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公开(公告)号:US5493351A
公开(公告)日:1996-02-20
申请号:US160024
申请日:1993-11-30
申请人: Goro Hamagishi , Masahiro Sakata , Katsumi Terada , Haruhisa Kosaka , Shunichi Kishimoto , Keiichi Kanatani
发明人: Goro Hamagishi , Masahiro Sakata , Katsumi Terada , Haruhisa Kosaka , Shunichi Kishimoto , Keiichi Kanatani
IPC分类号: G02F1/13 , G02F1/133 , G02F1/1335 , H04N9/31 , G03B21/00
CPC分类号: H04N9/3144 , G02F1/133385 , G02F1/133514
摘要: A liquid crystal projector includes a light source, a color filter for adding color projection image, a liquid crystal panel for forming a projection image on it, a projection lens and an optical unit located between the color filter and the liquid crystal panel for optically coupling the color filter and the liquid crystal panel. The color filter is separately located from the liquid crystal, and therefore the increase in temperature on the color filter because of absorbing the light from the light source has less effect on the liquid crystal panel.
摘要翻译: 液晶投影仪包括光源,用于添加彩色投影图像的滤色器,用于在其上形成投影图像的液晶面板,投影透镜和位于滤色器和用于光耦合的液晶面板之间的光学单元 滤色器和液晶面板。 滤色器与液晶分开设置,因此由于吸收来自光源的光而使滤色器上的温度升高对液晶面板的影响较小。
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公开(公告)号:US5248917A
公开(公告)日:1993-09-28
申请号:US737001
申请日:1991-07-29
申请人: Goro Hamagishi , Keiichi Kanatani , Shunichi Kishimoto , Katsumi Terada , Yasuo Funazo , Takashi Ikeda , Masahiro Sakata , Hiroyuki Yagi
发明人: Goro Hamagishi , Keiichi Kanatani , Shunichi Kishimoto , Katsumi Terada , Yasuo Funazo , Takashi Ikeda , Masahiro Sakata , Hiroyuki Yagi
IPC分类号: H04N9/31 , H05B41/392
CPC分类号: H05B41/14 , H04N9/3105 , H04N9/315
摘要: A flat fluorescent lamp comprises a flat glass container formed by a front glass panel, a rear glass panel and glass frames, a phosphor coating formed along the inner surface of the front glass panel, an anode disposed in the vicinity of the phosphor coating, a plurality of linear cathodes arranged in parallel to the anode and supported by support members, and at least one mesh electrode disposed between the anode and the cathodes The intensity of light of the lamp is adjusted by applying a pulse voltage to the mesh electrode.
摘要翻译: 平面荧光灯包括由前玻璃面板,后玻璃面板和玻璃框架形成的平板玻璃容器,沿着前玻璃面板的内表面形成的荧光体涂层,设置在荧光体涂层附近的阳极, 多个直线阴极平行于阳极排列并被支撑件支撑,以及设置在阳极和阴极之间的至少一个网状电极通过向网状电极施加脉冲电压来调节灯的强度。
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公开(公告)号:US4920298A
公开(公告)日:1990-04-24
申请号:US169708
申请日:1988-03-18
IPC分类号: F21V8/00 , G02F1/13357 , H01J61/30
CPC分类号: G02F1/133604 , H01J61/30
摘要: In a flat fluorescent lamp for serving as a back light of liquid crystal panels for use in display devices, upper and lower glass plates are respectively coated with fluorescent film on its inner surface and arranged in parallel to each other, a glass side wall is disposed along the peripheral edges of the upper and lower glass plates in order to form a hermetic discharge space between the upper and lower glass plates, a pair of discharge electrodes are arranged in parallel within the discharge space and opposed to each other, at least one reinforcing glass member having a height approximately equal to the distance between the upper and lower glass plates and for supporting the upper and lower glass plates is disposed between the electrodes, and the upper glass plate is formed at its inner surface with an uncoated portion having no fluorescent film at the position where the upper glass plate is opposed to the reinforcing glass member in contact therewith.
