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    Flexible circuit board having enhanced bending durability and method for preparing same
    1.
    发明授权
    Flexible circuit board having enhanced bending durability and method for preparing same 有权

    公开(公告)号：US10561015B2

    公开(公告)日：2020-02-11

    申请号：US16375947

    申请日：2019-04-05

    Applicant: GigaLane Co., Ltd.

    Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

    IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

    Printed circuit board including linking extended contact pad
    3.
    发明授权
    Printed circuit board including linking extended contact pad 有权
    印刷电路板，包括连接扩展接触垫

    公开(公告)号：US09532446B2

    公开(公告)日：2016-12-27

    申请号：US14172187

    申请日：2014-02-04

    Applicant: GIGALANE CO., LTD.

    Inventor： Kyung Hun Jung ,  Ik Soo Kim ,  Yuck Hwan Jeon ,  Hee Seok Jung ,  Hwang Sub Koo ,  Hyun Je Kim

    IPC: H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/025 ,  H05K1/0242 ,  H05K1/0393

    Abstract: A printed circuit board (PCB) used as a signal transmission line of a terminal, comprising a first ground layer elongating in one direction, a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer, a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer, a ground pad elongating from one end of the first ground layer and in contact with an external ground, and a signal line pad extended from one end of the signal transmission line and in contact with an external signal line.

    Abstract translation: 一种用作端子的信号传输线的印刷电路板（PCB），包括沿一个方向延伸的第一接地层，沉积在第一接地层的顶部上并沿与第一接地相同的方向延伸的第一介电层 层，沉积在第一介电层的顶部并沿与第一介电层相同的方向延伸的信号传输线，从第一接地层的一端延伸并与外部接地接触的接地焊盘， 线焊盘从信号传输线的一端延伸并与外部信号线接触。

    Flexible circuit board having enhanced bending durability and method for preparing same
    4.
    发明授权
    Flexible circuit board having enhanced bending durability and method for preparing same 有权

    公开(公告)号：US10750612B2

    公开(公告)日：2020-08-18

    申请号：US16375944

    申请日：2019-04-05

    Applicant: GigaLane Co., Ltd.

    Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

    IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

    Flexible circuit board having enhanced bending durability and method for preparing same
    5.
    发明授权
    Flexible circuit board having enhanced bending durability and method for preparing same 有权

    公开(公告)号：US10356895B2

    公开(公告)日：2019-07-16

    申请号：US15923070

    申请日：2018-03-16

    Applicant: GigaLane Co., Ltd.

    Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

    IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

    FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHOD FOR PREPARING SAME
    8.
    发明申请
    FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHOD FOR PREPARING SAME 审中-公开

    公开(公告)号：US20190239343A1

    公开(公告)日：2019-08-01

    申请号：US16375944

    申请日：2019-04-05

    Applicant: GigaLane Co., Ltd.

    Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K3/06 ,  H05K3/28 ,  H05K1/11

    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

    Flexible circuit board having three-layer dielectric body and four-layer ground layer structure
    9.
    发明授权
    Flexible circuit board having three-layer dielectric body and four-layer ground layer structure 有权

    公开(公告)号：US10362675B2

    公开(公告)日：2019-07-23

    申请号：US15923048

    申请日：2018-03-16

    Applicant: GigaLane Co., Ltd.

    Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K1/03 ,  H05K3/46

    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.

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