公开(公告)号：US06645862B2

公开(公告)日：2003-11-11

申请号：US09989550

申请日：2001-11-20

申请人： Guido Wenski ,  Johann Glas ,  Thomas Altmann ,  Gerhard Heier

发明人： Guido Wenski ,  Johann Glas ,  Thomas Altmann ,  Gerhard Heier

IPC分类号： H01L21302

CPC分类号： H01L21/02024 ,  B24B37/0056 ,  B24B37/08

摘要： A process for producing semiconductor wafers by double-sided polishing between two rotating, upper and lower polishing plates, which are covered with polishing cloth, while an alkaline polishing abrasive with colloidal solid fractions is being supplied, the semiconductor wafers being guided by carriers which have circumferential gear teeth and are set in rotation by complementary outer gear teeth and inner gear teeth of the polishing machine, which is distinguished by the following process steps: (a) at least one of the two sets of gear teeth of the polishing machine is at least from time to time sprayed with a liquid which substantially comprises water, (b) the alkaline polishing abrasive is fed continuously to the semiconductor wafers in a closed supply device. There is also a device which is suitable for carrying out the process.

摘要翻译： 在提供具有胶体固体部分的碱性抛光磨料的同时，在被抛光布覆盖的两个旋转，上和下抛光板之间通过双面抛光来生产半导体晶片的方法，半导体晶片由具有 周向齿轮齿，并由抛光机的互补外齿轮齿和内齿轮齿旋转，其特征在于以下工艺步骤：（a）抛光机的两组齿轮齿中的至少一个处于 至少不时地用基本上包含水的液体喷雾，（b）碱性抛光磨料在封闭的供应装置中连续地供给到半导体晶片。 还有一种适用于执行该过程的装置。

公开(公告)号：US06793837B2

公开(公告)日：2004-09-21

申请号：US10174139

申请日：2002-06-18

申请人： Guido Wenski ,  Thomas Altmann ,  Gerhard Heier ,  Wolfgang Winkler ,  Gunther Kann

发明人： Guido Wenski ,  Thomas Altmann ,  Gerhard Heier ,  Wolfgang Winkler ,  Gunther Kann

IPC分类号： B44C122

CPC分类号： H01L21/02024 ,  B24B17/10 ,  B24B37/08

摘要： A process is for material-removing machining, on both sides simultaneously, of semiconductor wafers having a front surface and a back surface, the semiconductor wafers resting in carriers which are set in rotation by means of an annular outer drive ring and an annular inner drive ring and being moved between two oppositely rotating working disks in a manner which can be described by means of in each case one path curve relative to the upper working disk and one path curve relative to the lower working disk, wherein the two path curves after six loops around the center have the appearance of still being open, and at each point have a radius of curvature which is at least as great as the radius of the inner drive ring.

摘要翻译： 一种方法是在半导体晶片具有前表面和后表面的同时在两面同时进行材料去除加工，半导体晶片位于载体中，该载体通过环形外驱动环和环形内驱动 在两个相对旋转的工作盘之间移动，可以通过在每种情况下通过相对于上工作盘的一个路径曲线和相对于下工作盘的一个路径曲线来描述，其中在六个之后的两个路径曲线 围绕中心的环路具有仍然是开放的外观，并且在每个点处具有至少与内部驱动环的半径一样大的曲率半径。

公开(公告)号：US06514424B2

公开(公告)日：2003-02-04

申请号：US09826135

申请日：2001-04-04

申请人： Guido Wenski ,  Gerhard Heier ,  Wolfgang Winkler ,  Thomas Altmann

发明人： Guido Wenski ,  Gerhard Heier ,  Wolfgang Winkler ,  Thomas Altmann

IPC分类号： H01L2100

CPC分类号： B24B41/067 ,  B24B37/08 ,  H01L21/02024

摘要： A process for the double-side polishing of semiconductor wafers between two polishing plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 &mgr;m of semiconductor material is removed. The semiconductor wafers lay in plastic-lined cutouts in a set of a plurality of planar carriers which are made from steel and the mean thickness of which is 2 to 20 &mgr;m smaller than the mean thickness of the fully polished semiconductor wafers. The set comprises only those carriers whose difference in thickness is at most 5 &mgr;m, and each carrier belonging to the set has at least one unambiguous identification feature which assigns it to the set. An item of information contained in the identification feature is used in order for the plastic linings to be exchanged at fixed intervals and to ensure that the semiconductor wafers remain in the same order after the polishing as before the polishing. There is also a carrier which is suitable for carrying out the process.

