-
1.发明申请SEMICONDUCTOR INTEGRATED CIRCUIT, MAGNETIC DETECTING DEVICE, ELECTRONIC COMPASS, AND AMMETER 有权半导体集成电路，磁性检测器件，电子指示器和电阻器公开(公告)号：US20130214777A1
公开(公告)日：2013-08-22
申请号：US13853812
申请日：2013-03-29
Applicant: FUJIKURA LTD.
Inventor： Kazuhisa Itoi
IPC: G01R33/09
Abstract: A semiconductor integrated circuit includes a clock-signal control circuit controlling intensity-signal output, which is output from a signal processing circuit, to be stopped in at least a forward outage time and a backward outage time. The forward outage time is previous to an apex point of a triangular wave and having 1 to 5% of a triangular wave period. The backward outage time is subsequent to the apex point of the triangular wave and having 1 to 5% of a triangular wave period.
Abstract translation: 半导体集成电路包括时钟信号控制电路，其控制从信号处理电路输出的强度信号输出至少停止在正向中断时间和后退时间。 正向停电时间先于三角波的顶点，并具有1〜5％的三角波周期。 后退时间在三角波的顶点之后，具有1〜5％的三角波周期。
-
2.发明授权Semiconductor integrated circuit, magnetic detecting device, electronic compass, and ammeter 有权半导体集成电路，磁检测装置，电子罗盘和电流表公开(公告)号：US09234946B2
公开(公告)日：2016-01-12
申请号：US13853812
申请日：2013-03-29
Applicant: FUJIKURA LTD.
Inventor： Kazuhisa Itoi
Abstract: A semiconductor integrated circuit includes a clock-signal control circuit controlling intensity-signal output, which is output from a signal processing circuit, to be stopped in at least a forward outage time and a backward outage time. The forward outage time is previous to an apex point of a triangular wave and having 1 to 5% of a triangular wave period. The backward outage time is subsequent to the apex point of the triangular wave and having 1 to 5% of a triangular wave period.
Abstract translation: 半导体集成电路包括时钟信号控制电路，其控制从信号处理电路输出的强度信号输出至少停止在正向中断时间和后退时间。 正向停电时间先于三角波的顶点，并具有1〜5％的三角波周期。 后退时间在三角波的顶点之后，具有1〜5％的三角波周期。
-
3.发明授权公开(公告)号：US09591767B2
公开(公告)日：2017-03-07
申请号：US14290173
申请日：2014-05-29
Applicant: FUJIKURA LTD.
Inventor： Kazuhisa Itoi , Masahiro Okamoto
IPC: H05K1/02 , H05K1/18 , H05K3/10 , H01L23/538 , H01L23/367 , H01L21/48 , H01L23/00 , H05K3/00 , H05K3/46
CPC classification number: H05K3/10 , H01L21/4857 , H01L23/367 , H01L23/3677 , H01L23/5389 , H01L24/19 , H01L2224/02311 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/08237 , H01L2224/11312 , H01L2224/1132 , H01L2224/11334 , H01L2224/11416 , H01L2224/11418 , H01L2224/12105 , H01L2224/13009 , H01L2224/1329 , H01L2224/13294 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/1336 , H01L2224/1339 , H01L2224/16225 , H01L2224/16238 , H01L2224/16503 , H01L2224/2929 , H01L2224/32225 , H01L2224/73201 , H01L2224/73251 , H01L2224/73253 , H01L2224/80203 , H01L2224/80447 , H01L2224/80903 , H01L2224/81192 , H01L2224/81203 , H01L2224/8185 , H01L2224/81862 , H01L2224/81907 , H01L2224/83192 , H01L2224/83203 , H01L2224/8349 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/9221 , H01L2924/07811 , H01L2924/12042 , H01L2924/15153 , H05K1/0206 , H05K1/0207 , H05K1/186 , H05K3/0061 , H05K3/4602 , H05K3/4614 , H05K2201/0969 , H05K2201/10674 , Y10T29/49126 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2224/81 , H01L2224/83 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2224/32 , H01L2924/00
Abstract: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.
Abstract translation: 一种组件内置板，其中堆叠有多个印刷布线基底，其具有形成在其树脂基底上的布线图案和通孔，并且包括内置于其中的电子部件，其中多个印刷的至少一部分 布线基底包括布线图案中的热布线，并且在通孔中包括热通孔，多个印刷布线基底中的至少一个在其中形成有电子部件构建的开口，并且在其中形成有导热层 并且紧贴在与内置于开口部的电子部件的电极形成面相反一侧的面上，电子部件通过形成有孔的层叠在导热层上的粘接层固定在开口部 在面向导热层的开口的区域中。
-
4.发明申请公开(公告)号：US20140268574A1
公开(公告)日：2014-09-18
申请号：US14290173
申请日：2014-05-29
Applicant: FUJIKURA LTD.
Inventor： Kazuhisa Itoi , Masahiro Okamoto
CPC classification number: H05K3/10 , H01L21/4857 , H01L23/367 , H01L23/3677 , H01L23/5389 , H01L24/19 , H01L2224/02311 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/08237 , H01L2224/11312 , H01L2224/1132 , H01L2224/11334 , H01L2224/11416 , H01L2224/11418 , H01L2224/12105 , H01L2224/13009 , H01L2224/1329 , H01L2224/13294 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/1336 , H01L2224/1339 , H01L2224/16225 , H01L2224/16238 , H01L2224/16503 , H01L2224/2929 , H01L2224/32225 , H01L2224/73201 , H01L2224/73251 , H01L2224/73253 , H01L2224/80203 , H01L2224/80447 , H01L2224/80903 , H01L2224/81192 , H01L2224/81203 , H01L2224/8185 , H01L2224/81862 , H01L2224/81907 , H01L2224/83192 , H01L2224/83203 , H01L2224/8349 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/9221 , H01L2924/07811 , H01L2924/12042 , H01L2924/15153 , H05K1/0206 , H05K1/0207 , H05K1/186 , H05K3/0061 , H05K3/4602 , H05K3/4614 , H05K2201/0969 , H05K2201/10674 , Y10T29/49126 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2224/81 , H01L2224/83 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2224/32 , H01L2924/00
Abstract: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.
Abstract translation: 一种组件内置板，其中堆叠有多个印刷布线基底，其具有形成在其树脂基底上的布线图案和通孔，并且包括内置于其中的电子部件，其中多个印刷的至少一部分 布线基底包括布线图案中的热布线，并且在通孔中包括热通孔，多个印刷布线基底中的至少一个在其中形成有电子部件构建的开口，并且在其中形成有导热层 并且紧贴在与内置于开口部的电子部件的电极形成面相反一侧的面上，电子部件通过形成有孔的层叠在导热层上的粘接层固定在开口部 在面向导热层的开口的区域中。
-
-
-
Search Results
4
records
(took 0.017 seconds)
