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公开(公告)号：US09123509B2
公开(公告)日：2015-09-01
申请号：US13157005
申请日：2011-06-09
申请人： George D. Papasouliotis , Kamal Hadidi , Helen L. Maynard , Ludovic Godet , Vikram Singh , Timothy J. Miller , Bernard Lindsay
发明人： George D. Papasouliotis , Kamal Hadidi , Helen L. Maynard , Ludovic Godet , Vikram Singh , Timothy J. Miller , Bernard Lindsay
IPC分类号： H01J37/32
CPC分类号： H01J37/32146 , H01J37/32412 , H01J37/3244
摘要： Techniques for plasma processing a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a method comprising introducing a feed gas proximate to a plasma source, where the feed gas may comprise a first and second species, where the first and second species have different ionization energies; providing a multi-level RF power waveform to the plasma source, where the multi-level RF power waveform has at least a first power level during a first pulse duration and a second power level during a second pulse duration, where the second power level may be different from the first power level; ionizing the first species of the feed gas during the first pulse duration; ionizing the second species during the second pulse duration; and providing a bias to the substrate during the first pulse duration.
摘要翻译： 公开了用于等离子体处理衬底的技术。 在一个特定的示例性实施例中，该技术可以通过包括将进料气体接近等离子体源的方法来实现，其中进料气体可以包括第一和第二物质，其中第一和第二物质具有不同的电离能; 向所述等离子体源提供多级RF功率波形，其中所述多级RF功率波形在第一脉冲持续时间期间具有至少第一功率电平，并且在第二脉冲持续时间期间具有第二功率电平，其中所述第二功率电平可以 与第一功率水平不同; 在第一脉冲持续期间电离原料气体的第一种; 在第二脉冲期间电离第二物种; 以及在所述第一脉冲持续时间期间向所述衬底提供偏置。
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公开(公告)号：US20110086501A1
公开(公告)日：2011-04-14
申请号：US12902250
申请日：2010-10-12
IPC分类号： H01L21/30
CPC分类号： H01L21/2236 , H01J37/321 , H01J37/32706 , H01J37/32834 , H01L29/66803
摘要： A method of processing a substrate having horizontal and non-horizontal surfaces is disclosed. The substrate is implanted with particles using an ion implanter. During the ion implant, due to the nature of the implant process, a film may be deposited on the surfaces, wherein the thickness of this film is thicker on the horizontal surfaces. The presences of this film may adversely alter the properties of the substrate. To rectify this, a second process step is performed to remove the film deposited on the horizontal surfaces. In some embodiments, an etching process is used to remove this film. In some embodiments, a material modifying step is used to change the composition of the material comprising the film. This material modifying step may be instead of, or in addition to the etching process.
摘要翻译： 公开了一种处理具有水平和非水平表面的衬底的方法。 使用离子注入机将基片注入颗粒。 在离子注入期间，由于植入过程的性质，可以在表面上沉积膜，其中该膜的厚度在水平表面上更厚。 该膜的存在可能不利地改变基材的性质。 为了纠正这一点，执行第二处理步骤以去除沉积在水平表面上的膜。 在一些实施例中，使用蚀刻工艺去除该膜。 在一些实施方案中，材料修饰步骤用于改变包含该膜的材料的组成。 该材料修饰步骤可以代替或补充蚀刻工艺。
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公开(公告)号：US08679960B2
公开(公告)日：2014-03-25
申请号：US12902250
申请日：2010-10-12
IPC分类号： H01L21/425 , H01L21/38
CPC分类号： H01L21/2236 , H01J37/321 , H01J37/32706 , H01J37/32834 , H01L29/66803
摘要： A method of processing a substrate having horizontal and non-horizontal surfaces is disclosed. The substrate is implanted with particles using an ion implanter. During the ion implant, due to the nature of the implant process, a film may be deposited on the surfaces, wherein the thickness of this film is thicker on the horizontal surfaces. The presences of this film may adversely alter the properties of the substrate. To rectify this, a second process step is performed to remove the film deposited on the horizontal surfaces. In some embodiments, an etching process is used to remove this film. In some embodiments, a material modifying step is used to change the composition of the material comprising the film. This material modifying step may be instead of, or in addition to the etching process.
