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公开(公告)号：US06443179B1
公开(公告)日：2002-09-03
申请号：US09790423
申请日：2001-02-21
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
IPC分类号： F16K2700
CPC分类号： F16K99/0001 , B01L3/502707 , B01L2200/021 , B01L2300/0636 , B01L2300/0867 , B01L2300/0874 , B01L2300/0887 , F15C5/00 , F16K99/0042 , F16K2099/0074 , F16K2099/0076 , F16K2099/008 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/8592 , H01L2924/01004 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , Y10T137/7504 , Y10T137/87249 , H01L2924/00014 , H01L2924/00
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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公开(公告)号：US06821819B1
公开(公告)日：2004-11-23
申请号：US10370543
申请日：2003-02-20
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号： H01L2144
CPC分类号： H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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公开(公告)号：US06548895B1
公开(公告)日：2003-04-15
申请号：US09790305
申请日：2001-02-21
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号： H01L2348
CPC分类号： H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。
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公开(公告)号：US07004198B1
公开(公告)日：2006-02-28
申请号：US10894636
申请日：2004-07-20
IPC分类号： F16K37/00
CPC分类号： B01L3/565 , B01J2219/00783 , B01J2219/0081 , B01J2219/00828 , B01L3/5027 , B01L9/527 , B01L2200/027 , B01L2300/0816 , Y10T137/2191 , Y10T137/2224 , Y10T137/8242
摘要： An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm×6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.
摘要翻译： 提出了一种用于同时对准和互连微流体端口的装置。 需要这种互连来利用在微机电系统（MEMS）技术中制造的微流体装置，其在小占地面积内（例如3mm×6mm）具有多个流体通路口（例如100微米直径）。 微流体装置的小端口到较大直径（例如500微米）的扇出促进微流体装置与印刷线路板，电子封装，流体歧管等的封装和互连。
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公开(公告)号：US06886916B1
公开(公告)日：2005-05-03
申请号：US10600008
申请日：2003-06-18
CPC分类号： B41J2/14314
摘要： A surface-micromachined fluid-ejection apparatus is disclosed which utilizes a piston to provide for the ejection of jets or drops of a fluid (e.g. for ink-jet printing). The piston, which is located at least partially inside a fluid reservoir, is moveable into a cylindrical fluid-ejection chamber connected to the reservoir by a microelectromechanical (MEM) actuator which is located outside the reservoir. In this way, the reservoir and fluid-ejection chamber can be maintained as electric-field-free regions thereby allowing the apparatus to be used with fluids that are electrically conductive or which may react or break down in the presence of a high electric field. The MEM actuator can comprise either an electrostatic actuator or a thermal actuator.
摘要翻译： 公开了一种表面微机械流体喷射装置，其利用活塞来提供喷射或液滴的喷射（例如用于喷墨打印）。 至少部分地位于流体储存器内部的活塞可通过位于储存器外部的微机电（MEM）致动器移动到连接到储存器的圆柱形流体排出室中。 以这种方式，储存器和流体喷射室可以保持为无电场区域，从而允许该装置与导电的流体一起使用或者可能在存在高电场的情况下反应或分解。 MEM致动器可以包括静电致动器或热致动器。
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公开(公告)号：US06675671B1
公开(公告)日：2004-01-13
申请号：US10153109
申请日：2002-05-22
IPC分类号： B25J700
CPC分类号： B81C99/002 , B23Q1/5462 , B23Q1/5468 , B25J7/00 , B25J9/1065 , Y10T74/20354
摘要： A multiple degree of freedom platform assembly formed from a plurality of thin films on a substrate can, when activated, move out of the plane of the substrate without additional manufacturing steps. The platform is connected to the substrate by at least three linkages, each linkage being pivotally connected to the platform and the base. At least two of the base connections are to powered traveling devices that are manufactured at one end of a path and which may be moved to locations along the path to cause the platform to move to predetermined positions. The entire assembly, including hinges, is manufactured as planar structures; preferably by a thin film technology such as MEMS.
