公开(公告)号：US09018749B2

公开(公告)日：2015-04-28

申请号：US14146376

申请日：2014-01-02

Applicant: Flextronics AP, LLC

Inventor： Samuel Tam ,  Bryan Lee Sik Pong ,  Dick Pang

IPC: H01L23/02 ,  H01L21/00 ,  H01L25/10 ,  H05K1/02 ,  H01L25/00 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K1/0296 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/111 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract translation: 这里描述的是使用激光直接结构化的堆叠封装。 堆叠的包装包括附接到基板的模具。 模具用激光直接结构化模具材料封装。 激光直接构造模具材料被激光激活，以在激光直接结构模具材料的顶部和侧表面上形成电路迹线。 然后电路迹线经历金属化。 然后将封装件附接到金属化电路迹线，并通过金属化电路迹线电连接至基板。