摘要翻译： 公开了一种处理具有水平和非水平表面的衬底的方法。 使用离子注入机将基片注入颗粒。 在离子注入期间，由于植入过程的性质，可以在表面上沉积膜，其中该膜的厚度在水平表面上更厚。 该膜的存在可能不利地改变基材的性质。 为了纠正这一点，执行第二处理步骤以去除沉积在水平表面上的膜。 在一些实施例中，使用蚀刻工艺去除该膜。 在一些实施方案中，材料修饰步骤用于改变包含该膜的材料的组成。 该材料修饰步骤可以代替或补充蚀刻工艺。
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4.发明申请公开(公告)号：US20110000896A1
公开(公告)日：2011-01-06
申请号：US12496080
申请日：2009-07-01
IPC分类号： H05H1/34 , H01L21/465
CPC分类号： C23C14/48 , H01J37/32412 , H01J37/32935
摘要： A method is disclosed for adjusting the composition of plasmas used in plasma doping, plasma deposition and plasma etching techniques. The disclosed method enables the plasma composition to be controlled by modifying the energy distribution of the electrons present in the plasma. Energetic electrons are produced in the plasma by accelerating electrons in the plasma using very fast voltage pulses. The pulses are long enough to influence the electrons, but too fast to affect the ions significantly. Collisions between the energetic electrons and the constituents of the plasma result in changes in the plasma composition. The plasma composition can then be optimized to meet the requirements of the specific process being used. This can entail changing the ratio of ion species in the plasma, changing the ratio of ionization to dissociation, or changing the excited state population of the plasma.
摘要翻译： 公开了一种用于调节用于等离子体掺杂，等离子体沉积和等离子体蚀刻技术的等离子体的组成的方法。 所公开的方法使得能够通过修改存在于等离子体中的电子的能量分布来控制等离子体组成。 通过使用非常快的电压脉冲加速等离子体中的电子，在等离子体中产生能量电子。 脉冲长度足以影响电子，但是太快而不能显着影响离子。 能量电子与等离子体成分之间的碰撞导致等离子体组成的变化。 然后可以优化等离子体组成以满足所使用的具体方法的要求。 这可能需要改变等离子体中的离子种类的比例，改变离子化与解离的比例，或改变等离子体的激发态群体。
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5.发明授权System and method for selectively controlling ion composition of ion sources 有权用于选择性地控制离子源的离子组成的系统和方法公开(公告)号：US08664561B2
公开(公告)日：2014-03-04
申请号：US12496080
申请日：2009-07-01
IPC分类号： B23K10/00
CPC分类号： C23C14/48 , H01J37/32412 , H01J37/32935
摘要： A method is disclosed for adjusting the composition of plasmas used in plasma doping, plasma deposition and plasma etching techniques. The disclosed method enables the plasma composition to be controlled by modifying the energy distribution of the electrons present in the plasma. Energetic electrons are produced in the plasma by accelerating electrons in the plasma using very fast voltage pulses. The pulses are long enough to influence the electrons, but too fast to affect the ions significantly. Collisions between the energetic electrons and the constituents of the plasma result in changes in the plasma composition. The plasma composition can then be optimized to meet the requirements of the specific process being used. This can entail changing the ratio of ion species in the plasma, changing the ratio of ionization to dissociation, or changing the excited state population of the plasma.
