利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

62 条记录 (耗时 0.035 秒)

    Uniform emission LED package
    1.
    发明申请
    Uniform emission LED package 有权
    均匀排放LED封装

    公开(公告)号：US20070228387A1

    公开(公告)日：2007-10-04

    申请号：US11398214

    申请日：2006-04-04

    申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

    Reflector packages and methods for packaging of a semiconductor light emitting device
    2.
    发明申请
    Reflector packages and methods for packaging of a semiconductor light emitting device 有权
    用于封装半导体发光器件的反射器封装和方法

    公开(公告)号：US20050221518A1

    公开(公告)日：2005-10-06

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    Uniform emission LED package
    3.
    发明授权
    Uniform emission LED package 有权
    均匀排放LED封装

    公开(公告)号：US08969908B2

    公开(公告)日：2015-03-03

    申请号：US11398214

    申请日：2006-04-04

    申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/48

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

    Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
    4.
    发明申请
    Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension 有权

    公开(公告)号：US20060063289A1

    公开(公告)日：2006-03-23

    申请号：US10946587

    申请日：2004-09-21

    申请人： Gerald Negley ,  Michael Leung

    发明人： Gerald Negley ,  Michael Leung

    IPC分类号： H01L21/00

    CPC分类号： H01L33/501 ,  H01L2933/0041

    摘要： Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to cause the phosphor particles to deposit on at least a portion of the light emitting surface. A coating including phosphor particles is thereby formed on at least a portion of the light emitting surface. Particles other than phosphor also may be coated and solutions wherein particles are dissolved in solvent also may be used.

    PACKAGED LIGHT EMITTING DEVICES
    7.
    发明申请
    PACKAGED LIGHT EMITTING DEVICES 有权
    包装发光装置

    公开(公告)号：US20070290218A1

    公开(公告)日：2007-12-20

    申请号：US11849530

    申请日：2007-09-04

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
    8.
    发明申请
    Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension 有权
    通过从悬浮液中蒸发溶剂来涂覆半导体发光元件的方法

    公开(公告)号：US20070224716A1

    公开(公告)日：2007-09-27

    申请号：US11799702

    申请日：2007-05-01

    申请人： Gerald Negley ,  Michael Leung

    发明人： Gerald Negley ,  Michael Leung

    IPC分类号： H01L29/22 ,  H01L21/00

    CPC分类号： H01L33/501 ,  H01L2933/0041

    摘要： Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to cause the phosphor particles to deposit on at least a portion of the light emitting surface. A coating including phosphor particles is thereby formed on at least a portion of the light emitting surface. Particles other than phosphor also may be coated and solutions wherein particles are dissolved in solvent also may be used.

    摘要翻译： 半导体发光器件通过将包含悬浮在溶剂中的荧光体颗粒的悬浮液放置在半导体发光元件的发光表面的至少一部分上而蒸发至少一些溶剂以使荧光体颗粒沉积在 光发射表面的至少一部分。 由此，在发光面的至少一部分上形成包含荧光体粒子的涂层。 可以使用除荧光体之外的颗粒，也可以使用其中颗粒溶解在溶剂中的溶液。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME
    9.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME 审中-公开
    包含光传输元件的半导体发光器件及其封装方法

    公开(公告)号：US20120037931A1

    公开(公告)日：2012-02-16

    申请号：US13272731

    申请日：2011-10-13

    申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    IPC分类号： H01L33/08 ,  H01L33/60 ,  H01L33/50

    CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

    摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING A LUMINESCENT CONVERSION ELEMENT AND METHODS FOR PACKAGING THE SAME
    10.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING A LUMINESCENT CONVERSION ELEMENT AND METHODS FOR PACKAGING THE SAME 有权
    包含发光变换元件的半导体发光器件及其封装方法

    公开(公告)号：US20090224277A1

    公开(公告)日：2009-09-10

    申请号：US12398626

    申请日：2009-03-05

    申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    IPC分类号： H01L33/00 ,  H01L21/66

    CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

    摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 空腔中的第一量的密封剂材料被处理以形成具有选定形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。