公开(公告)号：US09018749B2

公开(公告)日：2015-04-28

申请号：US14146376

申请日：2014-01-02

Applicant: Flextronics AP, LLC

Inventor： Samuel Tam ,  Bryan Lee Sik Pong ,  Dick Pang

IPC: H01L23/02 ,  H01L21/00 ,  H01L25/10 ,  H05K1/02 ,  H01L25/00 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K1/0296 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/111 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract translation: 这里描述的是使用激光直接结构化的堆叠封装。 堆叠的包装包括附接到基板的模具。 模具用激光直接结构化模具材料封装。 激光直接构造模具材料被激光激活，以在激光直接结构模具材料的顶部和侧表面上形成电路迹线。 然后电路迹线经历金属化。 然后将封装件附接到金属化电路迹线，并通过金属化电路迹线电连接至基板。

公开(公告)号：US20140117384A1

公开(公告)日：2014-05-01

申请号：US13660893

申请日：2012-10-25

Applicant: Flextronics AP, LLC

Inventor： Samuel Tam ,  Murad Kurwa ,  Dick Pang

IPC: H01L33/52 ,  H01L33/50

CPC classification number: H01L33/005 ,  H01L23/44 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/52 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation.

Abstract translation: 一种用于制造LED的方法和系统，其包括使用液体转移模具在整个硅晶片上形成多个坝结构，将模具附接到每个坝结构内的硅晶片，执行回流焊，清洁焊剂，执行引线接合， 分配磷光体，固化磷光体，同时通过使用所有坝结构上的液体转移模具，安装晶片，以及使用单个或多个LED单个切割的锯形成圆顶结构。

公开(公告)号：US09554465B1

公开(公告)日：2017-01-24

申请号：US14593849

申请日：2015-01-09

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Dick Pang ,  Murad Kurwa

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/092 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/183 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09218 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.

Abstract translation: 可拉伸互连件包括在弹性基底上形成为复合图案的多个导电迹线。 导电迹线的形式使得当弹性基底处于松弛或非拉伸状态时，每个导电迹线沿着弹性基底形成诸如波形的曲折路径。 导电迹线的弯曲路径提供松弛，使得当弹性基底被拉伸时松弛松弛。 一旦释放，弹性基板从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入导电迹线。

公开(公告)号：US09041019B2

公开(公告)日：2015-05-26

申请号：US13660893

申请日：2012-10-25

Applicant: Flextronics AP, LLC

Inventor： Samuel Tam ,  Murad Kurwa ,  Dick Pang

IPC: H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L21/00 ,  H01L25/075 ,  H01L23/44 ,  H01L33/50 ,  H01L33/52

CPC classification number: H01L33/005 ,  H01L23/44 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/52 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation.

Abstract translation: 一种用于制造LED的方法和系统，其包括使用液体转移模具在整个硅晶片上形成多个坝结构，将模具附接到每个坝结构内的硅晶片，执行回流焊，清洁焊剂，执行引线接合， 分配磷光体，固化磷光体，同时通过使用所有坝结构上的液体转移模具，安装晶片，以及使用单个或多个LED单个切割的锯形成圆顶结构。