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公开(公告)号:US08633403B2
公开(公告)日:2014-01-21
申请号:US13270421
申请日:2011-10-11
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
IPC分类号: H05K9/00
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号:US08881387B2
公开(公告)日:2014-11-11
申请号:US13270448
申请日:2011-10-11
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译: 这涉及用于屏蔽电子设备的电路区域的干扰(例如,EMI)的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来,可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中,导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中,导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号:US20120024588A1
公开(公告)日:2012-02-02
申请号:US13270421
申请日:2011-10-11
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC分类号: H05K9/00
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号:US20100224401A1
公开(公告)日:2010-09-09
申请号:US12397922
申请日:2009-03-04
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译: 这涉及用于屏蔽电子设备的电路区域的干扰(例如,EMI)的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来,可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中,导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中,导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号:US20120023743A1
公开(公告)日:2012-02-02
申请号:US13270448
申请日:2011-10-11
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC分类号: H01R43/00
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译: 这涉及用于屏蔽电子设备的电路区域的干扰(例如,EMI)的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来,可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中,导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中,导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号:US08071893B2
公开(公告)日:2011-12-06
申请号:US12397922
申请日:2009-03-04
申请人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译: 这涉及用于屏蔽电子设备的电路区域的干扰(例如,EMI)的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来,可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中,导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中,导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号:US20170332070A1
公开(公告)日:2017-11-16
申请号:US15154809
申请日:2016-05-13
申请人: Igor Markovsky , Michael Nikkhoo
发明人: Igor Markovsky , Michael Nikkhoo
CPC分类号: H04N13/341 , G02B27/017 , G02B27/0172 , G02B2027/0134 , G02B2027/0136 , G02B2027/0178
摘要: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.
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公开(公告)号:US20160209660A1
公开(公告)日:2016-07-21
申请号:US14601097
申请日:2015-01-20
申请人: Michael Nikkhoo , Erin Hurbi
发明人: Michael Nikkhoo , Erin Hurbi
CPC分类号: G02B27/0176 , B29D12/02 , G02B6/0085 , G02B27/017 , G02B2027/0178
摘要: A passive thermal heat-pipe material comprising an optical mounting structure including heat producing electronic components is provided. Each structural component of the optical mounting structure may be at least partially comprised of a polymer including a plurality of carbon nanoparticles. In a further aspect, a method of creating an optical structure adapted to support a plurality of heat emitting components is provided. The method includes adding a percentage by concentration of carbon nanoparticles to a polymer base material, mixing the polymer base material and carbon nanoparticles uniformly, melting the mixture at high temperature, forming the melted mixture into a component of the optical structure, and cooling the formed component to solidify the component. The percentage may be between 2 and 10 percent.
摘要翻译: 提供了一种包括包括发热电子部件的光学安装结构的被动热管材。 光学安装结构的每个结构部件可以至少部分地由包括多个碳纳米颗粒的聚合物组成。 在另一方面,提供了一种创建适于支撑多个发热部件的光学结构的方法。 该方法包括将碳纳米颗粒的浓度百分比加入到聚合物基材中,均匀混合聚合物基材和碳纳米颗粒,在高温下熔融混合物,将熔融混合物形成为光学结构的组分,并冷却形成 组分固化组分。 百分比可能在2%到10%之间。
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公开(公告)号:US20170176116A1
公开(公告)日:2017-06-22
申请号:US14975676
申请日:2015-12-18
申请人: Renee Wu , Michael Nikkhoo
发明人: Renee Wu , Michael Nikkhoo
CPC分类号: F28F21/02 , B23P15/26 , F28F21/065 , H01L23/3737 , H01L23/42 , H01L23/552
摘要: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.
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公开(公告)号:US20160381832A1
公开(公告)日:2016-12-29
申请号:US14754483
申请日:2015-06-29
申请人: Erin Hurbi , Michael Nikkhoo , Douglas L. Heirich
发明人: Erin Hurbi , Michael Nikkhoo , Douglas L. Heirich
CPC分类号: H05K7/20509 , B23P15/26 , B23P2700/10 , F28D2021/0028 , F28F21/02 , F28F2013/001 , F28F2255/00 , G02B27/0176 , H01L23/373 , H01L23/3733
摘要: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.
摘要翻译: 本文公开了一种构造成将热量从热源传导到散热器的热导管和形成所述导管的方法。 热导管可以包括由各向异性导热材料形成的多个堆叠片材,其非限制性实例是石墨,每个片材具有相应的导热取向。 多个片材的热传导取向可以在层叠方向上逐步变化,形成弯曲的热流路径。
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