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公开(公告)号：US20170332070A1
公开(公告)日：2017-11-16
申请号：US15154809
申请日：2016-05-13
Applicant: Igor Markovsky , Michael Nikkhoo
Inventor： Igor Markovsky , Michael Nikkhoo
CPC classification number: H04N13/341 , G02B27/017 , G02B27/0172 , G02B2027/0134 , G02B2027/0136 , G02B2027/0178
Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.
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公开(公告)号：US09726962B1
公开(公告)日：2017-08-08
申请号：US15143362
申请日：2016-04-29
Applicant: Ravi Nalla , Michael Nikkhoo , Igor Markovsky
Inventor： Ravi Nalla , Michael Nikkhoo , Igor Markovsky
IPC: G03B17/56
CPC classification number: G03B17/561 , F16M13/00
Abstract: The techniques disclosed herein provide an enhanced mount for a camera module. The mount comprises at least a first side and a second side. The sides are formed to enable contact with at least a portion of the camera module. The sides are configured with openings to enable a fastening material, such as an adhesive, to secure the camera module to the mount. Openings within the mount enable the use of a fastening material to secure the camera module to at least one surface of the mount while allowing the camera module and at least one surface to maintain the mechanical contact. In some configurations, one or more openings are formed such that a contraction of the fastening material pulls the camera module toward at least one surface of the mount.
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公开(公告)号：US20160375600A1
公开(公告)日：2016-12-29
申请号：US14754505
申请日：2015-06-29
Applicant: Igor Markovsky , Michael Nikkhoo , Scott Francis Fullam
Inventor： Igor Markovsky , Michael Nikkhoo , Scott Francis Fullam
IPC: B26D7/10
CPC classification number: B26D7/10
Abstract: Examples are disclosed that relate to heat-based cutting of an adhesive joint of a device. One disclosed example provides a device, comprising an adhesive joint connecting a first component and a second component via an adhesive layer, and a cutting affordance incorporated within the device and positioned within the adhesive joint or adjacent the adhesive joint.
Abstract translation: 公开了与装置的粘合剂接头的热基切割有关的实例。 一个公开的示例提供了一种装置，其包括通过粘合剂层连接第一部件和第二部件的粘合剂接合件，以及结合在该装置内并定位在粘合剂接合部内或邻近粘合剂接头的切割加工件。
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公开(公告)号：US20170343418A1
公开(公告)日：2017-11-30
申请号：US15167888
申请日：2016-05-27
Applicant: Erin Hurbi , Michael Nikkhoo , Igor Markovsky , Shahar Ben-Menahem
Inventor： Erin Hurbi , Michael Nikkhoo , Igor Markovsky , Shahar Ben-Menahem
CPC classification number: G01J5/10 , G01J5/0096 , G01J5/025 , G01J5/061 , G01J5/522 , G01J5/524 , G01J2005/0048 , G01J2005/0077 , G01N21/93 , G01N25/72 , H04N5/33 , H04N17/002
Abstract: An apparatus including a palette body, a plurality of heat distribution plates mounted on the body and positioned adjacent each other, a plurality of insulators positioned intermediate the adjacently positioned heat distribution plates, and a plurality of thermal camera calibration reference swatches including a near-ideal blackbody reference swatch, a diffuse reflective reference swatch, and a first material of the device under testing reference swatch, each reference swatch being mounted on a corresponding one of the heat distribution plates and thermally insulated from other reference swatches by the insulators.
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公开(公告)号：US20160381790A1
公开(公告)日：2016-12-29
申请号：US14754413
申请日：2015-06-29
Applicant: Igor Markovsky , Michael Nikkhoo , Andriy Pletenetskyy , Erin Hurbi
Inventor： Igor Markovsky , Michael Nikkhoo , Andriy Pletenetskyy , Erin Hurbi
CPC classification number: H05K1/0284 , G02B27/0172 , G02B2027/0174 , G02B2027/0178 , G06F3/012 , G06T19/006 , H05K1/0271 , H05K3/0058 , H05K3/061 , H05K3/303 , H05K3/4688 , H05K5/0078 , H05K2201/068 , H05K2201/09081 , H05K2201/10969 , H05K2201/10984 , H05K2203/0228 , H05K2203/068
Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
Abstract translation: 粘合接合系统包括具有远端的电路板和通过与壳体的舌槽连接安装在第一侧上的近端。 粘合剂至少位于围绕舌头的间隙中，并且电气部件安装到电路板的与第一侧相对的第二侧上的远端。 舌，粘合剂和限定凹槽的材料的各自的热膨胀系数（CTE）是相关的，使得当热量施加到舌和沟槽连接时，粘合剂在间隙内被压缩。
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Patent Agency Ranking
公开(公告)号：US20160377872A1
公开(公告)日：2016-12-29
申请号：US14754462
申请日：2015-06-29
Applicant: Erin Hurbi , Igor Markovsky , Michael Nikkhoo
Inventor： Erin Hurbi , Igor Markovsky , Michael Nikkhoo
IPC: G02B27/01
CPC classification number: G02B27/0176 , B82Y20/00 , B82Y30/00 , G02B27/017 , G02B27/0172 , G02B2027/0161 , G02B2027/0194 , H01L23/552 , H01L29/1606
Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.
Abstract translation: 本文公开的实例涉及透明光学显示器上的基于石墨烯的材料。 一个示例提供了一种计算设备，其包括透视显示系统，其包括可观看周围环境的光学部件，设置在光学部件的面向用户侧的电气部件和设置在光学部件上的石墨烯层 所述光学部件，所述石墨烯基层在更靠近所述电气部件的部分上包含更大厚度的基于石墨烯的材料，并且所述石墨烯基层在远离所述电气部件的部分上具有较小厚度的石墨烯材料。
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公开(公告)号：US20160209660A1
公开(公告)日：2016-07-21
申请号：US14601097
申请日：2015-01-20
Applicant: Michael Nikkhoo , Erin Hurbi
Inventor： Michael Nikkhoo , Erin Hurbi
CPC classification number: G02B27/0176 , B29D12/02 , G02B6/0085 , G02B27/017 , G02B2027/0178
Abstract: A passive thermal heat-pipe material comprising an optical mounting structure including heat producing electronic components is provided. Each structural component of the optical mounting structure may be at least partially comprised of a polymer including a plurality of carbon nanoparticles. In a further aspect, a method of creating an optical structure adapted to support a plurality of heat emitting components is provided. The method includes adding a percentage by concentration of carbon nanoparticles to a polymer base material, mixing the polymer base material and carbon nanoparticles uniformly, melting the mixture at high temperature, forming the melted mixture into a component of the optical structure, and cooling the formed component to solidify the component. The percentage may be between 2 and 10 percent.
Abstract translation: 提供了一种包括包括发热电子部件的光学安装结构的被动热管材。 光学安装结构的每个结构部件可以至少部分地由包括多个碳纳米颗粒的聚合物组成。 在另一方面，提供了一种创建适于支撑多个发热部件的光学结构的方法。 该方法包括将碳纳米颗粒的浓度百分比加入到聚合物基材中，均匀混合聚合物基材和碳纳米颗粒，在高温下熔融混合物，将熔融混合物形成为光学结构的组分，并冷却形成 组分固化组分。 百分比可能在2％到10％之间。
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公开(公告)号：US08881387B2
公开(公告)日：2014-11-11
申请号：US13270448
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US20120024588A1
公开(公告)日：2012-02-02
申请号：US13270421
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号：US20100224401A1
公开(公告)日：2010-09-09
申请号：US12397922
申请日：2009-03-04
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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