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    Component built-in board and method of manufacturing the same
    1.
    发明授权
    Component built-in board and method of manufacturing the same 有权
    组件内置板及其制造方法

    公开(公告)号：US09282628B2

    公开(公告)日：2016-03-08

    申请号：US14157669

    申请日：2014-01-17

    Applicant: FUJIKURA LTD.

    Inventor： Masahiro Okamoto

    IPC: H05K1/02 ,  H05K1/18 ,  H01L23/538 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L23/498

    CPC classification number: H05K1/0206 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0154 ,  Y10T29/49139 ,  H01L2924/00

    Abstract: A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

    Abstract translation: 一种组件内置板，其中至少两层多个印刷布线基底设置在电子部件的背面侧; 所述印刷布线基板的至少两层包括设置在所述电子部件的后表面上方的散热专用布线图案; 热辐射专用布线图形形成为使得散热专用布线和信号专用布线是连续的; 通孔包括连接电子部件的后表面和散热专用布线图案的多个散热专用通孔; 并且热辐射专用布线图案从连接到要连接的散热专用通孔的地方连续地连接到设置在电子部件的外周侧的另一通孔。

    MULTI-LAYER WIRING BOARD
    2.
    发明申请
    MULTI-LAYER WIRING BOARD 有权
    多层接线板

    公开(公告)号：US20160037630A1

    公开(公告)日：2016-02-04

    申请号：US14449662

    申请日：2014-08-01

    Applicant: FUJIKURA LTD.

    Inventor： Masahiro Okamoto

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

    CPC classification number: H05K3/4614 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4694 ,  H01L2224/13099

    Abstract: A multi-layer wiring board that has stacked therein a first printed wiring bases on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, that includes an electronic component terminal and a board terminal whose terminal pitch differs from that of the electronic component terminal, and that has an electronic component installed thereon via the electronic component terminal, wherein a second wiring base whose wiring pitch is smaller than that of the first wiring base is built in to a lower portion of an installing portion of the electronic component via the first wiring base, and the second wiring base is connected to the electronic component terminal via the conductive paste via of the first wiring base, has formed on both surfaces thereof a pattern that enlarges the terminal pitch from the electronic component terminal to the board terminal, and includes a via that connects the pattern of the both surfaces.

    Abstract translation: 一种多层布线基板，其在其上堆叠有形成布线图案的至少一个表面上的第一印刷布线基底，其中形成有导电浆料通孔，其包括电子部件端子和端子间距 不同于电子部件端子，并且具有经由电子部件端子安装在其上的电子部件，其中布线间距小于第一布线基座的布线间距的第二布线基座内置于安装的下部 部分经由第一布线基座的电子部件，并且第二布线基板经由第一布线基板的导电膏通孔连接到电子部件端子，在其两个表面上形成有从电子部件扩大端子间距的图案 组件端子连接到电路板端子，并且包括连接两个表面的图案的通孔。

    Component-embedded board and method of manufacturing same
    3.
    发明授权
    Component-embedded board and method of manufacturing same 有权

    公开(公告)号：US10383231B2

    公开(公告)日：2019-08-13

    申请号：US14759459

    申请日：2013-02-08

    Applicant: FUJIKURA LTD.

    Inventor： Yoshinori Sano ,  Masahiro Okamoto

    IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H01L23/13 ,  H01L23/14 ,  H01L23/538 ,  H05K3/46 ,  H01L23/12 ,  H01L23/00 ,  H05K3/42

    Abstract: Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.

    Laminated wiring board and manufacturing method for same
    5.
    发明授权
    Laminated wiring board and manufacturing method for same 有权
    复合布线板及其制造方法

    公开(公告)号：US08941016B2

    公开(公告)日：2015-01-27

    申请号：US13734474

    申请日：2013-01-04

    Applicant: Fujikura Ltd.

