Method for manufacturing an FET with asymmetrical gate region
    2.
    发明授权
    Method for manufacturing an FET with asymmetrical gate region 失效
    制造具有不对称栅极区域的FET的方法

    公开(公告)号:US5043294A

    公开(公告)日:1991-08-27

    申请号:US574106

    申请日:1990-08-29

    摘要: A method for manufacturing a field effect transistor having source and drain regions asymmetrically arranged relative to the gate region. A strip-shaped auxiliary layer is applied in the region of the gate. A first and second spacer are laterally fashioned along an auxillary layer, the first spacer is covered with a resist mask and the second spacer is subsequently etched away. The source metallization and the drain metallization are then applied, and a planarizing passivation layer is applied therebetween. This is followed by the application of connecting metallizations for the source, drain and gate regions.

    摘要翻译: 一种用于制造场效应晶体管的方法,该场效应晶体管具有相对于栅极区域非对称布置的源区和漏区。 在栅极的区域中施加带状辅助层。 第一和第二间隔物沿着辅助层横向形成,第一间隔物被抗蚀剂掩模覆盖,随后蚀刻掉第二间隔物。 然后施加源极金属化和漏极金属化,并且在其间施加平坦化钝化层。 接下来是应用用于源极,漏极和栅极区域的连接金属化。

    Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support
    3.
    发明申请
    Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support 有权
    用于冷却电气部件的冷却装置,由冷却装置和电气部件组成的模块以及包括冷却装置或模块和支撑件的组件

    公开(公告)号:US20050213304A1

    公开(公告)日:2005-09-29

    申请号:US10515279

    申请日:2003-05-09

    摘要: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.

    摘要翻译: 至少一个功率半导体部件由导电冷却剂流体的平坦的铜板式中空体冷却。 部件固定在中空体的一个平面表面上,另一个平面表面包括两个冷却剂流体开口,用于将冷却剂流体引入中空体并从中排出流体。 另一个平面表面是凹形的并且可在冷却剂流体开口之间弹性变形。 凹入的其他表面以支撑件的平坦表面附接到支撑体的均匀表面,使得凹面和均匀表面通过凹面的弹性平面变形而彼此压靠,并且冷却剂流体开口被密封在防流体 方式由O形圈。 将两个平坦侧表面互连的固体支柱另外构造在中空体中。 冷却装置可以用在包括支撑件和冷却装置或模块的模块或组件中。 该装置在电动传动装置中是有用的,特别是在机动车辆中。

    Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support
    6.
    发明授权
    Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support 有权
    用于冷却电气部件的冷却装置,包括冷却装置和电气部件的模块,以及冷却装置或模块和支撑件的组装

    公开(公告)号:US07187545B2

    公开(公告)日:2007-03-06

    申请号:US10515279

    申请日:2003-05-09

    IPC分类号: G06F1/16 H05K7/20

    摘要: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.

    摘要翻译: 至少一个功率半导体部件由导电冷却剂流体的平坦的铜板式中空体冷却。 部件固定在中空体的一个平面表面上,另一个平面表面包括两个冷却剂流体开口,用于将冷却剂流体引入中空体并从中排出流体。 另一个平面表面是凹形的并且可在冷却剂流体开口之间弹性变形。 凹入的其他表面以支撑件的平坦表面附接到支撑体的均匀表面,使得凹面和均匀表面通过凹面的弹性平面变形而彼此压靠,并且冷却剂流体开口被密封在防流体 方式由O形圈。 将两个平坦侧表面互连的固体支柱另外构造在中空体中。 冷却装置可以用在包括支撑件和冷却装置或模块的模块或组件中。 该装置在电动传动装置中是有用的,特别是在机动车辆中。

    Substrate for high-voltage modules
    7.
    发明授权
    Substrate for high-voltage modules 有权
    高压模块基板

    公开(公告)号:US06440574B2

    公开(公告)日:2002-08-27

    申请号:US09776948

    申请日:2001-02-05

    申请人: Guy Lefranc

    发明人: Guy Lefranc

    IPC分类号: B32B1504

    摘要: The substrate for high-voltage modules has a ceramic later with a first main side and a second main side opposite to the first main side. The ceramic layer has a first dielectric constant. A top metal layer is disposed on the first main side and a bottom metal layer is disposed on the second main side. To reduce field tips, a dielectric layer with a second dielectric constant borders the top metal layer and is disposed on the first main side of the ceramic layer. The density of the field lines on the edges of the voltage-conducting elements is thus attenuated so that the dielectric constants of the ceramic layer and the dielectric layer match each other.

    摘要翻译: 用于高电压模块的衬底具有稍后具有与第一主侧相对的第一主侧和第二主侧的陶瓷。 陶瓷层具有第一介电常数。 顶部金属层设置在第一主侧上,底部金属层设置在第二主侧。 为了减小场尖,具有第二介电常数的电介质层与顶部金属层相邻并且设置在陶瓷层的第一主侧上。 因此,导电元件边缘上的场线的密度被衰减,使得陶瓷层和电介质层的介电常数相互匹配。