摘要翻译： 公开了一种用于调节用于等离子体掺杂，等离子体沉积和等离子体蚀刻技术的等离子体的组成的方法。 所公开的方法使得能够通过修改存在于等离子体中的电子的能量分布来控制等离子体组成。 通过使用非常快的电压脉冲加速等离子体中的电子，在等离子体中产生能量电子。 脉冲长度足以影响电子，但是太快而不能显着影响离子。 能量电子与等离子体成分之间的碰撞导致等离子体组成的变化。 然后可以优化等离子体组成以满足所使用的具体方法的要求。 这可能需要改变等离子体中的离子种类的比例，改变离子化与解离的比例，或改变等离子体的激发态群体。
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公开(公告)号：US20090061605A1
公开(公告)日：2009-03-05
申请号：US12267193
申请日：2008-11-07
申请人： Ludovic GODET , George D. Papasouliotis , Ziwei Fang , Richard Appel , Vincent Deno , Vikram Singh , Harold M. Persing
发明人： Ludovic GODET , George D. Papasouliotis , Ziwei Fang , Richard Appel , Vincent Deno , Vikram Singh , Harold M. Persing
IPC分类号： H01L21/265
CPC分类号： H01J37/3171 , H01J37/32412 , H01J37/32935 , H01J2237/31705 , H01L21/2236
摘要： A method to provide a dopant profile adjustment solution in plasma doping systems for meeting both concentration and junction depth requirements. Bias ramping and bias ramp rate adjusting may be performed to achieve a desired dopant profile so that surface peak dopant profiles and retrograde dopant profiles are realized. The method may include an amorphization step in one embodiment.
摘要翻译： 在等离子体掺杂系统中提供掺杂剂分布调整溶液以满足浓度和结深度要求的方法。 可以执行偏置斜坡调整和偏置斜率调整以实现期望的掺杂剂分布，从而实现表面峰值掺杂剂分布和逆向掺杂剂分布。 该方法可以包括在一个实施方案中的非晶化步骤。
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公开(公告)号：US07687787B2
公开(公告)日：2010-03-30
申请号：US12267193
申请日：2008-11-07
申请人： Ludovic Godet , George D. Papasouliotis , Ziwei Fang , Richard Appel , Vincent Deno , Vikram Singh , Harold M. Persing
发明人： Ludovic Godet , George D. Papasouliotis , Ziwei Fang , Richard Appel , Vincent Deno , Vikram Singh , Harold M. Persing
IPC分类号： H01J37/317 , H01L21/265 , H05H1/24
CPC分类号： H01J37/3171 , H01J37/32412 , H01J37/32935 , H01J2237/31705 , H01L21/2236
摘要： A method to provide a dopant profile adjustment solution in plasma doping systems for meeting both concentration and junction depth requirements. Bias ramping and bias ramp rate adjusting may be performed to achieve a desired dopant profile so that surface peak dopant profiles and retrograde dopant profiles are realized. The method may include an amorphization step in one embodiment.
摘要翻译： 在等离子体掺杂系统中提供掺杂剂分布调整溶液以满足浓度和结深度要求的方法。 可以执行偏置斜坡调整和偏置斜率调整以实现期望的掺杂剂分布，从而实现表面峰值掺杂剂分布和逆向掺杂剂分布。 该方法可以包括在一个实施方案中的非晶化步骤。
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8.发明申请PULSED DEPOSITION AND RECRYSTALLIZATION AND TANDEM SOLAR CELL DESIGN UTILIZING CRYSTALLIZED/AMORPHOUS MATERIAL 审中-公开脉冲沉积和再结晶和使用晶体/非晶材料的太阳能电池设计公开(公告)号：US20110039034A1
公开(公告)日：2011-02-17
申请号：US12538913
申请日：2009-08-11
CPC分类号： H01L21/0237 , H01L21/02381 , H01L21/0245 , H01L21/02505 , H01L21/0251 , H01L21/02532 , H01L21/0259 , H01L21/02667 , H01L21/2236 , H01L31/0725 , H01L31/182 , H01L31/1872 , Y02E10/546 , Y02P70/521
摘要： A method of depositing and crystallizing materials on a substrate is disclosed. In a particular embodiment, the method may include creating a plasma having deposition-related species and energy-carrying species. During a first time period, no bias voltage is applied to the substrate, and species are deposited on the substrate via plasma deposition. During a second time period, a voltage is applied to the substrate, which attracts ions to and into the deposited species, thereby causing the deposited layer to crystallize. This process can be repeated until an adequate thickness is achieved. In another embodiment, the bias voltage or bias pulse duration can be varied to change the amount of crystallization that occurs. In another embodiment, a dopant may be used to dope the deposited layers.
