Forming metal-semiconductor films having different thicknesses within different regions of an electronic device
    1.
    发明授权
    Forming metal-semiconductor films having different thicknesses within different regions of an electronic device 有权
    在电子设备的不同区域内形成具有不同厚度的金属半导体膜

    公开(公告)号:US07880221B2

    公开(公告)日:2011-02-01

    申请号:US12340274

    申请日:2008-12-19

    IPC分类号: H01L29/792

    摘要: A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.

    摘要翻译: 提供一种形成电子器件的方法,其包括选择性地将离子注入到工件中,其中将离子注入到包括半导体材料的工件的第一区域中,而基本上没有离子注入工件的第二区域 其还包括半导体材料。 该方法还包括在选择性地注入之后,在第一区域和第二区域上沉积含金属膜,然后使含金属膜与半导体材料反应,以在第一区域内形成第一金属半导体膜,并且将第二金属 在第二区域内的半导体膜。 第一金属半导体膜具有第一厚度,第二金属半导体膜具有与第一厚度不同的第二厚度。

    FORMING METAL-SEMICONDUCTOR FILMS HAVING DIFFERENT THICKNESSES WITHIN DIFFERENT REGIONS OF AN ELECTRONIC DEVICE
    2.
    发明申请
    FORMING METAL-SEMICONDUCTOR FILMS HAVING DIFFERENT THICKNESSES WITHIN DIFFERENT REGIONS OF AN ELECTRONIC DEVICE 有权
    在电子设备的不同区域形成具有不同厚度的金属 - 半导体膜

    公开(公告)号:US20090140325A1

    公开(公告)日:2009-06-04

    申请号:US12340274

    申请日:2008-12-19

    IPC分类号: H01L29/792

    摘要: A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.

    摘要翻译: 提供一种形成电子器件的方法,其包括选择性地将离子注入到工件中,其中将离子注入到包括半导体材料的工件的第一区域中,而基本上没有离子注入工件的第二区域 其还包括半导体材料。 该方法还包括在选择性地注入之后,在第一区域和第二区域上沉积含金属膜,然后使含金属膜与半导体材料反应,以在第一区域内形成第一金属半导体膜,并且将第二金属 在第二区域内的半导体膜。 第一金属半导体膜具有第一厚度,第二金属半导体膜具有与第一厚度不同的第二厚度。

    Forming metal-semiconductor films having different thicknesses within different regions of an electronic device
    3.
    发明授权
    Forming metal-semiconductor films having different thicknesses within different regions of an electronic device 有权
    在电子设备的不同区域内形成具有不同厚度的金属半导体膜

    公开(公告)号:US07482217B1

    公开(公告)日:2009-01-27

    申请号:US11949637

    申请日:2007-12-03

    IPC分类号: H01L21/8238

    摘要: A method of forming an electronic device is provided that includes selectively implanting ions into a workpiece, wherein ions are implanted into a first region of the workpiece that includes a semiconductor material, while substantially none of the ions are implanted into a second region of the workpiece that also includes a semiconductor material. The method further includes depositing a metal-containing film over the first region and the second region after selectively implanting, and then reacting the metal-containing film with the semiconductor material to form a first metal-semiconductor film within the first region and a second metal-semiconductor film within the second region. The first metal-semiconductor film has a first thickness and the second metal-semiconductor film has a second thickness that is different from the first thickness.

    摘要翻译: 提供一种形成电子器件的方法,其包括选择性地将离子注入到工件中,其中将离子注入到包括半导体材料的工件的第一区域中,而基本上没有离子注入工件的第二区域 其还包括半导体材料。 该方法还包括在选择性地注入之后,在第一区域和第二区域上沉积含金属膜,然后使含金属膜与半导体材料反应,以在第一区域内形成第一金属半导体膜,并且将第二金属 在第二区域内的半导体膜。 第一金属半导体膜具有第一厚度,第二金属半导体膜具有与第一厚度不同的第二厚度。

    Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching
    4.
    发明申请
    Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching 有权
    通过进行硅化物侧壁生长和蚀刻在半导体器件中实现非常小的特征尺寸的方法

