公开(公告)号：US20100038560A1

公开(公告)日：2010-02-18

申请号：US12508140

申请日：2009-07-23

申请人： Fumihiko Tokura ,  Katsuhiko Kikuchi ,  Yuji Akasaki

发明人： Fumihiko Tokura ,  Katsuhiko Kikuchi ,  Yuji Akasaki

IPC分类号： G21G5/00

CPC分类号： B08B7/0042 ,  B23K26/06 ,  B23K26/0622 ,  G01R3/00

摘要： A probe cleaning apparatus includes a cleaning-conditions database. The probe cleaning apparatus removes contamination from a probe by irradiating the probe by a laser beam, refers to the cleaning-conditions database based on information about the probe, such as material and shape, and controls properties of the laser beam, such as output intensity, pulse interval, wavelength, and pulse width, so that the probe cleaning apparatus removes the contamination from the probe without damaging the probe by heat.

摘要翻译： 探针清洁装置包括清洁条件数据库。 探针清洁装置通过用激光束照射探针来去除探针中的污染物，基于关于探针的信息（例如材料和形状）来指示清洁条件数据库，并且控制激光束的性质，例如输出强度 脉冲间隔，波长和脉冲宽度，使得探头清洁装置从探针中去除污染物，而不会因热而损坏探针。

公开(公告)号：US07977961B2

公开(公告)日：2011-07-12

申请号：US12358522

申请日：2009-01-23

申请人： Daisuke Koizumi ,  Naohito Kohashi ,  Yuji Akasaki

发明人： Daisuke Koizumi ,  Naohito Kohashi ,  Yuji Akasaki

IPC分类号： G01R31/00

CPC分类号： G01R31/2863 ,  G01R31/2865

摘要： A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.

摘要翻译： 用于电子部件的测试装置的部件包括测试板; 投影电极，设置在测试板的主表面上; 所述定位部设置在所述测试板的主表面上，所述定位部被配置为定位所述电子部件; 以及按压部，被构造成按压由所述定位部定位的所述电子部件，并且使所述电子部件的引导部与所述突起电极接触，使得所述引线部弹性变形并与所述突起电极接触。

公开(公告)号：US06781223B2

公开(公告)日：2004-08-24

申请号：US10146904

申请日：2002-05-17

申请人： Takayuki Mihara ,  Yuji Akasaki

发明人： Takayuki Mihara ,  Yuji Akasaki

IPC分类号： H01L2350

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： This semiconductor device comprises a semiconductor chip, a signal lead connected to a signal electrode of the semiconductor chip, an external signal electrode connected with the signal lead, a ground lead extending along the signal lead, and a sealing resin sealing these elements. The external signal electrode is formed as a protruding electrode protruding from an undersurface of the sealing resin. One surface of the signal lead is exposed on the undersurface of the sealing resin.

摘要翻译： 该半导体器件包括半导体芯片，连接到半导体芯片的信号电极的信号引线，与信号引线连接的外部信号电极，沿着信号引线延伸的接地引线和密封这些元件的密封树脂。 外部信号电极形成为从密封树脂的下表面突出的突出电极。 信号引线的一个表面暴露在密封树脂的下表面上。

公开(公告)号：US08436633B2

公开(公告)日：2013-05-07

申请号：US12726426

申请日：2010-03-18

申请人： Satoshi Sano ,  Yuji Akasaki

发明人： Satoshi Sano ,  Yuji Akasaki

IPC分类号： G01R31/26

CPC分类号： G01R31/2891 ,  H01L22/12 ,  H01L22/20

摘要： Disclosed is a method to determine a needle mark, which can more accurately determine whether marks formed on electrode pads of devices are probe needle marks, thereby significantly reducing misdetermination of the marks as the probe needle marks. The method includes giving scores, which are used to determine the quality of marks as probe needle marks, to marks formed on a plurality of electrode pads of a plurality of devices, and selecting, based on the scores, an object device including an object electrode pad with an indefinite mark formed thereon, and selecting four comparison devices preceding the object device and nine time-successive comparison devices following the object device at successive times along the test direction, and determining if the indefinite mark of the object device is good or bad as a probe needle mark, by comparing a value of the score given to the indefinite mark of the object device plus scores given to marks formed on the comparison devices' comparison electrode pads corresponding to the object electrode pad, with a reference value.

