimensional multilayer integrated circuit fabrication method can include forming a first device layer and forming a second device layer on top of the first device layer with minimal detrimental heat transfer to the first layer by utilizing a controlled laser layer formation annealing process. A controlled laser crystallization process can be utilized and the controlled laser can include creating an amorphous layer; defining a crystallization area in the amorphous layer, where in the crystallization area is defined to promote single crystal growth (i.e. prevent multi-crystalline growth); and applying laser to the crystallization area, wherein the laser is applied in a manner that prevents undesired heat transfer to another layer.