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公开(公告)号：US5349743A
公开(公告)日：1994-09-27
申请号：US695653
申请日：1991-05-02
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902
摘要： Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic mataerial to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
摘要翻译： 使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。 这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。 通过导电通孔，通过多层结构连接的丝网印刷导体形成绕线。
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公开(公告)号：US5479695A
公开(公告)日：1996-01-02
申请号：US270197
申请日：1994-07-01
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902
摘要： Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic material to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
摘要翻译： 使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。 这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料，以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。 通过导电通孔，通过多层结构连接的丝网印刷导体形成绕线。
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公开(公告)号：US5389428A
公开(公告)日：1995-02-14
申请号：US987515
申请日：1992-12-08
申请人： Debra A. Fleming , Gideon S. Grader , David W. Johnson, Jr. , Henry M. O'Bryan, Jr. , Warren W. Rhodes
发明人： Debra A. Fleming , Gideon S. Grader , David W. Johnson, Jr. , Henry M. O'Bryan, Jr. , Warren W. Rhodes
IPC分类号： C04B35/622 , C04B35/26 , C04B41/87 , H01F17/00 , H01F17/04 , H01F27/02 , H01F41/16 , H01G4/12 , H01F41/02
CPC分类号： H01F17/0033 , H01F17/0013 , H01F17/04 , H01F27/027 , H01F41/16 , H01F2017/048 , Y10S428/90 , Y10T428/24917
摘要： This invention is predicated upon applicants' discovery that conventional techniques for minimizing metal loss from sintered ceramic materials are not adequate in the fabrication of small ceramic components such as multilayer monolithic magnetic devices wherein a magnetic core is substantially surrounded by an insulating housing. Applicants have determined that this metal loss problem can be solved by providing the component with a housing layer having an appropriate concentration of metal. Specifically, if the insulating housing material around the magnetic core has, during the high temperature firing, the same partial pressure of metal as the magnetic core material, there is no net loss of metal from the core. In a preferred embodiment, loss of zinc from a MnZn ferrite core is compensated by providing a housing of NiZn ferrite or zinc aluminate with appropriate Zn concentrations. Similar considerations apply to other ceramic components.
摘要翻译： 本发明基于申请人的发现，用于最小化烧结陶瓷材料的金属损耗的常规技术在制造小型陶瓷部件如多层单片磁性器件中是不够的，其中磁芯基本上被绝缘壳体包围。 申请人已经确定，通过为组件提供具有适当浓度金属的容纳层，可以解决该金属损失问题。 具体来说，如果磁芯周围的绝缘壳体材料在高温烧成时具有与磁心材料相同的金属分压，则不存在来自芯的金属的净损耗。 在优选的实施方案中，通过提供具有合适的Zn浓度的NiZn铁氧体或铝酸锌的壳体来补偿来自MnZn铁氧体磁心的锌的损失。 类似的考虑也适用于其他陶瓷组件。
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公开(公告)号：US06716488B2
公开(公告)日：2004-04-06
申请号：US09887938
申请日：2001-06-22
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , John Thomson, Jr. , Robert Bruce Van Dover
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , John Thomson, Jr. , Robert Bruce Van Dover
IPC分类号： H01F100
CPC分类号： H01F41/24 , B82Y30/00 , C03C17/25 , C03C2217/216 , C03C2217/217 , C03C2217/23 , C04B41/009 , C04B41/5036 , C04B41/87 , C04B2111/00422 , C04B41/4543 , C04B41/455 , C04B35/10
摘要： A ferrite layer formation process that may be performed at a lower temperature than conventional ferrite formation processes. The formation process may produce highly anisotropic structures. A ferrite layer is deposited on a substrate while the substrate is exposed to a magnetic field. An intermediate layer may be positioned between the substrate and the ferrite to promote bonding of the ferrite to the substrate. The process may be performed at temperatures less than 300° C. Ferrite film anisotropy may be achieved by embodiments of the invention in the range of about 1000 dyn-cm/cm3 to about 2×106 dyn-cm/cm3.
摘要翻译： 可以在比常规铁素体形成工艺更低的温度下进行的铁素体层形成工艺。 形成过程可能产生高度各向异性的结构。 在衬底暴露于磁场的同时，在衬底上沉积铁素体层。 中间层可以位于基底和铁素体之间，以促进铁素体与基底的结合。 该方法可以在低于300℃的温度下进行。铁氧体膜各向异性可以通过本发明的实施方案在约1000dyncm -1 / cm 3至约2×10 6 dyn-cm / cm 3的范围内实现。 3>。
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公开(公告)号：US6153078A
公开(公告)日：2000-11-28
申请号：US369105
申请日：1999-08-05
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
CPC分类号： C25D7/001 , C25D5/022 , H01F41/043 , H01F41/046 , H01F41/16 , H01F17/0033
摘要： The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
摘要翻译： 本发明提供了一种用于制造包含金属化磁性陶瓷材料的器件的改进方法，例如电感器，变压器和磁性衬底。 特别地，在本发明的方法中使用的唯一的通孔允许仅通过单个通孔涂覆步骤从多个未烧制的铁氧体层制造器件，从而避免了需要大量的冲压步骤。 此外，不需要扩大通孔的尺寸，因此不需要内部金属化。 因此，本发明以比当前方法更快，更不复杂和更可靠的方式提供诸如电感器，变压器和磁性基板的器件的绿色带状制造。 本发明还涉及在这种方法中使用改进的导电材料，所述导电材料含有银/钯颗粒，铁氧体颗粒，纤维素基或其它有机粘合剂和溶剂。 在其上涂覆有油墨的基材烧制之后，并通过焦磷酸铜浴将铜镀覆在其上，镀铜显示出大于约4kpsi的拉伸强度，有利地大于约5kpsi。 使用焦磷酸铜浴还可以在长而窄的通孔内均匀镀覆。
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公开(公告)号：US6007758A
公开(公告)日：1999-12-28
申请号：US21500
申请日：1998-02-10
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
IPC分类号： C25D5/02 , C25D7/00 , H01F17/00 , H01F41/04 , H01F41/16 , H05K1/16 , H05K3/42 , H05K3/46 , B29C65/02
CPC分类号： C25D7/001 , C25D5/022 , H01F41/043 , H01F41/046 , H01F41/16 , H01F17/0033
摘要： The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
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