摘要翻译: 在用作显示装置的液晶面板的背光的平面荧光灯中,上下玻璃板在其内表面上分别涂有荧光膜并且彼此平行地布置,玻璃侧壁被布置 沿着上玻璃板和下玻璃板的周边边缘,以便在上玻璃板和下玻璃板之间形成密封的放电空间,一对放电电极平行布置在放电空间内并彼此相对,至少一个增强 玻璃构件的高度大致等于上下玻璃板之间的距离,并且用于支撑上玻璃板和下玻璃板,设置在电极之间,并且上玻璃板在其内表面上形成有不具有荧光体的未涂覆部分 在上玻璃板与与其接触的加强玻璃构件相对的位置处的膜。
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公开(公告)号:US5126628A
公开(公告)日:1992-06-30
申请号:US737896
申请日:1991-07-26
申请人: Shunichi Kishimoto , Yasuo Funazo , Katsumi Terada , Goro Hamagishi , Kazuhiko Takeuchi , Daisuke Takemori , Takashi Ikeda
发明人: Shunichi Kishimoto , Yasuo Funazo , Katsumi Terada , Goro Hamagishi , Kazuhiko Takeuchi , Daisuke Takemori , Takashi Ikeda
IPC分类号: H01J31/12
CPC分类号: H01J31/126 , H01J2329/30
摘要: A flat display includes a front panel having a fluorescent screen on its rear side, a rear panel defining a flat space with the front panel, linear filament cathodes arranged close to the rear panel, and an address electrode plate having a multiplicity of apertures and disposed close to the front panel. The rear panel is formed on its inner surface with spacer ridges each extending on each side of each filament cathode therealong and having a height to reach the address electrode plate. The spacer ridges give the flat display improved strength against pressure.
摘要翻译: 平面显示器包括在其后侧具有荧光屏的前面板,与前面板限定平坦空间的后面板,靠近后面板布置的线状灯丝阴极以及设置有多个孔的寻址电极板 靠近前面板。 后板在其内表面上形成有间隔脊,每个间隔脊在每个长丝阴极的每一侧延伸,并且具有到达寻址电极板的高度。 间隔脊使平面显示器提高了抗压强度。
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公开(公告)号:US4767965A
公开(公告)日:1988-08-30
申请号:US928133
申请日:1986-11-07
申请人: Masaru Yamano , Katsuhiro Hinotani , Hajime Hayama , Shunichi Kishimoto , Nobutake Kawamori , Katsumi Terada , Kazuhiro Kono , Yasuo Funozo
发明人: Masaru Yamano , Katsuhiro Hinotani , Hajime Hayama , Shunichi Kishimoto , Nobutake Kawamori , Katsumi Terada , Kazuhiro Kono , Yasuo Funozo
IPC分类号: G02F1/13357 , H01J61/78 , H01J61/067 , H01J61/30
CPC分类号: G02F1/133604 , H01J61/78
摘要: In a flat luminescent lamp fitted to an under surface of the liquid crystalline TV display panel to backlight its image, a pair of the electrode plates 14 of cold cathode type are opposingly positioned in the cavity. The electrode plate has a concave cross section, auxiliary electrodes on each electrode plate project toward the other electrode plate from both terminations and has a lead plate projecting outwardly in the same direction as the extract tube of the lamp.
摘要翻译: 在安装在液晶电视显示面板的下表面上以使其图像背光的平面发光灯中,一对冷阴极型电极板14相对地定位在空腔中。 电极板具有凹入的横截面,每个电极板上的辅助电极从两个端子朝着另一个电极板突出,并且具有与灯的提取管相同的方向向外突出的引线板。
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公开(公告)号:US20090289098A1
公开(公告)日:2009-11-26
申请号:US12085964
申请日:2006-11-30
申请人: Katsumi Terada , Mikio Kawakami
发明人: Katsumi Terada , Mikio Kawakami
CPC分类号: H01L24/81 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01055 , H01L2924/01067 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要: A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.
摘要翻译: 芯片安装装置具有驱动控制装置。 驱动控制装置设置有工具架,安装用于向芯片施加压力的工具,用于支撑待垂直移动的工具架的保持器支撑装置,用于垂直移动保持器支撑装置的驱动装置和位置 检测装置,用于检测工具架到保持器支撑装置的相对位置。 驱动控制装置基于工具和芯片彼此重叠并与基板接触的位置来控制工具的高度和加压力。 还提供了芯片安装方法。 可以防止相邻焊料凸点之间的短路故障,并且可以以高产率和可靠性安装芯片。
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公开(公告)号:US07621969B2
公开(公告)日:2009-11-24
申请号:US11887212
申请日:2006-03-13
申请人: Mutsumi Masumoto , Katsumi Terada
发明人: Mutsumi Masumoto , Katsumi Terada
IPC分类号: H01L21/00
CPC分类号: H01L21/67109 , H01L21/563 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/75 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/15788 , Y10T29/41 , H01L2924/00
摘要: A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.