摘要翻译： 公开了一种在衬底上沉积和结晶材料的方法。 在特定实施例中，该方法可以包括产生具有沉积相关物质和能量携带物质的等离子体。 在第一时间段期间，没有偏置电压施加到衬底，并且通过等离子体沉积物质沉积在衬底上。 在第二时间段期间，向衬底施加电压，其将离子吸引到沉积的物质中，从而使沉积层结晶。 可以重复该过程，直到达到足够的厚度。 在另一个实施例中，可以改变偏置电压或偏置脉冲持续时间以改变发生的结晶量。 在另一个实施方案中，可以使用掺杂剂来掺杂沉积的层。
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9.发明申请Closed Loop Control And Process Optimization In Plasma Doping Processes Using A Time of Flight Ion Detector 有权使用飞行时间离子检测器的等离子体掺杂过程中的闭环控制和工艺优化公开(公告)号：US20090200461A1
公开(公告)日：2009-08-13
申请号：US12029710
申请日：2008-02-12
IPC分类号： B01D59/44
CPC分类号： C23C14/48 , C23C14/54 , H01J37/32412 , H01J37/32935 , H01J37/3299
摘要： A method of controlling a plasma doping process using a time-of-flight ion detector includes generating a plasma comprising dopant ions in a plasma chamber proximate to a platen supporting a substrate. The platen is biased with a bias voltage waveform having a negative potential that attracts ions in the plasma to the substrate for plasma doping. A spectrum of ions present in the plasma is measured as a function of ion mass with a time-of-flight ion detector. The total number ions impacting the substrate is measured with a Faraday dosimetry system. An implant profile is determined from the measured spectrum of ions. An integrated dose is determined from the measured total number of ions and the calculated implant profile. At least one plasma doping parameter is modified in response to the calculated integrated dose.
摘要翻译： 使用飞行时间离子检测器控制等离子体掺杂过程的方法包括在靠近支撑衬底的压板的等离子体室中产生包含掺杂剂离子的等离子体。 压板被具有负电位的偏压电压波形偏置，其将等离子体中的离子吸引到用于等离子体掺杂的衬底。 使用飞行时间离子检测器测量存在于等离子体中的离子的光谱作为离子质量的函数。 用法拉第剂量测定系统测量影响底物的总数离子。 从测量的离子光谱确定植入物轮廓。 从测量的离子总数和计算出的植入物轮廓确定综合剂量。 响应于计算的积分剂量修改至少一个等离子体掺杂参数。
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公开(公告)号：US20130075253A1
公开(公告)日：2013-03-28
申请号：US13245035
申请日：2011-09-26
CPC分类号： C23C14/564 , C23C16/4404 , H01J37/3171 , H01J37/32477 , H01J2237/0213 , H01J2237/08 , H01J2237/16
摘要： An improved plasma processing chamber is disclosed, wherein some or all of the components which are exposed to the plasma are made of, or coated with, titanium diborane. Titanium diborane has a hardness in excess of 9 mhos, making it less susceptible to sputtering. In addition, titanium diborane is resistant to fluoride and chlorine ions. Finally, titanium diborane is electrically conductive, and therefore the plasma remains more uniform over time, as charge does not build on the surfaces of the titanium diborane components. This results in improved workpiece processing, with less contaminants and greater uniformity. In other embodiments, titanium diborane may be used to line components within a beam line implanter.
摘要翻译： 公开了一种改进的等离子体处理室，其中暴露于等离子体的部分或全部组分由钛乙硼烷制成或涂覆。 钛乙硼烷的硬度超过9毫摩尔，使其不易溅射。 此外，乙硼烷钛耐氟化物和氯离子。 最后，乙硼烷钛是导电的，因此随着时间的推移，等离子体保持更均匀，因为电荷不会在钛二硼烷组分的表面上形成。 这导致改进的工件加工，更少的污染物和更大的均匀性。 在其它实施方案中，可以使用乙硼烷钛来在束线注入机内引导组分。
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