公开(公告)号：US20180250915A1

公开(公告)日：2018-09-06

申请号：US15758146

申请日：2015-11-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： KUAN-TING WU ,  CHIEN-LUNG YANG ,  CHENG-FENG LIAO

IPC: B32B15/088 ,  B21D26/021 ,  B21D26/055 ,  B21D26/059 ,  B29C70/86 ,  B32B1/02 ,  B32B15/082 ,  B32B15/09 ,  B32B15/14 ,  B32B15/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B3/28 ,  B32B7/12 ,  B32B37/10

CPC classification number: B32B15/088 ,  B21D26/021 ,  B21D26/055 ,  B21D26/059 ,  B29C70/088 ,  B29C70/86 ,  B29K2705/00 ,  B32B1/02 ,  B32B3/28 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/09 ,  B32B15/14 ,  B32B15/20 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/308 ,  B32B27/34 ,  B32B27/365 ,  B32B37/10 ,  B32B37/12 ,  B32B38/1866 ,  B32B2037/1223 ,  B32B2250/02 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2305/22 ,  B32B2307/50 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/18 ,  B32B2311/24 ,  B32B2313/04

Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.

公开(公告)号：US20180217633A1

公开(公告)日：2018-08-02

申请号：US15746123

申请日：2015-09-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： CHUNG-HUA KU ,  WEI-CHUNG CHEN ,  WEN-HUA NI ,  KUAN-TING WU

IPC: G06F1/16 ,  H05K5/02

CPC classification number: G06F1/166 ,  G06F1/1626 ,  G06F1/1681 ,  H05K5/0234

Abstract: In one example, a kickstand for a mobile computing device is described. The kickstand having a first end and a second end opposite the first end to rotatably couple to a first side and a second side of a housing of the mobile computing device, respectively, proximate the middle of the first side and the second side of the housing such that the U shaped kickstand provides the space for disposing the components in the housing without significantly affecting form factors and/or aesthetic aspects of the mobile computing device in typing, inking and retracted modes.

公开(公告)号：US20190177858A1

公开(公告)日：2019-06-13

申请号：US16323088

申请日：2016-10-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： YOUNG-JUN LI ,  KUAN-TING WU ,  XIAO-JUN ZHU

IPC: C23C28/00

Abstract: Examples relating to coating an alloy substrate are described. For example, techniques for treating a surface of the alloy substrate for coating the alloy substrate with an exterior coat include providing an alloy substrate of a die-casted metal alloy, the alloy substrate having a surface with multiple pores, and applying an electrically conductive layer on the surface of the alloy substrate. The electrically conductive surface is composed of metal particles and electrically conductive polymers, and the electrically conductive layer is applied such that the metal particles fill the multiple pores on the surface of the alloy substrate. Thereafter, an oxidation process is performed on the surface to form an oxidation layer over the surface. The oxidation layer provides for adhesion of the surface with the exterior coat.

公开(公告)号：US20180129084A1

公开(公告)日：2018-05-10

申请号：US15563241

申请日：2015-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： KUAN-TING WU ,  WEI KUANG CHU ,  CHENG-HUA YU

IPC: G02F1/1334

CPC classification number: G02F1/1334 ,  G02F2001/13756

Abstract: In one example in accordance with the present disclosure a device is described. The device includes a first electrode. The device also includes a second electrode. The device also includes multiple polymer dispersed liquid crystals (PDLCs). The multiple PDLCs are disposed between the first and the second electrode and are of varying height.