公开(公告)号：US10074600B2

公开(公告)日：2018-09-11

申请号：US13436150

申请日：2012-03-30

申请人： Fei Guo ,  Feng Zhu ,  Julius Din ,  Anwar Kashem ,  Sally Yeung

发明人： Fei Guo ,  Feng Zhu ,  Julius Din ,  Anwar Kashem ,  Sally Yeung

IPC分类号： H01C17/00 ,  H01L23/498 ,  H01L23/14 ,  H01L23/50

CPC分类号： H01L23/49822 ,  H01L23/147 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/15311 ,  Y10T29/49082

摘要： Various resistor circuits and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a resistor onboard an interposer. The resistor is adapted to dampen a capacitive network. The capacitive network has at least one capacitor positioned external to the interposer.

公开(公告)号：US20130258627A1

公开(公告)日：2013-10-03

申请号：US13436150

申请日：2012-03-30

申请人： Fei Guo ,  Feng Zhu ,  Julius Din ,  Anwar Kashem ,  Sally Yeung

发明人： Fei Guo ,  Feng Zhu ,  Julius Din ,  Anwar Kashem ,  Sally Yeung

IPC分类号： H01L27/06 ,  H01L21/66 ,  H05K7/06 ,  H01L21/58

CPC分类号： H01L23/49822 ,  H01L23/147 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/15311 ,  Y10T29/49082

摘要： Various resistor circuits and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a resistor onboard an interposer. The resistor is adapted to dampen a capacitive network. The capacitive network has at least one capacitor positioned external to the interposer.

摘要翻译： 公开了各种电阻电路及其制造和使用方法。 一方面，提供一种制造方法，其包括在插入件上形成电阻器。 该电阻适用于抑制电容网络。 电容网络具有位于插入件外部的至少一个电容器。

公开(公告)号：US20130341783A1

公开(公告)日：2013-12-26

申请号：US13529736

申请日：2012-06-21

申请人： Michael Alfano ,  Joe Siegel ,  Michael Z. Su ,  Bryan Black ,  Julius Din

发明人： Michael Alfano ,  Joe Siegel ,  Michael Z. Su ,  Bryan Black ,  Julius Din

IPC分类号： H01L21/50 ,  H01L23/52

CPC分类号： H01L23/49827 ,  H01L22/14 ,  H01L22/20 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/5382 ,  H01L23/544 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2223/5444 ,  H01L2223/54446 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.

摘要翻译： 公开了各种插入件及其制造方法。 一方面，提供一种制造方法，其包括将识别结构耦合到插入器。 识别结构可操作以提供关于插入器的识别信息。 识别结构是可编程的，以创建或改变识别信息。

公开(公告)号：US10290606B2

公开(公告)日：2019-05-14

申请号：US13529736

申请日：2012-06-21

申请人： Michael Alfano ,  Joe Siegel ,  Michael Z. Su ,  Bryan Black ,  Julius Din

发明人： Michael Alfano ,  Joe Siegel ,  Michael Z. Su ,  Bryan Black ,  Julius Din

IPC分类号： H01L21/50 ,  H01L23/52 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/544 ,  H01L21/66 ,  H01L25/065 ,  H01L23/14

摘要： Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.