公开(公告)号：US5734672A

公开(公告)日：1998-03-31

申请号：US692600

申请日：1996-08-06

Applicant: Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

Inventor： Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

IPC: H01S3/094 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/06 ,  H01S5/068 ,  H01S5/22 ,  H01S5/40 ,  H01S3/19

CPC classification number: H01S5/4031 ,  H01S5/4025 ,  H01S5/0014 ,  H01S5/0021 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02407 ,  H01S5/02415 ,  H01S5/0617 ,  H01S5/06825 ,  H01S5/40

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract translation: 激光二极管阵列组件包括激光二极管阵列和与阵列整体封装的存储器件。 存储器件包括与阵列相关的操作信息。 存储设备可由主机外部操作系统访问，主机外部操作系统基于操作信息确定阵列的供电方式。 存储器件可以具有被写入的能力，使得外部操作系统可以在存储器件中记录诸如极端操作条件，操作故障以及阵列的准时或镜头计数等重大事件。 组件可以包括操作系统耦合到的传感器。 组件还可以包括处理装置，用于监测传感器并提供对外部操作系统的实时更新，使得激光二极管阵列以最佳方式连续供电。

公开(公告)号：US06307871B1

公开(公告)日：2001-10-23

申请号：US09270991

申请日：1999-03-17

Applicant: Geoffrey O. Heberle

Inventor： Geoffrey O. Heberle

IPC: H01S304

CPC classification number: F28F3/02 ,  F28D20/02 ,  F28D2021/0029 ,  F28F3/12 ,  H01S3/025 ,  H01S3/027 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0941 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02469 ,  H01S5/4025 ,  Y02E60/145

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase. This transition of the phase change material also provides a thermal buffer for laser components such that the phase change material absorbs the energy associated with fluctuations in ambient temperature before transferring it to the laser component. Also, the heat sink assembly can contain more than one type of phase change material, each having a different melting temperature.

Abstract translation: 阐述了一种用于产生高输出功率的被动冷却的固态激光系统。 该系统包括包含产生高功率激光束的激光头组件的光学台架组件。 激光介质散热器组件定位成与激光介质热连通，用于导电地耗散废热并控制激光介质的温度。 二极管阵列散热器组件定位成与激光二极管阵列组件热连通，用于导电地耗散余热并控制激光二极管阵列组件的温度。 散热器组件包括具有与相变材料紧密接触的延伸表面的热交换器。 当激光系统工作时，相变材料从固相转变为液相。 相变材料的这种转变还为激光组件提供热缓冲器，使得相变材料在将其转移到激光部件之前吸收与环境温度波动相关联的能量。 此外，散热器组件可以包含多于一种类型的相变材料，每种相变材料具有不同的熔化温度。

公开(公告)号：US06351478B1

公开(公告)日：2002-02-26

申请号：US09151851

申请日：1998-09-11

Applicant: Geoffrey O. Heberle

Inventor： Geoffrey O. Heberle

IPC: H01S304

CPC classification number: F28F3/12 ,  F28D20/02 ,  F28D2021/0029 ,  F28F3/02 ,  H01S3/025 ,  H01S3/027 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0941 ,  H01S5/02415 ,  H01S5/02469 ,  Y02E60/145

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase.

Abstract translation: 阐述了一种用于产生高输出功率的被动冷却的固态激光系统。 该系统包括包含产生高功率激光束的激光头组件的光学台架组件。 激光介质散热器组件定位成与激光介质热连通，用于导电地耗散废热并控制激光介质的温度。 二极管阵列散热器组件定位成与激光二极管阵列组件热连通，用于导电地耗散余热并控制激光二极管阵列组件的温度。 散热器组件包括具有与相变材料紧密接触的延伸表面的热交换器。 当激光系统工作时，相变材料从固相转变为液相。