摘要翻译： 公开了一种确定针标的方法，其可以更精确地确定形成在装置的电极焊盘上的标记是否是探针针迹，从而显着减少探针针标记时的标记的误定。 该方法包括将用于确定作为探针针迹的标记的质量的分数分配给形成在多个装置的多个电极焊盘上的标记，并且基于分数来选择包括对象电极的对象装置 在其上形成无限度标记，并且在连续的时间沿着测试方向选择在对象设备之前的四个比较设备和跟随对象设备的九个时间连续的比较设备，以及确定对象设备的不定标是否良好 作为探针针标，通过比较给定到对象装置的不定标记的得分的值加上给对应于对象电极垫的比较装置的比较电极垫上形成的标记的评分与参考值进行比较。

公开(公告)号：US20050162517A1

公开(公告)日：2005-07-28

申请号：US11019117

申请日：2004-12-22

申请人： Katsumi Fujihara ,  Susumu Haga ,  Takeo Shigihara ,  Yuji Akasaki

发明人： Katsumi Fujihara ,  Susumu Haga ,  Takeo Shigihara ,  Yuji Akasaki

IPC分类号： G01M11/00 ,  H01L21/66 ,  H01L27/14 ,  H04N17/00

CPC分类号： H04N17/002

摘要： An image-pickup-device testing method according to an aspect of the present invention, wherein processes are performed at one stage, the processes includes mounting a image pickup device under test on a test desk, performing an electrical test on the mounted image pickup device, then performing automatic focus adjustment, then performing an image test; then performing a flicker test; then fixing a lens, and then measuring assembly dimensions of the image pickup device under test.

摘要翻译： 根据本发明的一个方面的图像拾取装置测试方法，其中在一个阶段执行处理，所述处理包括将被测试的图像拾取装置安装在测试台上，对安装的图像拾取装置执行电测试 ，然后执行自动对焦调整，然后执行图像测试; 然后执行闪烁测试; 然后固定镜头，然后测量被测图像拾取装置的组件尺寸。

公开(公告)号：US20100237894A1

公开(公告)日：2010-09-23

申请号：US12726426

申请日：2010-03-18

申请人： Satoshi Sano ,  Yuji Akasaki

发明人： Satoshi Sano ,  Yuji Akasaki

IPC分类号： G01R31/26

CPC分类号： G01R31/2891 ,  H01L22/12 ,  H01L22/20

摘要： Disclosed is a method to determine a needle mark, which can more accurately determine whether marks formed on electrode pads of devices are probe needle marks, thereby significantly reducing misdetermination of the marks as the probe needle marks. The method includes giving scores, which are used to determine the quality of marks as probe needle marks, to marks formed on a plurality of electrode pads of a plurality of devices, and selecting, based on the scores, an object device including an object electrode pad with an indefinite mark formed thereon, and selecting four comparison devices preceding the object device and nine time-successive comparison devices following the object device at successive times along the test direction, and determining if the indefinite mark of the object device is good or bad as a probe needle mark, by comparing a value of the score given to the indefinite mark of the object device plus scores given to marks formed on the comparison devices' comparison electrode pads corresponding to the object electrode pad, with a reference value.

摘要翻译： 公开了一种确定针标的方法，其可以更精确地确定形成在装置的电极焊盘上的标记是否是探针针迹，从而显着减少探针针标记时的标记的误定。 该方法包括将用于确定作为探针针迹的标记的质量的分数分配给形成在多个装置的多个电极焊盘上的标记，并且基于分数来选择包括对象电极的对象装置 在其上形成无限度标记，并且在连续的时间沿着测试方向选择在对象设备之前的四个比较设备和跟随对象设备的九个时间连续的比较设备，以及确定对象设备的不定标是否良好 作为探针针标，通过比较给定到对象装置的不定标记的得分的值加上给对应于对象电极垫的比较装置的比较电极垫上形成的标记的评分与参考值进行比较。

公开(公告)号：US06392433B1

公开(公告)日：2002-05-21

申请号：US09350925

申请日：1999-07-12

申请人： Kenji Itasaka ,  Terumi Kamifukumoto ,  Yuji Akasaki ,  Nobuo Ooyama

发明人： Kenji Itasaka ,  Terumi Kamifukumoto ,  Yuji Akasaki ,  Nobuo Ooyama

IPC分类号： G01R3126

摘要： A method of testing semiconductor devices includes an adhering step, a position correcting step, and an electrical test step. The adhering step includes adhering either a semiconductor device collective body or a plurality of individual semiconductor devices onto an adhesive tape provided on a tape-holding member, the semiconductor device collective body being constructed by a plurality of semiconductor devices integrated together. The position correcting step includes positioning the semiconductor devices by mounting the tape-holding member on a position correction unit and, using an image processing technique, implementing position recognition and position correction of the semiconductor devices adhered on the adhesive tape. The electrical test step includes implementing an electrical characteristic test on the semiconductor devices positioned in the position correction step by connected the semiconductor devices on a testing contactor.