公开(公告)号：US20200328763A1

公开(公告)日：2020-10-15

申请号：US16304877

申请日：2017-07-21

Applicant: FUJIKURA LTD.

Inventor： Yusuke UEMICHI

IPC: H04B1/00 ,  H01P5/18 ,  H01P1/208

Abstract: Provided is a diplexer that is smaller and more lightweight than conventional diplexers. A diplexer includes a filter pair, first and second directional coupler sections, and first and second converter section pairs. These members are constituted by waveguides. The waveguides are post-wall waveguides that have a first wide wall, a second wide wall, and narrow walls. The first wide wall and the second wide wall are a pair of conductor plates provided on the opposite sides of a dielectric substrate. Each of the narrow walls is a post wall constituted by conductor posts passing through the dielectric substrate.

公开(公告)号：US20150107888A1

公开(公告)日：2015-04-23

申请号：US14584471

申请日：2014-12-29

Applicant: FUJIKURA LTD.

Inventor： Yusuke UEMICHI

IPC: H05K1/02 ,  H05K3/44 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H04L25/0272 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/445 ,  H05K2201/09854 ,  Y10T29/49165

Abstract: An interconnection substrate includes: a substrate having a first surface and a second surface opposite the first surface; and a transmission line including two parallel through-hole interconnections that are exposed to the first and second surfaces and are formed inside the substrate. Also, at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface.

Abstract translation: 互连基板包括：具有第一表面和与第一表面相对的第二表面的基板; 以及包括暴露于第一和第二表面并形成在基板内的两个平行的通孔互连的传输线。 此外，两个通孔互连中的至少一个包括具有比第一表面中的通孔互连的直径小的直径的小部分和第二表面中的通孔互连的直径。

公开(公告)号：US20150349398A1

公开(公告)日：2015-12-03

申请号：US14825682

申请日：2015-08-13

Applicant: FUJIKURA, LTD.

Inventor： Yusuke UEMICHI

IPC: H01P11/00

CPC classification number: H01P11/003 ,  H01P5/107 ,  H05K1/0251 ,  H05K3/002 ,  H05K3/0029 ,  H05K2201/037 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2203/0733 ,  Y10T29/49018

Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.

Abstract translation: 一种制造模式转换器的方法，该模式转换器包括作为单个部件的基板，包括第一主表面，与第一主表面相对的第二主表面和形成在第一主表面中的微孔，接地导体层， 形成在第一主表面和第二主表面上，形成在第一主表面上的平面电路和形成为覆盖微孔的内表面并且与平面电路电连接的销 所述方法包括：用激光照射所述基板，以从所述基板的一个主表面形成到所需深度的第一改质部分; 去除所述第一改性部分以形成所述微孔; 并用导电材料填充微孔以形成销。

公开(公告)号：US20160126637A1

公开(公告)日：2016-05-05

申请号：US14889536

申请日：2015-02-25

Applicant: FUJIKURA LTD.

Inventor： Yusuke UEMICHI

IPC: H01Q13/22

CPC classification number: H01Q13/22 ,  H01Q21/0043

Abstract: A slotted waveguide array antenna having a smaller reflection coefficient and a larger gain than conventional one is realized. In a slotted waveguide array antenna (1A), control walls (12c1-12c6) orthogonal to an upper wall (11) and side walls of the waveguide are provided inside the waveguide, and slots (11d1-11d6) each extend over an interface between regions formed by partition with corresponding one of the control walls but do not overlap the corresponding one of the plurality of control walls when viewed from above.

Abstract translation: 实现了具有比常规的更小的反射系数和更大增益的开槽波导阵列天线。 在开槽波导阵列天线（1A）中，在波导内部设置与波导管的上壁（11）和侧壁正交的控制壁（12c1-12c6），并且槽（11d1-11d6）各自在 当从上方观察时，与对应的一个控制壁分隔开而不与多个控制壁中的相应一个重叠。

公开(公告)号：US20150295295A1

公开(公告)日：2015-10-15

申请号：US14749839

申请日：2015-06-25

Applicant: FUJIKURA LTD.

Inventor： Yusuke UEMICHI

IPC: H01P5/103

CPC classification number: H01P5/107 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01P3/003 ,  H01P3/121 ,  H01P5/103

Abstract: A mode converter includes a substrate including a first main surface aid a second main surface, a first ground conductor layer formed on the first main surface, a second ground conductor layer formed on the second main surface, a plane circuit that is formed on the first main surface and propagates a high frequency, a pin that is connected to the plane-circuit, is formed inside a through-hole which penetrate from the first main surface to the second main surface, and communicates with the first main face and the second main surface, and an anti-pad that is formed between an end portion of the pin exposed in the second main surface and the second ground conductor layer.

Abstract translation: 模式转换器包括：基板，包括第一主表面辅助第二主表面，形成在第一主表面上的第一接地导体层，形成在第二主表面上的第二接地导体层，形成在第一主表面上的第一接触导体层 主表面传播高频，连接到平面电路的销形成在从第一主表面到第二主表面穿透的通孔内，并与第一主面和第二主面连通 表面，以及形成在第二主表面中露出的销的端部与第二接地导体层之间的防焊盘。