公开(公告)号：US20210296061A1

公开(公告)日：2021-09-23

申请号：US16605954

申请日：2017-06-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHUNG-HUA KU ,  CHI HAO CHANG ,  KUAN-TING WU

IPC: H01H13/14 ,  G06F3/02 ,  H01H13/86 ,  G05G1/02

Abstract: Example implementations relate to dampened keycaps. In an example, a dampened keycap includes a keycap, a link bar to contact the keycap, where the link bar includes a main body and an arm having a hooked portion forming a distal end of the link bar, and a dampening material disposed on a distal end of the link bar.

公开(公告)号：US20220066512A1

公开(公告)日：2022-03-03

申请号：US16763446

申请日：2018-02-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： HUI HE ,  HUI LENG LIM ,  CHI HAO CHANG ,  KUAN-TING WU

IPC: G06F1/16 ,  B32B15/06 ,  B32B25/10 ,  B32B7/12

Abstract: Examples include an apparatus comprising a laptop housing, an elastomer layer fixed on a surface of the laptop housing, and a fabric layer fixed on the elastomer layer.

公开(公告)号：US20200283648A1

公开(公告)日：2020-09-10

申请号：US16754122

申请日：2017-11-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YA-TING YEH ,  CHI HAO CHANG

IPC: C09D7/62 ,  C09D5/10 ,  C09D7/40 ,  H01Q1/42

Abstract: In one example, an electronic device housing is described, which may include a substrate having a surface and at least one waterborne metallic paint coating formed on the surface of the substrate. The at least one waterborne metallic paint coating may include an insulating material encapsulated metal powder in combination with at least one of a surface modified synthetic mica and a surface modified glass platelet.

公开(公告)号：US20180155846A1

公开(公告)日：2018-06-07

申请号：US15565485

申请日：2015-07-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  KUAN-TING WU ,  CHEN-TING LIN

IPC: C25D5/48 ,  B05D3/06 ,  B05D3/02 ,  B05D7/14 ,  C25D3/02

CPC classification number: C25D5/48 ,  B05D3/0254 ,  B05D3/067 ,  B05D7/14 ,  C09D123/02 ,  C25D3/02

Abstract: According to one example, forming a deposition layer on a magnesium alloy substrate and forming a cured coating on the deposition layer, where the cured coating is cured by ultra-violet radiation, heat at a cure temperature in a range from 60° C. to 140° C., or combinations thereof.

公开(公告)号：US20170312823A1

公开(公告)日：2017-11-02

申请号：US15519693

申请日：2015-01-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  CHIEN-TING LIN ,  KUAN-TING WU

IPC: B22F3/11 ,  H05K5/03 ,  B22F3/105 ,  B33Y80/00 ,  H05K5/04 ,  B33Y10/00

CPC classification number: B22F3/1115 ,  A45C2011/002 ,  A45C2011/003 ,  B22F3/1055 ,  B22F2003/1058 ,  B33Y10/00 ,  B33Y80/00 ,  G06F1/1656 ,  H04M1/185 ,  H05K5/03 ,  H05K5/04 ,  Y02P10/295

Abstract: One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.

公开(公告)号：US20210286426A1

公开(公告)日：2021-09-16

申请号：US16617905

申请日：2017-07-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  CHI HAO CHANG ,  YA-LING CHANG

IPC: G06F3/01 ,  H01L25/16 ,  H02P23/24 ,  G09G3/32

Abstract: An example micro light-emitting diode (LED) control device includes a substrate, a motor operatively connected to the substrate, a support stand connected to the motor, a support plate on the support stand, and a micro LED on the support plate, wherein the motor is set to rotate the support stand. The motor may rotate the support stand approximately 45° in each lateral direction with respect to a two-dimensional rotation plane. The support stand may include a sub-pixel driving circuit.

公开(公告)号：US20210126308A1

公开(公告)日：2021-04-29

申请号：US16605923

申请日：2017-06-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  CHENG-FENG LIAO ,  CHI HAO CHANG

IPC: H01M50/121

Abstract: Electronic devices comprising a polymeric material at least partially enclosed by an anodized metal are disclosed herein. The polymeric material can comprise a polymer composite, a carbon fiber composite, or mixtures thereof. The anodized metal can be selected from the group consisting of anodized aluminum, anodized aluminum alloy, anodized titanium, anodized titanium alloy, anodized zinc, anodized zinc alloy, anodized magnesium, anodized magnesium alloy, anodized niobium, anodized niobium alloy, anodized zirconium, anodized zirconium alloy, anodized hafnium, anodized hafnium alloy, anodized tantalum, anodized tantalum alloy, and combinations thereof.

公开(公告)号：US20210121952A1

公开(公告)日：2021-04-29

申请号：US16605766

申请日：2017-06-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  KUAN-TING WU ,  KUO CHIH HUANG ,  CHUNG HUA KU

IPC: B22F1/02 ,  B22F1/00 ,  C09D5/03 ,  C23C14/22 ,  C09D1/00 ,  B05D5/06 ,  B05D7/00 ,  H01Q1/40

Abstract: In an example, a device cover may comprise a substrate and a metal luster layer having a lustrous paint formulation applied to an outer surface of the substrate. The lustrous paint formulation may comprise base particles with surfaces partially coated with metal nanoparticles. The metal nanoparticles may be disposed in a non-continuous manner on the base particles.

公开(公告)号：US20180298499A1

公开(公告)日：2018-10-18

申请号：US15519697

申请日：2015-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  CHALAM KASHYAP ,  KUAN-TING WU

IPC: C23C28/02 ,  B32B15/01 ,  C23C24/10 ,  C25D11/04 ,  C23F17/00

Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.

公开(公告)号：US20230259179A1

公开(公告)日：2023-08-17

申请号：US18011493

申请日：2020-07-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： CHI HAO CHANG ,  HENDRY HUANG ,  KUAN-TING WU

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/40

CPC classification number: G06F1/1698 ,  G06F1/1656 ,  H01Q1/22 ,  H01Q1/40

Abstract: The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna is conformally carried by the recessed region and positioned at the opening.