    公开(公告)号:US20100055907A1

    公开(公告)日:2010-03-04

    申请号:US12231369

    申请日:2008-09-02

    IPC分类号: H01L21/302

    摘要: In the present method of fabricating a semiconductor device, initially, a semiconductor substrate is provided. An oxide layer is provided on and in contact with the substrate, and a polysilicon layer is provided on and in contact with the oxide layer. A layer of photoresist is provided on the polysilicon layer, and the photoresist is patterned to provide a photoresist body, which is used as a mask to etch away polysilicon and oxide, forming a polysilicon element thereunder. The photoresist body is then removed. A nickel layer is provided on the resulting structure, and a reaction step is undertaken to provide that nickel diffuses into the exposed top and side portions of the polysilicon body, forming nickel silicide. After the reaction step, the remaining nickel is removed, and a chemical-mechanical polishing step is undertaken to remove nickel silicide so that a pair of nickel silicide bodies remain, separated by polysilicon. Using the nickel silicide bodies as masks, the polysilicon and oxide thereunder are etched away.

    摘要翻译: 在本发明的制造半导体器件的方法中,首先提供半导体衬底。 氧化物层设置在衬底上并与衬底接触,并且多晶硅层设置在氧化物层上并与氧化物层接触。 在多晶硅层上提供一层光致抗蚀剂,并且将光致抗蚀剂图案化以提供光致抗蚀剂体,其用作掩模以去除多晶硅和氧化物,从而形成其下的多晶硅元件。 然后去除光致抗蚀剂体。 在所得结构上提供镍层,并且进行反应步骤以使镍扩散到多晶硅体的暴露的顶部和侧部,形成硅化镍。 在反应步骤之后,除去剩余的镍,并进行化学机械抛光步骤以除去硅化镍,使得一对硅化镍体保留,被多晶硅分离。 使用硅化镍体作为掩模,其后的多晶硅和氧化物被蚀刻掉。

    Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching
    5.
    发明授权
    Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching 有权
    通过进行硅化物侧壁生长和蚀刻在半导体器件中实现非常小的特征尺寸的方法

    公开(公告)号:US09236448B2

    公开(公告)日:2016-01-12

    申请号:US12231369

    申请日:2008-09-02

    摘要: In the present method of fabricating a semiconductor device, initially, a semiconductor substrate is provided. An oxide layer is provided on and in contact with the substrate, and a polysilicon layer is provided on and in contact with the oxide layer. A layer of photoresist is provided on the polysilicon layer, and the photoresist is patterned to provide a photoresist body, which is used as a mask to etch away polysilicon and oxide, forming a polysilicon element thereunder. The photoresist body is then removed. A nickel layer is provided on the resulting structure, and a reaction step is undertaken to provide that nickel diffuses into the exposed top and side portions of the polysilicon body, forming nickel silicide. After the reaction step, the remaining nickel is removed, and a chemical-mechanical polishing step is undertaken to remove nickel silicide so that a pair of nickel silicide bodies remain, separated by polysilicon. Using the nickel silicide bodies as masks, the polysilicon and oxide thereunder are etched away.

    摘要翻译: 在本发明的制造半导体器件的方法中,首先提供半导体衬底。 氧化物层设置在衬底上并与衬底接触,并且多晶硅层设置在氧化物层上并与氧化物层接触。 在多晶硅层上提供一层光致抗蚀剂,并且将光致抗蚀剂图案化以提供光致抗蚀剂体,其用作掩模以去除多晶硅和氧化物,从而形成其下的多晶硅元件。 然后去除光致抗蚀剂体。 在所得结构上提供镍层,并且进行反应步骤以使镍扩散到多晶硅体的暴露的顶部和侧部,形成硅化镍。 在反应步骤之后,除去剩余的镍,并进行化学机械抛光步骤以除去硅化镍,使得一对硅化镍体保留,被多晶硅分离。 使用硅化镍体作为掩模,其后的多晶硅和氧化物被蚀刻掉。

    OCT using spectrally resolved bandwidth
    8.
    发明授权
    OCT using spectrally resolved bandwidth 有权
    OCT使用光谱解析带宽

