公开(公告)号：US08633403B2

公开(公告)日：2014-01-21

申请号：US13270421

申请日：2011-10-11

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mahammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mahammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H05K9/00

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

公开(公告)号：US20120023743A1

公开(公告)日：2012-02-02

申请号：US13270448

申请日：2011-10-11

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H01R43/00

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。

公开(公告)号：US08071893B2

公开(公告)日：2011-12-06

申请号：US12397922

申请日：2009-03-04

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H05K9/00 ,  H01L23/28

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。

公开(公告)号：US08881387B2

公开(公告)日：2014-11-11

申请号：US13270448

申请日：2011-10-11

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H05K3/30 ,  H05K3/28 ,  H05K9/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/24 ,  H05K3/12

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。

公开(公告)号：US20120024588A1

公开(公告)日：2012-02-02

申请号：US13270421

申请日：2011-10-11

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H05K9/00

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

公开(公告)号：US20100224401A1

公开(公告)日：2010-09-09

申请号：US12397922

申请日：2009-03-04

申请人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

发明人： Gloria Lin ,  Wyeman Chen ,  Michael Nikkhoo ,  Michael Rosenblatt ,  Hammid Mohammadinia ,  Ziv Wolkowicki ,  Amir Salehi

IPC分类号： H05K9/00 ,  H05K13/00

CPC分类号： H05K9/0024 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/1241 ,  H05K3/245 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49171

摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。

公开(公告)号：US20110255250A1

公开(公告)日：2011-10-20

申请号：US12794599

申请日：2010-06-04

申请人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

发明人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

IPC分类号： H05K1/14 ,  F16B37/00 ,  F16B39/02 ,  H05K1/00 ,  H05K1/11

CPC分类号： H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

摘要翻译： 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。

公开(公告)号：US20130125392A1

公开(公告)日：2013-05-23

申请号：US13298818

申请日：2011-11-17

申请人： Dennis R. Pyper ,  Hong Wang ,  Wyeman Chen

发明人： Dennis R. Pyper ,  Hong Wang ,  Wyeman Chen

IPC分类号： H05K3/30

CPC分类号： H05K1/0269 ,  H05K3/1216 ,  H05K3/303 ,  H05K3/3484 ,  H05K2201/09918 ,  Y02P70/613 ,  Y10T29/49133

摘要： A printed circuit board may have patterned traces. Components may be mounted to the printed circuit board using solder. Solder paste may be printed onto the printed circuit board using a stencil. Following reflow operations, the solder paste may form solder bumps that connect component leads to traces on the printed circuit board. Misalignment between the mounted components and printed circuit board traces can be minimized by forming fiducials from solder paste. During the process of printing solder paste patterns on the printed circuit board, solder paste printing equipment may form the solder paste fiducials. Component mounting equipment may use cameras or other imaging equipment to gather information on the location of the solder paste fiducials. The component mounting equipment may then mount the components on the printed circuit using the information on the location of the solder paste fiducials.

摘要翻译： 印刷电路板可以具有图案迹线。 组件可以使用焊料安装到印刷电路板。 可以使用模板将焊膏印刷到印刷电路板上。 在回流操作之后，焊膏可以形成将组件引线连接到印刷电路板上的迹线的焊料凸块。 通过从焊膏形成基准，可以最小化安装部件和印刷电路板走线之间的对准。 在印刷电路板上印刷焊膏图案的过程中，焊膏印刷设备可能形成焊膏基准。 组件安装设备可以使用相机或其他成像设备来收集有关焊膏基准点位置的信息。 然后，部件安装设备可以使用关于焊膏基准的位置的信息将组件安装在印刷电路板上。