摘要翻译： 在两个抛光板之间进行双面抛光的方法，该两个抛光板以相反的方向旋转并被抛光布覆盖，以至于除去了至少2微米的半导体材料。 半导体晶片放置在由钢制成的多组平面载体的一组塑料衬里的切口中，其平均厚度比完全抛光的半导体晶片的平均厚度小2至20μm。 该集合仅包括厚度差为5mum以下的载波，属于该集合的每个载波具有至少一个明确的识别特征，将其分配给该集合。 使用包含在识别特征中的信息项目，以便以固定的间隔更换塑料衬里，并确保半导体晶片在抛光之后保持与抛光之前相同的顺序。 还有一个适用于执行该过程的载体。

公开(公告)号：US06899762B2

公开(公告)日：2005-05-31

申请号：US10402171

申请日：2003-03-28

申请人： Guido Wenski ,  Wolfgang Siebert ,  Klaus Messmann ,  Gerhard Heier ,  Thomas Altmann ,  Martin Fürfanger

发明人： Guido Wenski ,  Wolfgang Siebert ,  Klaus Messmann ,  Gerhard Heier ,  Thomas Altmann ,  Martin Fürfanger

IPC分类号： C30B29/06 ,  B24B37/04 ,  H01L21/02 ,  H01L21/205 ,  H01L21/304 ,  H01L21/306 ,  C30B25/14

CPC分类号： B24B37/08 ,  B24B37/042 ,  H01L21/02024 ,  H01L21/30625 ,  Y10T428/24355

摘要： A semiconductor wafer with a front surface and a back surface and an epitaxial layer of semiconducting material deposited on the front surface. In the semiconductor wafer, the epitaxial layer has a maximum local flatness value SFQRmax of less than or equal to 0.13 μm and a maximum density of 0.14 scattered light centers per cm2. The front surface of the semiconductor wafer, prior to the deposition of the epitaxial layer, has a surface roughness of 0.05 to 0.29 nm RMS, measured by AFM on a 1 μm×1 μm reference area. Furthermore, there is a process for producing the semiconductor wafer. The process includes the following process steps: (a) as a single polishing step, simultaneous polishing of the front surface and of the back surface of the semiconductor wafer between rotating polishing plates while an alkaline polishing slurry is being supplied, the semiconductor wafer lying in a cutout of a carrier whose thickness is dimensioned to be 2 to 20 μm less than the thickness of the semiconductor wafer after the latter has been polished; (b) simultaneous treatment of the front surface and of the back surface of the semiconductor wafer between rotating polishing plates while a liquid containing at least one polyhydric alcohol having 2 to 6 carbon atoms is being supplied; (c) cleaning and drying of the semiconductor wafer; and (d) deposition of the epitaxial layer on the front surface of the semiconductor wafer produced in accordance with steps (a) to (c).

摘要翻译： 具有前表面和后表面的半导体晶片和沉积在前表面上的半导体材料的外延层。 在半导体晶片中，外延层具有小于或等于0.13μm的最大局部平坦度值SFQR＆lt; SUB＆lt;＆lt; SUB＆lt; SUB＆gt;和最大密度为0.14散射光中心/ cm 2 。 在沉积外延层之前，半导体晶片的前表面在1mum×1mum参考区域上通过AFM测量的表面粗糙度为0.05至0.29nm RMS。 此外，存在制造半导体晶片的工艺。 该方法包括以下工艺步骤：（a）作为单个抛光步骤，在供应碱性抛光浆料的同时，在旋转的抛光板之间同时抛光半导体晶片的表面和背面，半导体晶片位于 载体的切口，其尺寸设定为比后半导体晶片抛光后的半导体晶片的厚度小2〜20μm; （b）在供给包含至少一种含有2〜6个碳原子的多元醇的液体的同时处理旋转研磨板之间的半导体晶片的前表面和后表面; （c）清洗和干燥半导体晶片; 以及（d）在根据步骤（a）至（c）制造的半导体晶片的前表面上沉积外延层。

公开(公告)号：US06583050B2

公开(公告)日：2003-06-24

申请号：US10218006

申请日：2002-08-13

申请人： Guido Wenski ,  Thomas Altmann ,  Ernst Feuchtinger ,  Willibald Bernwinkler ,  Wolfgang Winkler ,  Gerhard Heier

发明人： Guido Wenski ,  Thomas Altmann ,  Ernst Feuchtinger ,  Willibald Bernwinkler ,  Wolfgang Winkler ,  Gerhard Heier

