Semiconductor memory device and method of fabricating the same
    1.
    发明授权
    Semiconductor memory device and method of fabricating the same 失效
    半导体存储器件及其制造方法

    公开(公告)号:US08048741B2

    公开(公告)日:2011-11-01

    申请号:US12715964

    申请日:2010-03-02

    IPC分类号: H01L21/336

    摘要: A semiconductor memory device includes: a semiconductor substrate, on which an impurity diffusion layer is formed in a cell array area; a gate wiring stack body formed on the cell array area, in which multiple gate wirings are stacked and separated from each other with insulating films; a gate insulating film formed on the side surface of the gate wiring stack body, in which an insulating charge storage layer is contained; pillar-shaped semiconductor layers arranged along the gate wiring stack body, one side surfaces of which are opposed to the gate wiring stack body via the gate insulating film, each pillar-shaped semiconductor layer having the same conductivity type as the impurity diffusion layer; and data lines formed to be in contact with the upper surfaces of the pillar-shaped semiconductor layers and intersect the gate wirings.

    摘要翻译: 半导体存储器件包括:在单元阵列区域中形成有杂质扩散层的半导体衬底; 形成在电池阵列区域上的栅极布线堆叠体,其中多个栅极布线彼此堆叠并且用绝缘膜分离; 形成在栅极布线堆叠体的侧表面上的栅极绝缘膜,其中包含绝缘电荷存储层; 沿着栅极布线堆叠体排列的柱状半导体层,其一个侧表面经由栅极绝缘膜与栅极布线堆叠体相对,每个柱状半导体层具有与杂质扩散层相同的导电类型; 以及形成为与柱状半导体层的上表面接触并与栅极布线相交的数据线。

    Semiconductor memory and method for manufacturing a semiconductor memory
    2.
    发明授权
    Semiconductor memory and method for manufacturing a semiconductor memory 有权
    半导体存储器和半导体存储器的制造方法

    公开(公告)号:US07884422B2

    公开(公告)日:2011-02-08

    申请号:US11841257

    申请日:2007-08-20

    IPC分类号: H01L27/12

    摘要: A semiconductor memory including a plurality of cell units arranged in a row direction, each of the cell units includes: a semiconductor region; a first buried insulating film provided on the semiconductor region; a second buried insulating film provided on the first buried insulating film, which has higher dielectric constant than the first buried insulating film; a semiconductor layer provided on the second buried insulating film; and a plurality of memory cell transistors arranged in a column direction, each of the memory cell transistors having a source region, a drain region and a channel region defined in the semiconductor layer.

    摘要翻译: 一种半导体存储器,包括沿行方向布置的多个单元单元,每个单元单元包括:半导体区域; 设置在半导体区域上的第一掩埋绝缘膜; 设置在第一掩埋绝缘膜上的第二掩埋绝缘膜,其具有比第一掩埋绝缘膜更高的介电常数; 设置在所述第二掩埋绝缘膜上的半导体层; 以及沿列方向布置的多个存储单元晶体管,每个存储单元晶体管具有限定在半导体层中的源极区,漏极区和沟道区。

    Semiconductor memory device including pillar-shaped semiconductor layers and a method of fabricating the same
    5.
    发明授权
    Semiconductor memory device including pillar-shaped semiconductor layers and a method of fabricating the same 失效
    包括柱状半导体层的半导体存储器件及其制造方法

    公开(公告)号:US07696559B2

    公开(公告)日:2010-04-13

    申请号:US11616522

    申请日:2006-12-27

    IPC分类号: H01L27/115

    摘要: A semiconductor memory device includes: a semiconductor substrate, on which an impurity diffusion layer is formed in a cell array area; a gate wiring stack body formed on the cell array area, in which multiple gate wirings are stacked and separated from each other with insulating films; a gate insulating film formed on the side surface of the gate wiring stack body, in which an insulating charge storage layer is contained, pillar-shaped semiconductor layers arranged along the gate wiring stack body, one side surfaces of which are opposed to the gate wiring stack body via the gate insulating film, each pillar-shaped semiconductor layer having the same conductivity type as the impurity diffusion layer; and data lines formed to be in contact with the upper surfaces of the pillar-shaped semiconductor layers and intersect the gate wirings.

