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公开(公告)号:US4763826A
公开(公告)日:1988-08-16
申请号:US862988
申请日:1986-05-14
申请人: Frederick W. Kulicke, Jr. , David A. Leonhardt , Robert B. Newsome , Richard D. Sadler , Gary S. Gillotti
发明人: Frederick W. Kulicke, Jr. , David A. Leonhardt , Robert B. Newsome , Richard D. Sadler , Gary S. Gillotti
CPC分类号: H01L24/78 , B23K20/005 , H01L2224/78313 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082
摘要: An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire feed slack loop device comprises a pair of sector plates which are closely spaced apart from each other to provide an air space therebetween for receiving the fine wire. Compressed air is supplied to the air space between the sector plates and is directed radially outward by a diffuser shim plate which forces the wire to form into a uniform circular shape in the air space. Sensor means are provided at the outer perimeter of the sector plates which sense the position of the fine wire and supplies a signal to control means which turns off the rotation of the drive motor. Turning off the gas provides a slack wire loop with sufficient fine wire to make an interconnection on a semiconductor device without creating tension or compression of the wire at the bonding tool.
摘要翻译: 提供了一种用于将细线供应到毛细管接合工具或楔形接合工具的改进的自动送丝系统。 送丝系统包括一种新颖的送丝松弛环装置,其安装在接合工具和细丝源之间的接线机上。 新颖的送丝松弛环装置包括彼此紧密间隔开的一对扇形板,以在其间提供用于接收细线的空气空间。 压缩空气被供给到扇形板之间的空气空间,并且通过扩散器垫片径向向外指向,该扩散板垫板迫使电线在空气空间中形成均匀的圆形形状。 传感器装置设置在扇形板的外周边,感测细线的位置,并将信号提供给控制装置,该控制装置关闭驱动电动机的旋转。 关闭气体提供具有足够细线的松弛线环,以在半导体器件上形成互连,而不会在焊接工具处产生电线的张力或压缩。
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公开(公告)号:US5277355A
公开(公告)日:1994-01-11
申请号:US981764
申请日:1992-11-25
CPC分类号: B23K20/004 , B23K20/10 , B23K20/106 , H01L24/78 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2224/85205 , H01L2924/00014 , H01L2924/14
摘要: A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be connected to a bonding head support. The wire clamp jaw mounting arm serves as a fixed lever to which is attached a first fixed flat surface clamping jaw and also serves as a mount to which a second and pivotal jaw is positioned juxtaposed the first jaw. A force mounting spring is also mounted on the mounting arm for applying a unidirectional force to one end of the second pivotal jaw to bias the pivotal jaw in a normally open or normally closed position. A force adjusting screw is further mounted on the mounting jaw which cooperates with the force spring for setting a predetermined bias jaw force on the second jaw which is mounted for effecting a rocking motion along an edge of the first jaw so that when the second jaw pivots along the line edge of the first jaw, it forms a plane defining a wedge parallel to the first jaw which is self-aligning.
摘要翻译: 提供了一种低质量的自调心线夹钳组件,其可用作可替换的线夹钳组件或作为具有致动器的完整集成线夹组件。 该新型自对准线夹钳组件包括线夹爪安装臂,其适于连接到接合头支架。 线夹爪安装臂用作固定杆,其附接有第一固定平面夹紧爪,并且还用作安装件,第二枢转夹爪与第一夹爪并置放置在该安装座上。 力安装弹簧也安装在安装臂上,用于向第二枢转钳口的一端施加单向力以将枢转钳口偏压在常开或常闭位置。 力调节螺钉进一步安装在安装爪上,与力弹簧配合,用于在第二夹爪上设置预定的偏压钳口力,第二钳夹被安装成用于沿着第一钳口的边缘进行摇摆运动,使得当第二钳爪枢转时 沿着第一钳口的线边缘,它形成一个平行于自对准的第一钳口的楔形平面。
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公开(公告)号:US4361261A
公开(公告)日:1982-11-30
申请号:US178368
申请日:1980-08-15
IPC分类号: H01L21/00 , H01L21/60 , H01L21/607 , B23K37/02
CPC分类号: H01L24/85 , H01L24/78 , H01L2224/45124 , H01L2224/4847 , H01L2224/49171 , H01L2224/78822 , H01L2224/78901 , H01L2224/85205 , H01L24/45 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01054 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , Y10T29/49778
摘要: A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.
摘要翻译: 一种用于将细线楔入半导体器件的引线接合机设置有旋转接合头,其安装在固定机架上,并且具有安装在固定机架上的XY工作台,该XY工作台与安装在旋转接合头上的可垂直移动的接合工具相对 。 接合头设置有用于在垂直方向和旋转方向上铰接接合工具的装置。 新型接合头的旋转运动不会对接合工具施加垂直运动。
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公开(公告)号:US4073424A
公开(公告)日:1978-02-14
申请号:US715042
申请日:1976-08-17
IPC分类号: H01L21/60 , H01L21/603
CPC分类号: H01L24/78 , H01L2224/78 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/14 , Y10T74/20201
摘要: An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor at a first bond position and completing a first bond, the second bond actuating means cooperating with a second bond positioning device automatically moves the semiconductor to a second bond position. After completing the second bond, the second bond positioning actuating means is released permitting the semiconductor to return to a first bond position as another second bond positioning device is cycled into active position.
摘要翻译: 一种用于在第二接合位置自动定位引线接合机的设备设置有多个可单独调节的第二接合定位装置,其设置在第二接合位置处并与第二接合定位致动装置配合。 在将半导体定位在第一接合位置并完成第一接合之后,与第二接合定位装置配合的第二接合致动装置自动将半导体移动到第二接合位置。 在完成第二接合之后,第二接合定位致动装置被释放,允许半导体返回到第一接合位置,因为另一第二接合定位装置循环到主动位置。
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公开(公告)号:US4239144A
公开(公告)日:1980-12-16
申请号:US963167
申请日:1978-11-22
CPC分类号: H01L24/85 , B23K20/005 , H01L24/78 , H01L2224/45124 , H01L2224/4847 , H01L2224/49171 , H01L2224/78 , H01L2224/85205 , H01L24/45 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01054 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , Y10S228/904 , Y10T403/32672 , Y10T403/32983 , Y10T74/20207
摘要: A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.
摘要翻译: 一种用于将细线楔入半导体器件的引线接合机设置有旋转接合头,其安装在固定机架上,并且具有安装在固定机架上的XY工作台,该XY工作台与安装在旋转接合头上的可垂直移动的接合工具相对 。 接合头设有用于在垂直方向和旋转方向上铰接接合工具的装置。 新型接合头的旋转运动不会对接合工具施加垂直运动。
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