IPC分类号： H01L214763

CPC分类号： H01L21/02024 ,  B24B37/042 ,  B24B37/08

摘要： A semiconductor wafer has a front surface and a back surface and flatness values based on partial areas of a surface grid on the front surface of the semiconductor wafer, which has a maximum local flatness value SFQRmax of less than or equal to 0.13 &mgr;m and individual SFQR values which in a peripheral area of the semiconductor wafer do not differ significantly from those in a central area of the semiconductor wafer. There is also a process for producing this semiconductor wafer, wherein the starting thickness of the semiconductor wafer is 20 to 200 &mgr;m greater than the thickness of the carrier and the semiconductor wafer is polished until the end thickness of the semiconductor wafer is 2 to 20 &mgr;m greater than the thickness of the carrier.

公开(公告)号：US06458688B1

公开(公告)日：2002-10-01

申请号：US09491649

申请日：2000-01-27

申请人： Guido Wenski ,  Thomas Altmann ,  Ernst Feuchtinger ,  Willibald Bernwinkler ,  Wolfgang Winkler ,  Gerhard Heier

发明人： Guido Wenski ,  Thomas Altmann ,  Ernst Feuchtinger ,  Willibald Bernwinkler ,  Wolfgang Winkler ,  Gerhard Heier

IPC分类号： H01L214763

CPC分类号： H01L21/02024 ,  B24B37/042 ,  B24B37/08

摘要： A semiconductor wafer has a front surface and a back surface and flatness values based on partial areas of a surface grid on the front surface of the semiconductor wafer, which has a maximum local flatness value SFQRmax of less than or equal to 0.13 &mgr;m and individual SFQR values which in a peripheral area of the semiconductor wafer do not differ significantly from those in a central area of the semiconductor wafer. There is also a process for producing this semiconductor wafer, wherein the starting thickness of the semiconductor wafer is 20 to 200 &mgr;m greater than the thickness of the carrier and the semiconductor wafer is polished until the end thickness of the semiconductor wafer is 2 to 20 &mgr;m greater than the thickness of the carrier.

摘要翻译： 半导体晶片具有基于半导体晶片的前表面上的表面格栅的部分区域的前表面和后表面以及平坦度值，其具有小于或等于0.13μm的最大局部平坦度值SFQRmax和单独的SFQR 在半导体晶片的周边区域中的值与半导体晶片的中心区域的值没有显着差异。 还有一种制造该半导体晶片的方法，其中半导体晶片的起始厚度比载体的厚度大20至200微米，并且半导体晶片被抛光直到半导体晶片的端部厚度为2至20μm 大于载体的厚度。

公开(公告)号：US07541287B2

公开(公告)日：2009-06-02

申请号：US11487652

申请日：2006-07-17

申请人： Ruediger Schmolke ,  Thomas Buschhardt ,  Gerhard Heier ,  Guido Wenski

发明人： Ruediger Schmolke ,  Thomas Buschhardt ,  Gerhard Heier ,  Guido Wenski

IPC分类号： H01L21/302

CPC分类号： B24B37/28 ,  Y10S438/959

摘要： A semiconductor wafer is guided in a cutout in a carrier while a thickness of the semiconductor wafer is reduced to a target thickness by material removal from the front and back surfaces simultaneously. The semiconductor wafer is machined until it is thinner than a carrier body and thicker than an inlay used to line the cutout in the carrier to protect the semiconductor wafer. The carrier is distinguished by the fact that the carrier body and the inlay have different thicknesses throughout the entire duration of the machining of the semiconductor wafer, the carrier body being thicker than the inlay, by from 20 to 70 μm. Themethod provides semiconductor wafers polished on both sides, having a front surface, a back surface and an edge, and a local flatness of the front surface, SFQRmax of less than 50 nm with an edge exclusion of R-2 mm and less than nm with an edge exclusion of R-1 mm, based on a site area of 26 by 8 mm.

