公开(公告)号：US12042883B2

公开(公告)日：2024-07-23

申请号：US18328183

申请日：2023-06-02

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  C08L63/00 ,  H01L21/683 ,  H01L23/00

CPC classification number: B23K35/025 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3613 ,  B32B27/00 ,  C08L63/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/205 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/83191 ,  H01L2224/8384

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

公开(公告)号：US11745294B2

公开(公告)日：2023-09-05

申请号：US15803137

申请日：2017-11-03

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  H01L23/00 ,  B32B27/00 ,  C08L63/00 ,  H01L21/683 ,  B23K35/30 ,  B23K35/36 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B15/08 ,  B32B27/38 ,  B32B15/20 ,  B32B27/40 ,  B32B27/30 ,  B32B27/20 ,  B32B27/28 ,  B32B27/08

CPC classification number: B23K35/025 ,  B23K35/302 ,  B23K35/3006 ,  B23K35/3033 ,  B23K35/3613 ,  B32B27/00 ,  C08L63/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/205 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/8384 ,  H01L2224/83191

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

公开(公告)号：US20230321765A1

公开(公告)日：2023-10-12

申请号：US18328183

申请日：2023-06-02

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  H01L23/00 ,  B32B27/00 ,  C08L63/00 ,  H01L21/683 ,  B23K35/30 ,  B23K35/36

CPC classification number: B23K35/025 ,  H01L24/27 ,  B32B27/00 ,  C08L63/00 ,  H01L24/29 ,  H01L21/6836 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3613 ,  H01L24/83 ,  B32B2307/202 ,  B32B2307/748 ,  B32B7/06

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.