Abstract:
A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
Abstract:
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.
Abstract:
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.
Abstract:
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.
Abstract:
A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines.
Abstract:
This disclosure generally relates to devices and methods involving optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a multi-channel optoelectronic subassembly including a multi-channel header subassembly with a plurality of optoelectronic transducers on a substrate, a housing defining a housing cavity and including an optically transmissive portion, a ferrule assembly retaining optical fibers and an alignment sleeve with a sleeve cavity sized and shaped to receive the ferrule assembly. At least one of the optoelectronic transducers may be configured to transmit and/or receive optical signals corresponding to one channel.
Abstract:
This disclosure generally relates to devices and methods involving optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a multi-channel optoelectronic subassembly including a multi-channel header subassembly with a plurality of optoelectronic transducers on a substrate, a housing defining a housing cavity and including an optically transmissive portion, a ferrule assembly retaining optical fibers and an alignment sleeve with a sleeve cavity sized and shaped to receive the ferrule assembly. At least one of the optoelectronic transducers may be configured to transmit and/or receive optical signals corresponding to one channel.
Abstract:
A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
Abstract:
A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
Abstract:
A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.