公开(公告)号：US20050127500A1

公开(公告)日：2005-06-16

申请号：US10732015

申请日：2003-12-10

申请人： Evan Colgan ,  Claudis Feger ,  Gary Goth ,  George Katopis ,  John Magerlein ,  Edmund Sprogis

发明人： Evan Colgan ,  Claudis Feger ,  Gary Goth ,  George Katopis ,  John Magerlein ,  Edmund Sprogis

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L21/56 ,  H01L23/10 ,  H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an integrated circuit packaging structure, such as in an MCM or in a SCM, a compliant thermally conductive material is applied between a heat-generating integrated circuit chip and a substrate attached thereto. Raised regions are defined on the back side of the chip aligned to areas of a higher than average power density on the front active surface of the chip such that a thinner layer of the compliant thermally conductive material is disposed between the chip and the substrate in this area after assembly thereof resulting in a reduced “hot-spot” temperature on the chip. In an exemplary embodiment, the substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

摘要翻译： 在诸如在MCM或SCM中的集成电路封装结构中，在发热集成电路芯片和附着于其之间的衬底之间施加兼容的导热材料。 凸起区域被限定在芯片的背面上，与芯片的前活性表面上的高于平均功率密度的区域相对准，使得在该芯片和衬底之间设置较薄的柔性导热材料层 组装后的区域导致芯片上的“热点”温度降低。 在示例性实施例中，基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

公开(公告)号：US20060109630A1

公开(公告)日：2006-05-25

申请号：US10991987

申请日：2004-11-19

申请人： Evan Colgan ,  Gary Goth ,  Deborah Sylvester ,  Jeffrey Zitz

发明人： Evan Colgan ,  Gary Goth ,  Deborah Sylvester ,  Jeffrey Zitz

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

摘要翻译： 本发明一般涉及用于冷却半导体集成电路（IC）芯片封装结构的装置和方法。 更具体地，本发明涉及使用柔性导热材料（例如，热糊）将半导体芯片热耦合到导热装置（例如，铜热帽或盖）的装置和方法，其中热界面被设计成 由于这种材料由于热循环而在芯片和导热装置之间流入和流出，因此防止/抑制柔性导热材料中空隙的形成。

公开(公告)号：US20060263912A1

公开(公告)日：2006-11-23

申请号：US11133427

申请日：2005-05-19

申请人： Ronald Arroyo ,  Kenneth Bird ,  William Ciarfella ,  Bret Elison ,  Gary Goth ,  Terrance Kueper ,  Thoi Nguyen ,  Roger Weekly

发明人： Ronald Arroyo ,  Kenneth Bird ,  William Ciarfella ,  Bret Elison ,  Gary Goth ,  Terrance Kueper ,  Thoi Nguyen ,  Roger Weekly

IPC分类号： H01L21/66 ,  G01N25/68 ,  G01N25/00 ,  G01K15/00

CPC分类号： G01K7/425 ,  H01L23/34 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

摘要翻译： 考虑到基于被测设备（DUT）根据电气性能标准进行操作的能力来评估热解决方案的热性能的系统和布置。 实施例可以包括与DUT耦合以确定操作结温度的测试器。 在一些实施例中，测量的结温度可以是客户安装中DUT的预期的工作结温。 在其他实施例中，测试器可以包括基于测量的结温度和测试仪与客户安装之间的已知差异来计算投影的工作结温度的逻辑。 在客户安装中确定DUT的工作结温后，将工作结温与最大结温进行比较，以便DUT的正常工作。 有利的是，最大结温度可以基于DUT线的项目目标而变化。

公开(公告)号：US07803664B2

公开(公告)日：2010-09-28

申请号：US12115332

申请日：2008-05-05

申请人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

发明人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

IPC分类号： H01L21/00 ,  H01L23/34 ,  H01L23/367

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

摘要翻译： 本发明一般涉及用于冷却半导体集成电路（IC）芯片封装结构的装置和方法。 更具体地，本发明涉及使用柔性导热材料（例如，热糊）将半导体芯片热耦合到导热装置（例如，铜热帽或盖）的装置和方法，其中热界面被设计成 由于这种材料由于热循环而在芯片和导热装置之间流入和流出，因此防止/抑制柔性导热材料中空隙的形成。

公开(公告)号：US20060087813A1

公开(公告)日：2006-04-27

申请号：US10972868

申请日：2004-10-25

申请人： Wiren Becker ,  Joseph Corrado ,  Ethan Cruz ,  Michael Fisher ,  Gary Goth

发明人： Wiren Becker ,  Joseph Corrado ,  Ethan Cruz ,  Michael Fisher ,  Gary Goth

IPC分类号： H05K1/00

CPC分类号： H05K7/20563 ,  G06F1/183 ,  G06F1/20

摘要： A system for airflow management in an electronic enclosure includes a backplane assembly having at least one backplane connector, at least one daughter card, and components disposed on the daughter card oriented to facilitate front-to-back airflow, wherein inlet cooling air impinges on the backplane assembly and splits into at least two flow portions flowing in different directions along a surface defining the backplane assembly

摘要翻译： 一种用于电子外壳中的气流管理的系统包括背板组件，该背板组件具有至少一个背板连接器，至少一个子卡，以及设置在子卡上的部件，其定向成便于前后气流，其中入口冷却空气冲击 底板组件，并分成沿着限定背板组件的表面沿不同方向流动的至少两个流动部分

