Additive manufacturing of electrical circuits

    公开(公告)号:US11978842B2

    公开(公告)日:2024-05-07

    申请号:US18155487

    申请日:2023-01-17

    IPC分类号: H01L33/62 H01L33/58

    摘要: A method of manufacturing an electronics assembly includes forming a base layer, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, and forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween.

    System and method for modular vehicle storage

    公开(公告)号:US11970139B2

    公开(公告)日:2024-04-30

    申请号:US17078214

    申请日:2020-10-23

    IPC分类号: B60R7/04

    CPC分类号: B60R7/04

    摘要: A storage module connects to a frame forming a door opening of a vehicle. The storage module includes a housing conforming to the door opening and extending into the compartment in an installed configuration. The storage module further includes an exterior panel disposed on a first side of the housing. The exterior panel conforms to an exterior surface of the vehicle enclosing the door opening. At least one storage compartment is disposed inside the housing and the compartment in the installed configuration. The storage compartment includes an access panel forming a portion of the exterior surface and forms a first storage volume.