    公开(公告)号:US08540627B2

    公开(公告)日:2013-09-24

    申请号:US12832001

    申请日:2010-07-07

    IPC分类号: A61B1/00 A61B1/07

    摘要: The embodiments disclosed herein is related to a system for optical coherence tomographic imaging of turbid (i.e., scattering) materials utilizing multiple channels of information. The multiple channels of information may be comprised and encompass spatial, angle, spectral and polarization domains. More specifically, the embodiments disclosed herein is related to methods and apparatus for utilizing optical sources, systems or receivers capable of providing (source), processing (system) or recording (receiver) a multiplicity of channels of spectral information for optical coherence tomographic imaging of turbid materials. In these methods and apparatus the multiplicity of channels of spectral information that can be provided by the source, processed by the system, or recorded by the receiver are used to convey simultaneously spatial, spectral or polarimetric information relating to the turbid material being imaged tomographically. The multichannel optical coherence tomographic methods can be incorporated into an endoscopic probe for imaging a patient. The endoscope comprises an optical fiber array and can comprise a plurality of optical fibers adapted to be disposed in the patient. The optical fiber array transmits the light from the light source into the patient, and transmits the light reflected by the patient out of the patient. The plurality of optical fibers in the array is in optical communication with the light source. The multichannel optical coherence tomography system comprises a detector for receiving the light from the array and analyzing the light. The methods and apparatus may be applied for imaging a vessel, biliary, GU and/or GI tract of a patient.

    摘要翻译: 本文公开的实施例涉及利用多个信道信道的浑浊(即散射)材料的光学相干断层成像系统。 可以包括多个信道信道并且包括空间,角度,频谱和极化域。 更具体地说,这里公开的实施例涉及用于利用光源,系统或接收器的方法和装置,该光源,系统或接收器能够提供(源),处理(系统)或记录(接收)多个光谱信息通道,用于光学相干断层成像 浑浊的材料。 在这些方法和装置中,可以由源提供的,由系统处理或由接收机记录的光谱信息的多个信道的多样性被用于同时传送与被层析成像的浑浊材料有关的空间,光谱或偏振信息。 多通道光学相干断层摄影方法可以并入用于成像患者的内窥镜探针中。 内窥镜包括光纤阵列,并且可以包括适于设置在患者体内的多根光纤。 光纤阵列将来自光源的光透射到患者体内,并将患者反射的光透射出患者。 阵列中的多个光纤与光源光学通信。 多通道光学相干断层摄影系统包括用于从阵列接收光并分析光的检测器。 该方法和装置可以应用于对患者的血管,胆管,GU和/或胃肠道进行成像。

    3-D integrated circuit system and method
    10.
    发明授权
    3-D integrated circuit system and method 有权
    3-D集成电路系统及方法

    公开(公告)号:US07998846B2

    公开(公告)日:2011-08-16

    申请号:US12209478

    申请日:2008-09-12

    IPC分类号: H01L21/263

    摘要: A semiconductor fabrication system and method are presented. A three dimensional multilayer integrated circuit fabrication method can include forming a first device layer and forming a second device layer on top of the first device layer with minimal detrimental heat transfer to the first layer by utilizing a controlled laser layer formation annealing process. A controlled laser crystallization process can be utilized and the controlled laser can include creating an amorphous layer; defining a crystallization area in the amorphous layer, where in the crystallization area is defined to promote single crystal growth (i.e. prevent multi-crystalline growth); and applying laser to the crystallization area, wherein the laser is applied in a manner that prevents undesired heat transfer to another layer.

    摘要翻译: 提出了半导体制造系统和方法。 三维多层集成电路制造方法可以包括通过利用受控激光层形成退火工艺形成第一器件层并在第一器件层顶部形成第二器件层,并以最小的有害热传递到第一层。 可以利用受控激光结晶过程,并且受控激光器可以包括产生非晶层; 限定非晶层中的结晶区域,其中结晶区域被限定为促进单晶生长(即防止多晶生长); 以及将激光施加到结晶区域,其中以防止不希望的热传递到另一层的方式施加激光。