公开(公告)号：US20080242002A1

公开(公告)日：2008-10-02

申请号：US12115332

申请日：2008-05-05

申请人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

发明人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

IPC分类号： H01L21/58

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

摘要翻译： 本发明一般涉及用于冷却半导体集成电路（IC）芯片封装结构的装置和方法。 更具体地，本发明涉及使用柔性导热材料（例如，热糊）将半导体芯片热耦合到导热装置（例如，铜热帽或盖）的装置和方法，其中热界面被设计成 由于这种材料由于热循环而在芯片和导热装置之间流入和流出，因此防止/抑制柔性导热材料中空隙的形成。

公开(公告)号：US20050280140A1

公开(公告)日：2005-12-22

申请号：US10869524

申请日：2004-06-16

申请人： John Corbin ,  Gary Goth ,  Dales Kent ,  William Kostenko ,  Roger Schmidt ,  John Torok

发明人： John Corbin ,  Gary Goth ,  Dales Kent ,  William Kostenko ,  Roger Schmidt ,  John Torok

IPC分类号： H01L21/44 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L23/367 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

摘要翻译： 在诸如在SCM，DCM或MCM中的集成电路封装结构中，公开了一种用于增加散热器尺寸并因此提高散热性能的方法和装置。 包装结构包括第一基板; 电子设备，其可操作地耦合到限定所述第一基板的顶表面; 散热器具有可操作地耦合到限定电子设备的顶表面的第一表面和与第二基板热连通的相对的第二表面; 以及限定穿过其中的开口的框架。 框架进一步由向内延伸的凸缘限定，该凸缘构造成允许散热器至少延伸至限定第一基板的周边的周边边缘。 在示例性实施例中，第二基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

公开(公告)号：US20050044869A1

公开(公告)日：2005-03-03

申请号：US10653633

申请日：2003-09-02

申请人： Gary Goth ,  Daniel Kearney ,  Robert Makowicki ,  W. McClafferty ,  Donald Porter

发明人： Gary Goth ,  Daniel Kearney ,  Robert Makowicki ,  W. McClafferty ,  Donald Porter

IPC分类号： F25B5/02 ,  F25D23/12 ,  F25B41/06

CPC分类号： F25B5/02 ,  F25B2341/0653 ,  F25B2700/2116 ,  F25B2700/21161 ,  F25B2700/21163 ,  F25B2700/2117 ,  F25B2700/21174 ,  F25B2700/21175 ,  Y02B30/72

摘要： An exemplary embodiment is a cooling system for cooling multiple logic modules. The cooling system includes a condenser, a first electrically controlled expansion valve coupled to the condenser and a first evaporator coupled to the first electrically controlled expansion valve. A second electrically controlled expansion valve is coupled to the condenser and a second evaporator coupled to the second electrically controlled expansion valve. A controller provides control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve. A compressor is coupled to the first evaporator, the second evaporator and the condenser.

摘要翻译： 示例性实施例是用于冷却多个逻辑模块的冷却系统。 冷却系统包括冷凝器，耦合到冷凝器的第一电控膨胀阀和耦合到第一电控膨胀阀的第一蒸发器。 第二电控膨胀阀联接到冷凝器和耦合到第二电控膨胀阀的第二蒸发器。 控制器向第一电控膨胀阀和第二电控膨胀阀提供控制信号，以控制第一电控膨胀阀和第二电控膨胀阀的操作。 压缩机联接到第一蒸发器，第二蒸发器和冷凝器。

公开(公告)号：US07394659B2

公开(公告)日：2008-07-01

申请号：US10991987

申请日：2004-11-19

申请人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

发明人： Evan George Colgan ,  Gary Goth ,  Deborah Anne Sylvester ,  Jeffrey Allen Zitz

IPC分类号： H05K7/20 ,  H01L23/367

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

摘要翻译： 本发明一般涉及用于冷却半导体集成电路（IC）芯片封装结构的装置和方法。 更具体地，本发明涉及使用柔性导热材料（例如，热糊）将半导体芯片热耦合到导热装置（例如，铜热帽或盖）的装置和方法，其中热界面被设计成 由于这种材料由于热循环而在芯片和导热装置之间流入和流出，因此防止/抑制柔性导热材料中空隙的形成。

公开(公告)号：US20070095569A1

公开(公告)日：2007-05-03

申请号：US11262050

申请日：2005-10-28

申请人： Gary Goth ,  John Loparco ,  Andrew Rybak ,  John Torok

发明人： Gary Goth ,  John Loparco ,  Andrew Rybak ,  John Torok

IPC分类号： H01L23/28

CPC分类号： H05K7/1487

摘要： An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.

摘要翻译： 一种改进的方法和用于保护电子部件的盒组件，包括外壳，其包围设置在绝缘体上的电子部件。 壳体还包括可从第一位置移动到第二位置的剪刀千斤顶部件，以使得盒组件的致动和脱离能够进入下一级包装。 壳体具有突出设计，具有互补的上部开口和下部电缆护罩区域，用于支撑电缆连接并提供散热释放和EMC防护。 替代设计提供了其他组件，如蜂窝梳屏和EMC垫片，以进一步实现EMC容纳。 此外，可以向设计中添加诸如致动捕获门，保持特征和卡支撑构件或支撑支柱的其它部件，以实现更好的致动并提供改进的结构刚性。