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公开(公告)号：US12042883B2
公开(公告)日：2024-07-23
申请号：US18328183
申请日：2023-06-02
发明人： Pukun Zhu , Shashi Gupta , Louis Rector , Qizhuo Zhuo
IPC分类号： B23K35/02 , B23K35/30 , B23K35/36 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/00 , B32B27/08 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/36 , B32B27/38 , B32B27/40 , C08L63/00 , H01L21/683 , H01L23/00
CPC分类号： B23K35/025 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3613 , B32B27/00 , C08L63/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/205 , B32B27/281 , B32B27/306 , B32B27/308 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2255/205 , B32B2264/102 , B32B2264/105 , B32B2264/12 , B32B2274/00 , B32B2307/202 , B32B2307/302 , B32B2307/542 , B32B2307/748 , B32B2457/14 , H01L2221/68327 , H01L2221/68377 , H01L2224/83191 , H01L2224/8384
摘要： Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.
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公开(公告)号：US11745294B2
公开(公告)日：2023-09-05
申请号：US15803137
申请日：2017-11-03
发明人： Pukun Zhu , Shashi Gupta , Louis Rector , Qizhuo Zhuo
IPC分类号： B23K35/02 , H01L23/00 , B32B27/00 , C08L63/00 , H01L21/683 , B23K35/30 , B23K35/36 , B32B7/06 , B32B7/12 , B32B27/36 , B32B15/08 , B32B27/38 , B32B15/20 , B32B27/40 , B32B27/30 , B32B27/20 , B32B27/28 , B32B27/08
CPC分类号： B23K35/025 , B23K35/302 , B23K35/3006 , B23K35/3033 , B23K35/3613 , B32B27/00 , C08L63/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/205 , B32B27/281 , B32B27/306 , B32B27/308 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2255/205 , B32B2264/102 , B32B2264/105 , B32B2264/12 , B32B2274/00 , B32B2307/202 , B32B2307/302 , B32B2307/542 , B32B2307/748 , B32B2457/14 , H01L2221/68327 , H01L2221/68377 , H01L2224/8384 , H01L2224/83191
摘要： Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.
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3.发明申请公开(公告)号：US20230114308A1
公开(公告)日：2023-04-13
申请号：US18073351
申请日：2022-12-01
申请人： Henkel AG & Co. KGaA
发明人： Sandeep Kapadia , Laxmisha M. Sridhar , Zhan Hang Yang , Pukun Zhu , Sarah Liao
IPC分类号： C09J163/00 , C09J173/02
摘要： Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydride and at least one difunctional anhydride and optionally at least one polyfunctional anhydride. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.
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公开(公告)号：US20230321765A1
公开(公告)日：2023-10-12
申请号：US18328183
申请日：2023-06-02
发明人： Pukun Zhu , Shashi Gupta , Louis Rector , Qizhuo Zhuo
CPC分类号： B23K35/025 , H01L24/27 , B32B27/00 , C08L63/00 , H01L24/29 , H01L21/6836 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3613 , H01L24/83 , B32B2307/202 , B32B2307/748 , B32B7/06
摘要： Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.
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