摘要:
A mobile rock crushing vehicle with a detachable electronic control box which can be automatically lifted, by a pair of hydraulic pivoting arms, off the vehicle, lowered and set upon any vibration damping and isolating mass, such as the earth, all by moving a hydraulic lever. The pair of pivoting arms further automatically configure a reduced-vibration transmitting connection when the electronic control box is set upon the ground.
摘要:
A mobile rock crushing vehicle with a detachable electronic control box which can be automatically lifted, by a pair of hydraulic pivoting arms, off the vehicle, lowered and set upon any vibration damping and isolating mass, such as the earth, all by moving a hydraulic lever. The pair of pivoting arms further automatically configures a reduced-vibration transmitting connection when the electronic control box is set upon the ground.
摘要:
An apparatus for manipulating a work piece in connection with a wire bonding machine including at least one magazine handler is provided. The apparatus includes a first conveyor system configured to receive work pieces from the at least one magazine handler, and a second conveyor system configured to receive work pieces from the at least one magazine handler. The apparatus is adapted such that the second conveyor system prepares a work piece for a wire bonding operation by a wire bonding tool concurrent with the first conveyor system supporting another work piece during a wire bonding operation of the another work piece using the wire bonding tool.
摘要:
A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.
摘要:
A probe for a probe card assembly is provided. The probe has a post structure supported by a substrate, a plurality of stacked beam elements disposed on the post structure, and a tip attached to a surface of a top beam element, of the plurality of stacked beam elements, that opposes the substrate. The tip is configured to be electrically connected to a semiconductor device to be tested. The probe may be bent so that the tip is further away from the substrate than the height the post structure. The effective maximum force exerted by the tips of a multi-beamed probe against, for example, DUT pads may be increased when compared to prior probes.
摘要:
An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.
摘要:
A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
摘要:
A wire bonding machine is provided which includes a bond head including a wire bonding tool adapted to feed a wire for bonding to bonding locations. The wire bonding machine also includes an electronic flame-off wand configured to heat an end portion of the wire extending through the bonding tool to form a free-air ball for bonding. The electronic flame-off wand is vertically actuatable relative to a support structure of the electronic flame-off wand.