摘要翻译: 安装系统设置有基板装载部分,芯片安装部分和基板卸载部分,用于顺序取出安装芯片的基板。 安装系统的特征在于,基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱,分别设置用于加热/隔热基板的台加热器, 在从芯片安装部的基板等待台到芯片安装部,芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部,基板卸载部是 提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。 可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度,并且特别地,可以抑制或防止归因于吸湿的问题的发生。
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公开(公告)号:US07207679B2
公开(公告)日:2007-04-24
申请号:US10878356
申请日:2004-06-29
申请人: Takahiro Totani , Katsumi Terada , Hiroki Koba , Kazunobu Oketani
发明人: Takahiro Totani , Katsumi Terada , Hiroki Koba , Kazunobu Oketani
IPC分类号: G03B21/14 , G03B21/20 , F21V17/02 , G02F1/1335 , H04N9/31
CPC分类号: G03B21/2053
摘要: A video signal processing circuit inputs a video signal to perform processing such as frequency conversion as well as processing for generating data representing the APL (Average Picture Level) of a frame video for each frame period. A microcomputer functions as a dimmer arithmetic block to perform processing for generating dimmer data upon receipt of APL data, and functions as a lamp driver control block to perform processing for sending out a dimmer command to a lamp driver. The lamp driver receives the dimmer command, to control an amount of light emitted from a light source (a lamp).
摘要翻译: 视频信号处理电路输入视频信号以执行诸如频率转换的处理,以及用于在每个帧周期中产生表示帧视频的APL(平均画面电平)的数据的处理。 微计算机用作调光算术块,以在接收到APL数据时执行用于产生调光器数据的处理,并且用作灯驱动器控制块,以执行向灯驱动器发送调光器命令的处理。 灯驱动器接收调光器命令,以控制从光源(灯)发出的光量。
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公开(公告)号:US20120015458A1
公开(公告)日:2012-01-19
申请号:US13260232
申请日:2010-03-18
CPC分类号: H05K13/021 , H01L2224/16225 , H01L2224/75 , H05K13/0452 , Y10T29/53178
摘要: Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
摘要翻译: 提供了一种将芯片部件安装在具有形成在其上的多个电路图案的电路板上的电路图案上的安装装置。 安装装置设置有多个焊接工具,每个焊接工具将芯片部件安装在电路板上的每个电路图案上。 每个接合工具在电路板上要安装芯片部件的区域内设置专用安装区域,其中只有每个焊接工具可以安装芯片部件,以及公共安装区域,其中焊接工具和 相邻的焊接工具可以安装芯片组件。 还提供了一种安装方法。 即使在电路板上形成多个电路图案并且在形成的电路图案中包括故障电路图案的情况下,也可以缩短芯片组件的安装节拍时间。
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公开(公告)号:US20100225136A1
公开(公告)日:2010-09-09
申请号:US12279944
申请日:2007-02-19
申请人: Masanori Ogawa , Katsumi Terada , Junichi Hasegawa , Makoto Fujii
发明人: Masanori Ogawa , Katsumi Terada , Junichi Hasegawa , Makoto Fujii
IPC分类号: B60R13/02
CPC分类号: B60J5/0418 , B29C51/10 , B29C2791/001 , B29C2791/006 , B29K2105/04 , B29L2031/3014 , B60R13/0206 , B60R13/0243 , B60R13/0892
摘要: The object of the present invention is to provide a door seal member which is easily fitted into the door of a car. A door seal member 13 is fitted between the door panel 11 and the door trim board 12, wherein the door seal member 13 is manufactured by the vacuum and/or pressure forming or cold working of a foamed sheet, the door seal member 13 being molded into a cubic shape corresponding to that of the door trim board 12.
摘要翻译: 本发明的目的是提供一种容易装入轿厢门的门密封件。 门密封构件13装配在门板11和门饰板12之间,其中门密封构件13通过发泡片材的真空和/或压力成形或冷加工制造,门密封构件13被模制 成为对应于门饰板12的立方体。
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