公开(公告)号：US20230189465A1

公开(公告)日：2023-06-15

申请号：US17997173

申请日：2020-05-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chi Hao Chang

IPC: H05K5/03 ,  C09D5/00 ,  C09D7/41 ,  C09D7/45 ,  C25D11/02 ,  C25D11/24 ,  C25D11/30

CPC classification number: H05K5/03 ,  C09D5/002 ,  C09D7/41 ,  C09D7/45 ,  C25D11/026 ,  C25D11/30 ,  C25D11/243

Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.

公开(公告)号：US20230112533A1

公开(公告)日：2023-04-13

申请号：US17911575

申请日：2020-04-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Hsing-Hung Hsieh ,  Chi Hao Chang

IPC: H01L23/373 ,  H10K50/87 ,  H10K85/20 ,  H10K77/10 ,  H10K71/00

Abstract: The present disclosure is drawn to displays for electronic devices. In one example, the display includes a light emitting layer with an organic light emitting element. A porous substrate can be attached to the light emitting layer, wherein the porous substrate is flexible and spreads heat generated by the light emitting layer. A cover layer can be attached to a surface of the porous substrate opposite the light emitting layer.

公开(公告)号：US20230034431A1

公开(公告)日：2023-02-02

申请号：US17786619

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chi Hao Chang

IPC: H05K5/06 ,  H05K5/03

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.

公开(公告)号：US20230015912A1

公开(公告)日：2023-01-19

申请号：US17786633

申请日：2020-01-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Yung Yun Chen

IPC: H05K5/03 ,  B29C45/14 ,  B29C45/00 ,  C23C22/78 ,  C23C28/04 ,  C25D11/02 ,  C25D13/12 ,  H05K5/02 ,  G06F1/16

Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

公开(公告)号：US20230031605A1

公开(公告)日：2023-02-02

申请号：US17788361

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chien-Ting Lin

IPC: C25D11/30 ,  H04M1/02 ,  C25D11/02 ,  C25D11/24

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.

公开(公告)号：US20220148484A1

公开(公告)日：2022-05-12

申请号：US17419265

申请日：2019-07-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: G09G3/20 ,  G06F1/16

Abstract: In some examples, a display comprises a first side, where the first side comprises a first portion of pixels that emit light to the first side of the display and a second portion of pixels, where a first subset of the second portion of pixels emit light to the first side of the display, and a second side comprising a second subset of the second portion of pixels that emit light to the second side of the display, where the first portion of pixels has a pixel density and the second portion of pixels has a pixel density.

公开(公告)号：US20210190166A1

公开(公告)日：2021-06-24

申请号：US17046017

申请日：2018-09-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chung-Hua Ku ,  Chi Hao Chang

IPC: F16F1/36 ,  H01H13/14 ,  G11B33/08 ,  C08K5/09 ,  C08K3/36 ,  C08K3/04 ,  C08K13/02

Abstract: An energy dampener for use in an electronic device can include a carbon nanotube-aerogel matrix, including carbon nanotubes embedded in an aerogel and a rubber composited with the carbon nanotube-aerogel matrix.

公开(公告)号：US20210050279A1

公开(公告)日：2021-02-18

申请号：US16980518

申请日：2018-05-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chien-Ting Lin

IPC: H01L23/373 ,  B32B9/00 ,  B32B9/04 ,  B32B7/12

Abstract: The present subject matter relates to composite films for heat dissipation. In an example implementation of the present subject matter, a composite film for heat dissipation comprises a conductive material layer for thermal conduction of heat; and a polymer layer disposed over the conductive material layer to provide insulation from the heat.

公开(公告)号：US10537939B2

公开(公告)日：2020-01-21

申请号：US15519693

申请日：2015-01-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chi Hao Chang ,  Chien-Ting Lin ,  Kuan-Ting Wu

IPC: H05K3/36 ,  B22F3/11 ,  B22F3/105 ,  B33Y10/00 ,  B33Y80/00 ,  H05K5/03 ,  H05K5/04

Abstract: One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.

公开(公告)号：US11808316B2

公开(公告)日：2023-11-07

申请号：US17852782

申请日：2022-06-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chung-Hua Ku ,  Chi Hao Chang

IPC: F16F1/36 ,  C08K3/04 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: F16F1/3605 ,  C08K3/041 ,  C08K3/042 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00 ,  C08K2201/006 ,  C08K2201/011 ,  C08K2201/014 ,  F16F2224/02 ,  F16F2224/025 ,  F16F2226/04 ,  H01H2221/062

Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.