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    Polishing composition for noble metals
    1.
    发明申请
    Polishing composition for noble metals 有权
    贵金属抛光组合物

    公开(公告)号：US20060024967A1

    公开(公告)日：2006-02-02

    申请号：US10901420

    申请日：2004-07-28

    申请人： Francesco De Rege Thesauro ,  Vlasta Brusic ,  Christopher Thompson ,  Benjamin Bayer

    发明人： Francesco De Rege Thesauro ,  Vlasta Brusic ,  Christopher Thompson ,  Benjamin Bayer

    IPC分类号： H01L21/461

    CPC分类号： C09G1/02 ,  C23F3/00 ,  H01L21/3212 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and α-hydroxycarbonyl compounds.

    摘要翻译： 本发明提供一种抛光组合物和一种化学机械抛光包含贵金属的基材的方法，所述抛光组合物包含（a）氧化贵金属的氧化剂，（b）选自硫酸盐， 硼酸盐，硝酸盐和磷酸盐，和（c）液体载体。 本发明还提供一种抛光组合物和一种化学机械抛光包含钌的基材的方法，该抛光组合物包含（a）氧化高于+4氧化态的钌的氧化剂，（b）选自下组的抛光添加剂： 由金属螯合聚合物，金属螯合剂，有机硫醇，还原四氧化钌的化合物，内酯和α-羟基羰基化合物组成。

    Compositions for polishing aluminum/copper and titanium in damascene structures
    3.
    发明授权
    Compositions for polishing aluminum/copper and titanium in damascene structures 有权
    用于在镶嵌结构中抛光铝/铜和钛的组合物

    公开(公告)号：US08425797B2

    公开(公告)日：2013-04-23

    申请号：US12052970

    申请日：2008-03-21

    申请人： Vlasta Brusic ,  Christopher Thompson ,  Jeffrey Dysard

    发明人： Vlasta Brusic ,  Christopher Thompson ,  Jeffrey Dysard

    IPC分类号： C09K13/04

    CPC分类号： H01L21/30625 ,  B24B37/044 ,  B24D3/00 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  C23F3/03 ,  C23F3/06

    摘要： The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an α-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.

    摘要翻译： 本发明提供了用于平坦化或抛光基材的组合物和方法。 该组合物包含由任选用聚合物氧化的氧化铝颗粒，α-羟基羧酸，氧化至少一种金属的氧化剂，任选的含钙化合物，任选的含钙化合物，任选的杀生物剂，任选地， pH调节剂和水。 该方法使用组合物对基材进行化学机械抛光。

    CMP of copper/ruthenium substrates
    5.
    发明申请
    CMP of copper/ruthenium substrates 有权

    公开(公告)号：US20070090094A1

    公开(公告)日：2007-04-26

    申请号：US11259645

    申请日：2005-10-26

    申请人： Christopher Thompson ,  Vlasta Brusic ,  Renjie Zhou

    发明人： Christopher Thompson ,  Vlasta Brusic ,  Renjie Zhou

    IPC分类号： C03C15/00 ,  C23F1/00 ,  H01L21/302 ,  B44C1/22

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  C23F3/04

    摘要： The invention provides a method of chemically-mechanically polishing a substrate. A substrate comprising ruthenium and copper is contacted with a chemical-mechanical polishing system comprising a polishing component, hydrogen peroxide, an organic acid, at least one heterocyclic compound comprising at least one nitrogen atom, and water. The polishing component is moved relative to the substrate, and at least a portion of the substrate is abraded to polish the substrate. The pH of the polishing system is about 6 to about 12, the ruthenium and copper are in electrical contact, and the difference between the open circuit potential of copper and the open circuit potential of ruthenium in the polishing system is about 50 mV or less.

    Use of CMP for aluminum mirror and solar cell fabrication
    7.
    发明申请
    Use of CMP for aluminum mirror and solar cell fabrication 有权
    使用CMP用于铝镜和太阳能电池制造

    公开(公告)号：US20070010098A1

    公开(公告)日：2007-01-11

    申请号：US11173518

    申请日：2005-06-30

    申请人： Vlasta Brusic ,  Richard Jenkins ,  Christopher Thompson

    发明人： Vlasta Brusic ,  Richard Jenkins ,  Christopher Thompson

    IPC分类号： H01L21/461 ,  B24B1/00

    CPC分类号： C09G1/02 ,  B24B13/015 ,  B24B29/02 ,  B24B37/044 ,  B24B37/24 ,  C09K3/1454 ,  H01L31/054

    摘要： The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.

    摘要翻译： 本发明涉及一种抛光包含铝的基材的表面的方法，包括使基材的表面与抛光垫接触，以及抛光组合物，其包含研磨剂，氧化铝的试剂和液体载体，并在 至少一部分表面以从衬底去除至少一些铝并抛光衬底的表面，其中磨料是颗粒形式并悬浮在液体载体中。

    Gold CMP composition and method
    9.
    发明授权
    Gold CMP composition and method 有权
    金CMP组成和方法

    公开(公告)号：US07368066B2

    公开(公告)日：2008-05-06

    申请号：US11444866

    申请日：2006-05-31

    申请人： Vlasta Brusic ,  Renjie Zhou ,  Christopher Thompson

    发明人： Vlasta Brusic ,  Renjie Zhou ,  Christopher Thompson

    IPC分类号： B44C1/22

    CPC分类号： C23F3/04 ,  C09G1/02 ,  H01L21/3212

    摘要： The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.

    摘要翻译： 本发明提供了一种无氰化学机械抛光（CMP）组合物，其可用于抛光基底的含金表面。 CMP组合物包含研磨剂，金氧化剂，不含氰化物的金增溶剂及其水性载体。 本发明还提供了利用上述抛光组合物对衬底的含金表面进行化学机械抛光的方法。

    Gold CMP composition and method
    10.
    发明申请
    Gold CMP composition and method 有权
    金CMP组成和方法

    公开(公告)号：US20070278184A1

    公开(公告)日：2007-12-06

    申请号：US11444866

    申请日：2006-05-31

    申请人： Vlasta Brusic ,  Renjie Zhou ,  Christopher Thompson

    发明人： Vlasta Brusic ,  Renjie Zhou ,  Christopher Thompson

    IPC分类号： C03C15/00 ,  C23F1/00

    CPC分类号： C23F3/04 ,  C09G1/02 ,  H01L21/3212

    摘要： The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.

    摘要翻译： 本发明提供了一种无氰化学机械抛光（CMP）组合物，其可用于抛光基底的含金表面。 CMP组合物包含研磨剂，金氧化剂，不含氰化物的金增溶剂及其水性载体。 本发明还提供了利用上述抛光组合物对衬底的含金表面进行化学机械抛光的方法。