-
公开(公告)号：US07106588B2
公开(公告)日：2006-09-12
申请号：US10694191
申请日：2003-10-27
IPC分类号： H05K7/20 , H01L23/427 , H05K7/06
CPC分类号： H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.
摘要翻译： 本发明涉及从大功率电子设备散热的装置和方法。 该组件包括大电流衬底，诸如支撑电子器件的印刷电路板，与电子器件热耦合的热管和还形成散热器的组装壳体，以及可以热耦合的热瞬变抑制材料 与电子设备和热管。
-
公开(公告)号：US06560110B1
公开(公告)日：2003-05-06
申请号：US10079760
申请日：2002-02-22
IPC分类号： H05K720
CPC分类号： H05K5/064 , H05K7/20463
摘要： A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.
摘要翻译： 提供了一种抗腐蚀电子组件10，其包括安装在基板14上并位于灌封材料18内的至少一个发热电子元件12.导热块元件24热安装到至少一个发热电子元件12上并定位 在灌封材料18内，从而提供具有改善的热耗散的耐腐蚀电子组件10。
-
公开(公告)号：US06779260B1
公开(公告)日：2004-08-24
申请号：US10401850
申请日：2003-03-28
IPC分类号： A05K330
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01R13/504 , H01R13/665 , H01R43/24 , H05K3/0058 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a backplate affixed to the substrate and, in some cases, also to the connector housing or shroud. In some embodiments, the connector housing or shroud may be affixed to the substrate, and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound to bond together all components of the subassembly and form the overmolded electronic package. The subassembly of components with the exception of the backplate may alternatively be overmolded with the molding compound, and a backplate thereafter affixed to the subassembly via a compliant bonding medium.
摘要翻译： 包覆成型的电子封装包括电路承载基板和通过适当的互连布置互连的连接器壳体或护罩。 一些实施例可以包括固定到基板的背板，并且在一些情况下还可以包括连接器壳体或护罩。 在一些实施例中，连接器壳体或护罩可以固定到基底上，并且在任何情况下，组件的整个子组件都用可刚性地形成的模制化合物进行包覆模制，以将所述子组件的所有部件结合在一起并形成包覆模制的电子封装。 组件除了背板之外的组件可以替代地用模制复合物包覆成型，然后后板通过柔性粘合介质固定到子组件上。
-
公开(公告)号：US07616448B2
公开(公告)日：2009-11-10
申请号：US11901042
申请日：2007-09-14
申请人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
发明人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
IPC分类号： H05K5/06
CPC分类号： H05K3/284 , H05K3/0061 , H05K3/0064 , H05K5/0034 , H05K5/065 , H05K7/20854 , H05K2201/10189 , H05K2203/1316
摘要： An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.
摘要翻译： 改进的包覆成型电子组件包括设置有凹入边缘的背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路 装置，电连接器和包覆成型体，其具有围绕背板的侧部并且围绕边缘凹部的周边边缘。 所产生的过度包覆功能消除了在电子组件的热循环期间会发生的分层问题，提高了连接器到背板接口处的耐腐蚀性，并且增强了印刷电路板组件和电连接器到组件的固定。
-
公开(公告)号：US07447041B2
公开(公告)日：2008-11-04
申请号：US11712718
申请日：2007-03-01
IPC分类号： H05K7/00
CPC分类号： H05K7/2049 , H01L24/05 , H01L24/06 , H01L24/72 , H01L25/072 , H01L2224/05644 , H01L2224/06181 , H01L2924/01029 , H01L2924/10253 , H01L2924/1203 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00
摘要： An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.
摘要翻译： 提供了改进的垂直集成电路器件封装，其消除或减少了对引线接合和/或焊接连接的需要。 封装包括在相对表面上具有电极的垂直装置，以及用于在电极和对应的导电元件之间建立压缩电连接的压缩弹簧构件。
-
6.发明授权Technique for connector to printed circuit board decoupling to eliminate flexure 失效连接器到印刷电路板去耦的技术，以消除挠曲公开(公告)号：US06905349B1
公开(公告)日：2005-06-14
申请号：US10784350
申请日：2004-02-23
申请人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Larry M Mandel , Richard D. Parker
发明人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Larry M Mandel , Richard D. Parker
CPC分类号： H05K3/284 , H05K1/0271 , H05K2201/10189 , H05K2203/1316
摘要： An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.
摘要翻译： 电子组件和/或模具被构造成当电子组件被包覆成型时减少对电子组件的部件和/或相关联的印刷电路板的偏转和所造成的损坏。
-
公开(公告)号：US20090073663A1
公开(公告)日：2009-03-19
申请号：US11901042
申请日：2007-09-14
申请人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
发明人： Thomas A. Degenkolb , Scott D. Brandenburg , Larry M. Mandel , Kin Yean Chow , Ching Meng Fang , Sim Ying Yong
IPC分类号： H05K5/02
CPC分类号： H05K3/284 , H05K3/0061 , H05K3/0064 , H05K5/0034 , H05K5/065 , H05K7/20854 , H05K2201/10189 , H05K2203/1316
摘要： An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.
-
公开(公告)号：US20090108439A1
公开(公告)日：2009-04-30
申请号：US12316982
申请日：2008-12-17
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
摘要翻译： 封装的微电子封装包括直接耦合到一个或多个半导体芯片的流体传导冷却管，其中密封剂模制在半导体芯片上并且冷却管的靠近半导体芯片的部分。 密封剂相对于半导体芯片固定冷却管，并且冷却管和密封剂设计成使其相对于半导体芯片的热膨胀系数的差异最小化。
-
公开(公告)号：US07485957B2
公开(公告)日：2009-02-03
申请号：US11654318
申请日：2007-01-17
IPC分类号： H01L23/46
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
-
公开(公告)号：US07422448B2
公开(公告)日：2008-09-09
申请号：US11191864
申请日：2005-07-28
IPC分类号： H01R12/00
CPC分类号： H01R43/0256 , H01R12/716 , H01R43/0249
摘要： A surface mount connector and assembly including the surface mount connector is shown and described. The assembly comprises a substrate and a connector including a carrier, and at least one electrical connecting element having first and second ends, wherein at least a portion of the first end extends through the carrier to electrically adjoin and physically secure the connector to the substrate. A reinforcement medium is disposed about at least a portion of surface mount connector and said substrate.
摘要翻译： 示出并描述了包括表面安装连接器的表面安装连接器和组件。 组件包括衬底和包括载体的连接器以及具有第一和第二端的至少一个电连接元件，其中第一端的至少一部分延伸穿过载体以将连接器电连接并物理地固定到衬底。 加强介质围绕表面安装连接器和所述基板的至少一部分设置。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.03 秒)