公开(公告)号：US20240209166A1

公开(公告)日：2024-06-27

申请号：US18416190

申请日：2024-01-18

Applicant: Henkel AG & Co. KGaA

Inventor： Jie Bai ,  Qizhuo Zhuo ,  James Sungwook Jang ,  Kyu Chang Shim

IPC: C08J5/18 ,  C08J3/24 ,  C08K5/3445 ,  H01L23/29

CPC classification number: C08J5/18 ,  C08J3/24 ,  C08K5/3445 ,  H01L23/295 ,  C08J2363/10

Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.

公开(公告)号：US11745294B2

公开(公告)日：2023-09-05

申请号：US15803137

申请日：2017-11-03

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  H01L23/00 ,  B32B27/00 ,  C08L63/00 ,  H01L21/683 ,  B23K35/30 ,  B23K35/36 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B15/08 ,  B32B27/38 ,  B32B15/20 ,  B32B27/40 ,  B32B27/30 ,  B32B27/20 ,  B32B27/28 ,  B32B27/08

CPC classification number: B23K35/025 ,  B23K35/302 ,  B23K35/3006 ,  B23K35/3033 ,  B23K35/3613 ,  B32B27/00 ,  C08L63/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/205 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/8384 ,  H01L2224/83191

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

公开(公告)号：US12042883B2

公开(公告)日：2024-07-23

申请号：US18328183

申请日：2023-06-02

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  C08L63/00 ,  H01L21/683 ,  H01L23/00

CPC classification number: B23K35/025 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3613 ,  B32B27/00 ,  C08L63/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/205 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/83191 ,  H01L2224/8384

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

公开(公告)号：US20240174854A1

公开(公告)日：2024-05-30

申请号：US18418268

申请日：2024-01-20

Applicant: Henkel AG & Co. KGaA

Inventor： Jie Bai ,  James Sungwook Jang ,  Kyu Chang Shim ,  Qizhuo Zhuo

IPC: C08L63/00 ,  B29C39/00 ,  B29C39/38 ,  B29K63/00 ,  B29K105/16 ,  C08J5/18

CPC classification number: C08L63/00 ,  C08J5/18 ,  B29C39/003 ,  B29C39/38 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2995/0012 ,  B29K2995/0077 ,  C08J2363/00

Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.

公开(公告)号：US20240076488A1

公开(公告)日：2024-03-07

申请号：US18497762

申请日：2023-10-30

Applicant: Henkel AG & Co. KGaA

Inventor： Bo Xia ,  Qizhuo Zhuo ,  Xinpei Cao ,  Xuan Hong

IPC: C08L63/00 ,  C08K3/08 ,  C08K3/36 ,  C08K9/06 ,  H01B1/22

CPC classification number: C08L63/00 ,  C08K3/08 ,  C08K3/36 ,  C08K9/06 ,  H01B1/22 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005

Abstract: Provided herein is an electrically conductive composition capable of sintering. More particularly, the electrically conductive composition comprises sinterable silver particles dispersed in a binder resin, which binder resin is not yet in a fully cured state when the composition is heated to a temperature at which the silver particles start to sinter.

公开(公告)号：US20230321765A1

公开(公告)日：2023-10-12

申请号：US18328183

申请日：2023-06-02

Applicant: HENKEL AG & CO., KGaA

Inventor： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC: B23K35/02 ,  H01L23/00 ,  B32B27/00 ,  C08L63/00 ,  H01L21/683 ,  B23K35/30 ,  B23K35/36

CPC classification number: B23K35/025 ,  H01L24/27 ,  B32B27/00 ,  C08L63/00 ,  H01L24/29 ,  H01L21/6836 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3613 ,  H01L24/83 ,  B32B2307/202 ,  B32B2307/748 ,  B32B7/06

Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.