摘要翻译： 由基板上的多个薄膜形成的多自由度平台组件可以在被激活时从衬底的平面移出而不需要额外的制造步骤。 平台通过至少三个连杆连接到基板，每个连杆枢转地连接到平台和基座。 至少两个基座连接件是在路径的一端制造的动力行进装置，其可沿着路径移动到位置以使平台移动到预定位置。 整个组件，包括铰链，被制造为平面结构; 优选通过诸如MEMS的薄膜技术。
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公开(公告)号：US06234703B1
公开(公告)日：2001-05-22
申请号：US09336308
申请日：1999-06-18
IPC分类号： F16C1106
CPC分类号： F16M11/14 , F16C11/0619 , F16C11/0623 , Y10T403/32573 , Y10T403/32655 , Y10T403/32803
摘要： A new class of spherical joints is disclosed. These spherical joints are capable of extremely large angular displacements (full cone angles in excess of 270°), while exhibiting no singularities or dead spots in their range of motion. These joints can improve or simplify a wide range of mechanical devices.
摘要翻译： 公开了一类新的球形接头。 这些球形接头能够具有非常大的角位移（全锥角超过270°），同时在其运动范围内不显示奇异点或死点。 这些接头可以改善或简化宽范围的机械装置。
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公开(公告)号：US5747915A
公开(公告)日：1998-05-05
申请号：US699279
申请日：1996-08-19
申请人： Gilbert L. Benavides
发明人： Gilbert L. Benavides
CPC分类号： H02N2/105
摘要： A nonelectromagnetic motor comprising a base, a bent shaft which is rotable relative to the base wherein the bent shaft comprises a straight portion aligned with a main axis and an offset portion that is offset with respect to the main axis; and a drive means for driving the offset portion of the bent shaft along a generally circular path in a plane perpendicular to the main axis to rotate the bent shaft. The bent shaft and drive means for driving the bent shaft can be selected from piezoelectric, magnetostrictive, rheological and shape memory alloys. The drive means of the nonelectromagnetic motor can additionally comprise a shell which shell surrounds and houses the bent shaft and precesses or gyrates which in turn causes the bent drive shaft to rotate. The nonelectromagnetic motor does not rely on friction for the application of torque upon a rotor.
摘要翻译： 一种非磁性电动机，包括基座，相对于基座可旋转的弯曲轴，其中所述弯曲轴包括与主轴对准的直线部分和相对于所述主轴线偏移的偏移部分; 以及驱动装置，用于沿垂直于主轴线的平面中的大致圆形路径驱动弯曲轴的偏移部分，以旋转弯曲的轴。 用于驱动弯曲轴的弯曲轴和驱动装置可以选自压电，磁致伸缩，流变和形状记忆合金。 非磁性电动机的驱动装置可以另外包括壳体，壳体围绕并容纳弯曲的轴并且进入或旋转，这又导致弯曲的驱动轴旋转。 非磁性马达不依赖于在转子上施加扭矩的摩擦力。
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公开(公告)号：US06409413B1
公开(公告)日：2002-06-25
申请号：US09336182
申请日：1999-06-18
IPC分类号： F16C1106
CPC分类号： F16C11/0619 , Y10T403/32565 , Y10T403/32573 , Y10T403/32631
摘要： A new class of spherical joints has a very large accessible full cone angle, a property which is beneficial for a wide range of applications. Despite the large cone angles, these joints move freely without singularities.
摘要翻译： 一类新的球形接头具有非常大的可接近的全锥角，这种特性有利于广泛的应用。 尽管锥角大，但这些关节自由移动而没有奇点。
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公开(公告)号：US5626040A
公开(公告)日：1997-05-06
申请号：US277100
申请日：1994-07-20
申请人： Gilbert L. Benavides
发明人： Gilbert L. Benavides
CPC分类号： E05B37/20 , A63F9/0078 , Y10T70/7169 , Y10T70/7175
摘要： A discriminator apparatus and method that discriminates between a unique signal and any other (incorrect) signal. The unique signal is a sequence of events; each event can assume one of two possible event states. Given the unique signal, a maze wheel is allowed to rotate fully in one direction. Given an incorrect signal, both the maze wheel and a pin wheel lock in position.
摘要翻译： 鉴别器装置和方法，用于鉴别唯一信号和任何其它（不正确）信号。 唯一的信号是一系列事件; 每个事件可以采取两种可能的事件状态之一。 给定独特的信号，允许迷宫轮在一个方向上完全旋转。 给定一个不正确的信号，迷宫轮和一个针轮锁定就位。
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