    Inventor： Masahiro Okamoto

    IPC: H05K1/16 ,  H05K1/09 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46

    CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4623 ,  H05K2201/09481 ,  Y10T29/4913

    Abstract: A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

    Abstract translation: 一种叠层电路板，包括：在绝缘层的一个表面上形成导体电路并在绝缘层的另一个表面上形成粘合层的第一基板，并且在通孔中形成导体， 绝缘层和粘合剂层，使得导体电路部分地暴露于其中; 通过允许电子部件的电极连接到导体而与导体电路电连接的电子部件; 嵌入构件，其围绕电子部件布置，使得电子部件嵌入其中; 以及第二基板，其具有层压以面对第一基板的粘合剂层并夹持电子部件和嵌入部件的粘合剂层，其中电子部件的每个电极通过两个或更多个导体与导体电路连续 。

    COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
    7.
    发明申请
    COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME 有权

    公开(公告)号：US20210204414A1

    公开(公告)日：2021-07-01

    申请号：US16328646

    申请日：2017-08-21

    Applicant: FUJIKURA LTD.

    Inventor： Masahiro Okamoto

    IPC: H05K3/46 ,  H05K3/00 ,  H05K3/10

    Abstract: A component-incorporated substrate of multi-layer structure includes: a plurality of printed wiring base members that are batch-laminated via an adhesive layer, with the plurality of printed wiring base members including a resin base member that includes a wiring pattern on at least one surface thereof and a via connected to the wiring pattern; an opening disposed in at least one printed wiring base member that is sandwiched on both sides by other printed wiring base members of the plurality of printed wiring base members; and an electronic component disposed in the opening. At least part of the wiring pattern of the printed wiring base member where the opening is formed is disposed in a frame shape surrounding the opening, in a periphery of the opening.

    Multi-layer wiring board
    8.
    发明授权
    Multi-layer wiring board 有权

    公开(公告)号：US09699921B2

    公开(公告)日：2017-07-04

    申请号：US14449662

    申请日：2014-08-01

    Applicant: FUJIKURA LTD.

    Inventor： Masahiro Okamoto

    IPC: H05K7/00 ,  H05K3/46 ,  H05K1/14 ,  H05K3/42

    CPC classification number: H05K3/4614 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4694 ,  H01L2224/13099

    Abstract: A multi-layer wiring board that has stacked therein a first printed wiring bases on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, that includes an electronic component terminal and a board terminal whose terminal pitch differs from that of the electronic component terminal, and that has an electronic component installed thereon via the electronic component terminal, wherein a second wiring base whose wiring pitch is smaller than that of the first wiring base is built in to a lower portion of an installing portion of the electronic component via the first wiring base, and the second wiring base is connected to the electronic component terminal via the conductive paste via of the first wiring base, has formed on both surfaces thereof a pattern that enlarges the terminal pitch from the electronic component terminal to the board terminal, and includes a via that connects the pattern of the both surfaces.

    COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    组件内置板及其制造方法

    公开(公告)号：US20140202741A1

    公开(公告)日：2014-07-24

    申请号：US14157669

    申请日：2014-01-17

    Applicant: FUJIKURA LTD.

    Inventor： Masahiro Okamoto

    IPC: H05K1/02 ,  H05K3/30

    CPC classification number: H05K1/0206 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0154 ,  Y10T29/49139 ,  H01L2924/00

    Abstract: A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

    Abstract translation: 一种组件内置板，其中至少两层多个印刷布线基底设置在电子部件的背面侧; 所述印刷布线基板的至少两层包括设置在所述电子部件的后表面上方的散热专用布线图案; 热辐射专用布线图形形成为使得散热专用布线和信号专用布线是连续的; 通孔包括连接电子部件的后表面和散热专用布线图案的多个散热专用通孔; 并且热辐射专用布线图案从连接到要连接的散热专用通孔的地方连续地连接到设置在电子部件的外周侧的另一通孔。

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