公开(公告)号：US10796959B2

公开(公告)日：2020-10-06

申请号：US15808211

申请日：2017-11-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC: B23K26/00 ,  B23K26/02 ,  H01L21/78 ,  B23K26/53 ,  B23K26/16 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/40 ,  B23K26/364 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/046 ,  B23K26/073 ,  B23K26/08 ,  B28D5/00 ,  C03B33/023 ,  C03B33/08 ,  C03B33/10 ,  C03C23/00 ,  B23K101/40 ,  B23K103/00 ,  G02F1/1368 ,  H01L21/683

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US09837315B2

公开(公告)日：2017-12-05

申请号：US14587677

申请日：2014-12-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC: B23K26/00 ,  H01L21/78 ,  B23K26/03 ,  B23K26/046 ,  B23K26/073 ,  B23K26/08 ,  B28D5/00 ,  C03B33/023 ,  C03B33/08 ,  C03B33/10 ,  C03C23/00 ,  B23K26/16 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/40 ,  B23K26/364 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K101/40 ,  G02F1/1368 ,  B23K103/00 ,  H01L21/683

CPC classification number: H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.