FLEXURE-BASED CONTINUOUS EJECTOR PIN MECHANISM FOR MINI/MICRO CHIP MASS TRANSFER

    公开(公告)号:US20230268205A1

    公开(公告)日:2023-08-24

    申请号:US18062025

    申请日:2022-12-06

    IPC分类号: H01L21/67 H01L33/00

    CPC分类号: H01L21/67144 H01L33/0093

    摘要: A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.

    RAPID ACTIVE VIBRATION REDUCTION METHOD FOR HIGH-SPEED MOTION STAGE

    公开(公告)号:US20230235810A1

    公开(公告)日:2023-07-27

    申请号:US18154533

    申请日:2023-01-13

    IPC分类号: F16F15/00 F16F15/02

    摘要: A rapid active vibration reduction method for a high-speed motion stage includes acquiring motion parameters of a motion body of the motion stage in current motion; determining a vibration reduction mode of a vibration reduction device according to the motion parameters; and controlling an action end of the vibration reduction device to contact with the motion body of the motion stage or contact with a driving device for driving the motion body to move based on the vibration reduction mode, so that a contact friction force used for suppressing vibration of the motion body is generated. Realizing vibration reduction by means of active friction can reduce vibration of the motion body in a specific stage needing vibration reduction, and the action end of the vibration reduction device does not need to contact with the motion body or does not need to contact with the driving device before vibration reduction.

    MOTOR TRACKING ERROR REDUCTION METHOD AND IMPLEMENTATION DEVICE BASED ON MICRO-DRIVE UNIT

    公开(公告)号:US20220060125A1

    公开(公告)日:2022-02-24

    申请号:US16950062

    申请日:2020-11-17

    IPC分类号: H02N2/06 G05B19/19

    摘要: The present disclosure relates to the technical field of mechanical precision manufacturing, in particular to a motor tracking error reduction method and an implementation device based on a micro-drive unit. A motor tracking error reduction method based on micro-drive unit includes: providing a motor mover as the working output end, and feeding back the position information of the motor mover to the micro-drive controller in real time by the sensor; controlling the micro-drive unit to compensate the displacement of the motor mover by the micro-drive controller; correcting the tracking error of the motor mover after the displacement compensation, and feeding back the tracking error information after correction to the motor controller. The error reduction method and implementation device in the present disclosure reduce the motor tracking error and solve the problem of coupling interference. In addition, the single position feedback is used to reduce the production cost.

    PARALLEL CONTROL METHOD AND SYSTEM FOR INTELLIGENT WORKSHOP

    公开(公告)号:US20200218243A1

    公开(公告)日:2020-07-09

    申请号:US16819178

    申请日:2020-03-16

    IPC分类号: G05B19/418 G06F13/40

    摘要: A parallel control method for an intelligent workshop is provided, comprising the following steps: step A: constructing a parallel control simulation platform; step B: establishing a parallel execution mechanism; and, step C: correcting and optimizing a parallel control system. A parallel control system for an intelligent workshop is provided, comprising: an MES module configured to issue production instructions to unit management modules; the unit management modules configured to convert the received production instructions into machine instructions and synchronously issue the machine instructions to underlying PLCs by a bus control network module, and drive the parallel control simulation platform and a field device to move by a soft PLC and a hard PLC; the bus control network module configured to establish a communication network among the MES module, an SCADA module, an industrial personal computer, physical devices and a whole-line simulation model; and, the SCADA module.

    METHOD FOR SYNCHRONOUS WET ETCHING PROCESSING OF DIFFERENTIAL MICROSTRUCTURES

    公开(公告)号:US20190355587A1

    公开(公告)日:2019-11-21

    申请号:US16383885

    申请日:2019-04-15

    IPC分类号: H01L21/308 H01L21/306

    摘要: A method for synchronous wet etching processing of differential microstructures, including the following steps: step a: performing photoetching on a processing surface of a workpiece to be processed to develop the workpiece; step b: affixing a mask to a surface opposite to the processing surface of the workpiece; step c: continuously cooling the mask; step d: placing the cooled mask and the workpiece in a wet etching device; and adding an etchant to the processing surface of the workpiece to start etching; step e: removing the mask and the workpiece from the wet etching device after the set etching time; separating the mask and the workpiece to obtain a workpiece with a etching structure. A temperature difference is formed between the pattern area to be processed and the retaining area.

    EJECTOR PIN SLIDING ON MEMBRANE-BASED DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)

    公开(公告)号:US20240363793A1

    公开(公告)日:2024-10-31

    申请号:US18769413

    申请日:2024-07-11

    IPC分类号: H01L33/00

    CPC分类号: H01L33/005

    摘要: An ejector pin sliding on membrane-based device and method for mass transfer of mini light-emitting diodes (Mini-LEDs) are provided. The device includes a gantry transverse beam. The gantry transverse beam is provided with an ejector pin base, and the ejector pin base is configured to move along the gantry transverse beam. The ejector pin base is fixedly provided with a vision camera and an ejector pin. A blue membrane is horizontally provided at a side of the gantry transverse beam close to the ejector pin, and is spaced from the gantry beam. A surface of a side of the blue membrane away from the gantry transverse beam is adhesively provided with a plurality of Mini-LED chips arranged evenly. A transfer substrate is horizontally provided at a side of the blue membrane close to the plurality of Mini-LED chips, and is spaced from the blue membrane.