公开(公告)号：US06272164B1

公开(公告)日：2001-08-07

申请号：US09691768

申请日：2000-10-18

Applicant: Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

Inventor： Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

IPC: H01S319

CPC classification number: H01S5/4031 ,  H01S5/0014 ,  H01S5/0021 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02407 ,  H01S5/02415 ,  H01S5/0617 ,  H01S5/06825 ,  H01S5/40 ,  H01S5/4025

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract translation: 激光二极管阵列组件包括激光二极管阵列和与阵列整体封装的存储器件。 存储器件包括与阵列相关的操作信息。 存储设备可由主机外部操作系统访问，主机外部操作系统基于操作信息确定阵列的供电方式。 存储器件可以具有被写入的能力，使得外部操作系统可以在存储器件中记录诸如极端操作条件，操作故障以及阵列的准时或镜头计数等重大事件。 组件可以包括操作系统耦合到的传感器。 组件还可以包括处理装置，用于监测传感器并提供对外部操作系统的实时更新，使得激光二极管阵列以最佳方式连续供电。

公开(公告)号：US06570895B2

公开(公告)日：2003-05-27

申请号：US09973027

申请日：2001-10-09

Applicant: Geoffrey O. Heberle

Inventor： Geoffrey O. Heberle

IPC: H01S304

CPC classification number: F28F3/02 ,  F28D20/02 ,  F28D2021/0029 ,  F28F3/12 ,  H01S3/025 ,  H01S3/027 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0941 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02469 ,  H01S5/4025 ,  Y02E60/145

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase. This transition of the phase change material also provides a thermal buffer for laser components such that the phase change material absorbs the energy associated with fluctuations in ambient temperature before transferring it to the laser component. Also, the heat sink assembly can contain more than one type of phase change material, each having a different melting temperature.

公开(公告)号：US06385226B2

公开(公告)日：2002-05-07

申请号：US09923754

申请日：2001-08-06

Applicant: Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

Inventor： Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

IPC: H01S319

CPC classification number: H01S5/4031 ,  H01S5/0014 ,  H01S5/0021 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02407 ,  H01S5/02415 ,  H01S5/0617 ,  H01S5/06825 ,  H01S5/40 ,  H01S5/4025

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that tie external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract translation: 激光二极管阵列组件包括激光二极管阵列和与阵列整体封装的存储器件。 存储器件包括与阵列相关的操作信息。 存储设备可由主机外部操作系统访问，主机外部操作系统基于操作信息确定阵列的供电方式。 存储器件可能具有写入能力，使得外部操作系统可以在存储器件中记录诸如极端操作条件，操作故障以及阵列的准时或镜头计数等重大事件。 组件可以包括操作系统耦合到的传感器。 组件还可以包括处理装置，用于监测传感器并提供对外部操作系统的实时更新，使得激光二极管阵列以最佳方式连续供电。

公开(公告)号：US06144684A

公开(公告)日：2000-11-07

申请号：US49579

申请日：1998-03-27

Applicant: Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

Inventor： Theodore S. McMinn ,  Dana A. Marshall ,  Michael A. Hope ,  Geoffrey O. Heberle

IPC: H01S3/094 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/06 ,  H01S5/068 ,  H01S5/22 ,  H01S5/40 ,  H01S3/19

CPC classification number: H01S5/4031 ,  H01S5/4025 ,  H01S5/0014 ,  H01S5/0021 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02407 ,  H01S5/02415 ,  H01S5/0617 ,  H01S5/06825 ,  H01S5/40

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract translation: 激光二极管阵列组件包括激光二极管阵列和与阵列整体封装的存储器件。 存储器件包括与阵列相关的操作信息。 存储设备可由主机外部操作系统访问，主机外部操作系统基于操作信息确定阵列的供电方式。 存储器件可以具有被写入的能力，使得外部操作系统可以在存储器件中记录诸如极端操作条件，操作故障以及阵列的准时或镜头计数等重大事件。 组件可以包括操作系统耦合到的传感器。 组件还可以包括处理装置，用于监测传感器并提供对外部操作系统的实时更新，使得激光二极管阵列以最佳方式连续供电。