Abstract:
A method of testing the cleanability of polymerized sublimate outgassed from a lithography material during a thermal heating process including; placing a wafer on a wafer hotplate inside a chamber with the wafer being covered by a lithography material; placing a target, having a starting composition, above the wafer in the chamber; heating the wafer using the wafer hotplate in an attempt to outgas a sublimate, where the sublimate condenses on the target; forming a polymerized sublimate on the target; and applying organic solvents to the target to determine the cleanability of the polymerized sublimate.
Abstract:
A mass spectrometer system includes a chamber configured to receive a sample; a gas source coupled to the chamber for delivering a gas across the sample; and a desorption energy source configured to desorb a contaminant from a test area of the sample. The system may also include a mass spectrometer including a vacuum source, an ion source, a mass analyzer and a detector, and a capillary transfer line operatively coupled to the chamber and the mass spectrometer and configured to deliver desorbed volatiles of the contaminant from the test area to the mass spectrometer, the capillary transfer line having an intake proximal the test area. A method of identifying a contaminant is also disclosed.
Abstract:
A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR′ wherein R′ is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R1, R2, R3, R4, and R5 or any two, three, or four of R6, R7, R8, R9, and R10 are optionally interconnected to form a fused ring system; R11 and R12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.