Bipolar junction transistors with an air gap in the shallow trench isolation
    3.
    发明授权
    Bipolar junction transistors with an air gap in the shallow trench isolation 有权
    双极结晶体管与浅沟槽隔离有气隙

    公开(公告)号:US09231074B2

    公开(公告)日:2016-01-05

    申请号:US13946379

    申请日:2013-07-19

    Abstract: Device structures, fabrication methods, and design structures for a bipolar junction transistor. A trench isolation region is formed in a substrate. The trench isolation region is coextensive with a collector in the substrate. A base layer is formed on the collector and on a first portion of the trench isolation region. A dielectric layer is formed on the base layer and on a second portion of the trench isolation region peripheral to the base layer. After the dielectric layer is formed, the trench isolation region is at least partially removed to define an air gap beneath the dielectric layer and the base layer.

    Abstract translation: 双极结型晶体管的器件结构,制造方法和设计结构。 在衬底中形成沟槽隔离区。 沟槽隔离区域与衬底中的集电极共同延伸。 基底层形成在集电器和沟槽隔离区的第一部分上。 电介质层形成在基底层上和在基底层周边的沟槽隔离区域的第二部分上。 在形成电介质层之后,至少部分去除沟槽隔离区域以在电介质层和基底层下方形成气隙。

Patent Agency Ranking