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公开(公告)号:US06443179B1
公开(公告)日:2002-09-03
申请号:US09790423
申请日:2001-02-21
申请人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
发明人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
IPC分类号: F16K2700
CPC分类号: F16K99/0001 , B01L3/502707 , B01L2200/021 , B01L2300/0636 , B01L2300/0867 , B01L2300/0874 , B01L2300/0887 , F15C5/00 , F16K99/0042 , F16K2099/0074 , F16K2099/0076 , F16K2099/008 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/8592 , H01L2924/01004 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , Y10T137/7504 , Y10T137/87249 , H01L2924/00014 , H01L2924/00
摘要: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译: 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装,从宏观尺度(微升)将流体带入设备规模(皮升)。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器(例如Fluidic Printed Wiring Board)组成。 嵌入式通道连接到较小的封装,即将微流体集成电路(MIC)引入流体的电 - 微流体双列直插封装(EMDIP)。 通过博世蚀刻的孔将流体连接制成MIC的背面,该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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公开(公告)号:US06821819B1
公开(公告)日:2004-11-23
申请号:US10370543
申请日:2003-02-20
申请人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号: H01L2144
CPC分类号: H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译: 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装,从宏观尺度(微升)将流体带入设备规模(皮升)。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器(例如Fluidic Printed Wiring Board)组成。 嵌入式通道连接到较小的封装,即将微流体集成电路(MIC)引入流体的电 - 微流体双列直插封装(EMDIP)。 通过博世蚀刻的孔将流体连接制成MIC的背面,该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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公开(公告)号:US06548895B1
公开(公告)日:2003-04-15
申请号:US09790305
申请日:2001-02-21
申请人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人: Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号: H01L2348
CPC分类号: H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译: 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装,从宏观尺度(微升)将流体带入设备规模(皮升)。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器(例如Fluidic Printed Wiring Board)组成。 嵌入式通道连接到较小的封装,即将微流体集成电路(MIC)引入流体的电 - 微流体双列直插封装(EMDIP)。 通过博世蚀刻的孔将流体连接制成MIC的背面,该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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