    摘要翻译: 半导体存储器件包括:在单元阵列区域中形成有杂质扩散层的半导体衬底; 形成在电池阵列区域上的栅极布线堆叠体,其中多个栅极布线彼此堆叠并且用绝缘膜分离; 形成在栅极布线堆叠体的侧表面上的栅极绝缘膜,其中包含绝缘电荷存储层,沿着栅极布线堆叠体布置的柱状半导体层,其一个侧表面与栅极布线相对 堆叠体经由栅极绝缘膜,每个柱状半导体层具有与杂质扩散层相同的导电类型; 以及形成为与柱状半导体层的上表面接触并与栅极布线相交的数据线。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    6.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 失效
    半导体存储器件及其制造方法

    公开(公告)号:US20070158736A1

    公开(公告)日:2007-07-12

    申请号:US11616522

    申请日:2006-12-27

    IPC分类号: H01L29/788

    摘要: A semiconductor memory device includes: a semiconductor substrate, on which an impurity diffusion layer is formed in a cell array area; a gate wiring stack body formed on the cell array area, in which multiple gate wirings are stacked and separated from each other with insulating films; a gate insulating film formed on the side surface of the gate wiring stack body, in which an insulating charge storage layer is contained, pillar-shaped semiconductor layers arranged along the gate wiring stack body, one side surfaces of which are opposed to the gate wiring stack body via the gate insulating film, each pillar-shaped semiconductor layer having the same conductivity type as the impurity diffusion layer; and data lines formed to be in contact with the upper surfaces of the pillar-shaped semiconductor layers and intersect the gate wirings.

    摘要翻译: 半导体存储器件包括:在单元阵列区域中形成有杂质扩散层的半导体衬底; 形成在电池阵列区域上的栅极布线堆叠体,其中多个栅极布线彼此堆叠并且用绝缘膜分离; 形成在栅极布线堆叠体的侧表面上的栅极绝缘膜,其中包含绝缘电荷存储层,沿着栅极布线堆叠体布置的柱状半导体层,其一个侧表面与栅极布线相对 堆叠体经由栅极绝缘膜,每个柱状半导体层具有与杂质扩散层相同的导电类型; 以及形成为与柱状半导体层的上表面接触并与栅极布线相交的数据线。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    7.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 失效
    半导体存储器件及其制造方法

    公开(公告)号:US20100159657A1

    公开(公告)日:2010-06-24

    申请号:US12715964

    申请日:2010-03-02

    IPC分类号: H01L21/336

    摘要: A semiconductor memory device includes: a semiconductor substrate, on which an impurity diffusion layer is formed in a cell array area; a gate wiring stack body formed on the cell array area, in which multiple gate wirings are stacked and separated from each other with insulating films; a gate insulating film formed on the side surface of the gate wiring stack body, in which an insulating charge storage layer is contained; pillar-shaped semiconductor layers arranged along the gate wiring stack body, one side surfaces of which are opposed to the gate wiring stack body via the gate insulating film, each pillar-shaped semiconductor layer having the same conductivity type as the impurity diffusion layer; and data lines formed to be in contact with the upper surfaces of the pillar-shaped semiconductor layers and intersect the gate wirings.

    摘要翻译: 半导体存储器件包括:在单元阵列区域中形成有杂质扩散层的半导体衬底; 形成在电池阵列区域上的栅极布线堆叠体,其中多个栅极布线彼此堆叠并且用绝缘膜分离; 形成在栅极布线堆叠体的侧表面上的栅极绝缘膜,其中包含绝缘电荷存储层; 沿着栅极布线堆叠体排列的柱状半导体层,其一个侧表面经由栅极绝缘膜与栅极布线堆叠体相对,每个柱状半导体层具有与杂质扩散层相同的导电类型; 以及形成为与柱状半导体层的上表面接触并与栅极布线相交的数据线。

    SEMICONDUCTOR MEMORY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MEMORY
    8.
    发明申请
    SEMICONDUCTOR MEMORY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MEMORY 有权
    半导体存储器和制造半导体存储器的方法

    公开(公告)号:US20080073695A1

    公开(公告)日:2008-03-27

    申请号:US11841257

    申请日:2007-08-20

    IPC分类号: H01L27/12 H01L21/84

    摘要: A semiconductor memory including a plurality of cell units arranged in a row direction, each of the cell units includes: a semiconductor region; a first buried insulating film provided on the semiconductor region; a second buried insulating film provided on the first buried insulating film, which has higher dielectric constant than the first buried insulating film; a semiconductor layer provided on the second buried insulating film; and a plurality of memory cell transistors arranged in a column direction, each of the memory cell transistors having a source region, a drain region and a channel region defined in the semiconductor layer.

    摘要翻译: 一种半导体存储器,包括沿行方向布置的多个单元单元,每个单元单元包括:半导体区域; 设置在半导体区域上的第一掩埋绝缘膜; 设置在第一掩埋绝缘膜上的第二掩埋绝缘膜,其具有比第一掩埋绝缘膜更高的介电常数; 设置在所述第二掩埋绝缘膜上的半导体层; 以及沿列方向布置的多个存储单元晶体管,每个存储单元晶体管具有限定在半导体层中的源极区,漏极区和沟道区。