摘要翻译： 半导体晶片被引导在载体的切口中，同时通过从前表面和背面去除材料将半导体晶片的厚度减小到目标厚度。 半导体晶片被加工直到其比载体体薄并且比用于将载体上的切口对准的嵌体更厚以保护半导体晶片。 载体的特征在于，在半导体晶片的加工整个整个持续时间内，载体主体和嵌体具有不同的厚度，载体主体比镶嵌物厚20〜70μm。 该方法提供在两侧抛光的半导体晶片，具有前表面，后表面和边缘以及前表面的局部平坦度，SFQRmax小于50nm，边缘排除R-2mm和小于nm， 基于26×8mm的场地面积，R-1mm的边缘排除。

公开(公告)号：US20070021042A1

公开(公告)日：2007-01-25

申请号：US11487652

申请日：2006-07-17

申请人： Ruediger Schmolke ,  Thomas Buschhardt ,  Gerhard Heier ,  Guido Wenski

发明人： Ruediger Schmolke ,  Thomas Buschhardt ,  Gerhard Heier ,  Guido Wenski

IPC分类号： B24B7/00

CPC分类号： B24B37/28 ,  Y10S438/959

摘要： A semiconductor wafer is guided in a cutout in a carrier while a thickness of the semiconductor wafer is reduced to a target thickness by material removal from the front and back surfaces simultaneously. The semiconductor wafer is machined until it is thinner than a carrier body and thicker than an inlay used to line the cutout in the carrier to protect the semiconductor wafer. The carrier is distinguished by the fact that the carrier body and the inlay have different thicknesses throughout the entire duration of the machining of the semiconductor wafer, the carrier body being thicker than the inlay, by from 20 to 70 μm. The method provides semiconductor wafers polished on both sides, having a front surface, a back surface and an edge, and a local flatness of the front surface, SFQRmax of less than 50 nm with an edge exclusion of R-2 mm and less than 115 nm with an edge exclusion of R-1 mm, based on a site area of 26 by 8 mm.

摘要翻译： 半导体晶片被引导在载体的切口中，同时通过从前表面和背面去除材料将半导体晶片的厚度减小到目标厚度。 半导体晶片被加工直到其比载体体薄并且比用于将载体上的切口对准的嵌体更厚以保护半导体晶片。 载体的特征在于，在半导体晶片的加工整个整个持续时间内，载体主体和嵌体具有不同的厚度，载体主体比镶嵌物厚20〜70μm。 该方法提供在两侧抛光的半导体晶片，具有前表面，后表面和边缘以及前表面的局部平坦度，SFQR 小于50nm，边缘排除 R-2mm和小于115nm，边缘排除R-1mm，基于26×8mm的位置面积。

公开(公告)号：US20100055908A1

公开(公告)日：2010-03-04

申请号：US12547749

申请日：2009-08-26

申请人： Klaus Roettger ,  Gerhard Heier ,  Alexander Heilmaier

发明人： Klaus Roettger ,  Gerhard Heier ,  Alexander Heilmaier

IPC分类号： H01L21/306

CPC分类号： B24B37/042 ,  H01L21/02024

摘要： A method for producing a semiconductor wafer. The method includes placing the semiconductor wafer in a cutout in a carrier. Both sides of the semiconductor wafer are polished between an upper and a lower polishing plate with a polishing agent until the thickness of the center of the semiconductor wafer is less than the thickness of the carrier and from 10 μm to 30 μm of semiconductor wafer material is removed. The polishing agent contains 0.1 to 0.4% by weight of SiO2 and 0.1 to 0.9% by weight of an alkaline component.

摘要翻译： 一种半导体晶片的制造方法。 该方法包括将半导体晶片放置在载体中的切口中。 半导体晶片的两面用抛光剂在上下抛光板之间进行抛光，直到半导体晶片的中心厚度小于载体的厚度为止，半导体晶片材料的10μm至30μm为 删除。 抛光剂含有0.1至0.4重量％的SiO 2和0.1至0.9重量％的碱性组分。

公开(公告)号：US20100210188A1

公开(公告)日：2010-08-19

申请号：US12692685

申请日：2010-01-25

申请人： Klaus Roettger ,  Gerhard Heier

发明人： Klaus Roettger ,  Gerhard Heier

IPC分类号： B24B5/01 ,  B24B29/00 ,  B24B41/06

CPC分类号： B24B41/067 ,  B24B37/08

摘要： The invention relates to a carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers, comprising cutouts for receiving the semiconductor wafers and passage openings for a polishing agent supplied during the polishing. Some of the passage openings are formed by holes which have a diameter of 2 to 8 mm and are arranged at a distance of 1 to 10 mm around the cutouts, wherein the holes are arranged on two central sections and an inner or an outer section of a circular path.

摘要翻译： 本发明涉及一种用于在半导体晶片的双面抛光期间保持半导体晶片的载体，包括用于接收半导体晶片的切口和用于在抛光期间供应的抛光剂的通道开口。 一些通道开口由直径为2至8mm的孔形成，并且围绕切口布置在1至10mm的距离处，其中孔布置在两个中心部分上，内部或外部部分 圆形路径。