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    ULTRASOUND IMAGING APPARATUS, AND SURGICAL OPERATION SUPPORT SYSTEM AND METHOD USING THE SAME
    1.
    发明申请
    ULTRASOUND IMAGING APPARATUS, AND SURGICAL OPERATION SUPPORT SYSTEM AND METHOD USING THE SAME 有权

    公开(公告)号：US20210369121A1

    公开(公告)日：2021-12-02

    申请号：US17215187

    申请日：2021-03-29

    Applicant: Hitachi, Ltd.

    Inventor： Tomohiko TANAKA ,  Teiichiro IKEDA ,  Ryo IMAI ,  Hirozumi TAKESHIMA

    IPC: A61B5/00 ,  B06B1/06 ,  A61B90/00 ,  A61B90/50 ,  A61N7/00

    Abstract: Provided are an ultrasound imaging apparatus and a surgical operation support system for obtaining position information of a device outside an imaging area and presenting the position information to a user together with an ultrasound image. The surgical operation support system includes the ultrasound imaging apparatus, an ultrasonic source fixed to a therapeutic tool to be inserted into a subject body, a display device for displaying the ultrasound image and the position of the ultrasonic source. The ultrasound imaging apparatus is provided with a position estimator for estimating the position information of the ultrasonic source, and the position estimator analyzes a grating lobe artifact (false image) that is generated by the ultrasonic wave emitted from the ultrasonic source outside the imaging area, to estimate the position information of the ultrasonic source with respect to the imaging area.

    ULTRASONIC WAVE IMAGING APPARATUS, THERAPY SUPPORT SYSTEM, AND IMAGE DISPLAY METHOD
    4.
    发明申请
    ULTRASONIC WAVE IMAGING APPARATUS, THERAPY SUPPORT SYSTEM, AND IMAGE DISPLAY METHOD 有权

    公开(公告)号：US20210369352A1

    公开(公告)日：2021-12-02

    申请号：US17233904

    申请日：2021-04-19

    Applicant: HITACHI, LTD.

    Inventor： Hirozumi TAKESHIMA ,  Tomohiko TANAKA ,  Ryo IMAI

    IPC: A61B34/20 ,  A61B8/08 ,  A61B8/12 ,  A61B8/00 ,  G16H30/40 ,  G16H20/40

    Abstract: An ultrasonic wave imaging apparatus is disclosed, including: an ultrasonic probe for irradiating a subject with an ultrasonic wave and receive a reflected wave of the ultrasonic wave and receiving an ultrasonic wave from a beacon inserted into the subject; a probe position-acquiring unit for acquiring a 3D position and an orientation of the ultrasonic probe; a beacon location-acquiring unit for determining a 3D location of the beacon from relative location and speed of the beacon relative to the ultrasonic probe as calculated from an ultrasonic wave image received at the ultrasonic probe and the 3D position and the orientation of the ultrasonic probe as acquired by the probe position-acquiring unit; and a display image formation section for using the ultrasonic wave image of the ultrasonic waves from the ultrasonic probe to form a display image. A corresponding method is also disclosed.

    ULTRASONIC IMAGING DEVICE, TREATMENT SUPPORT SYSTEM, AND IMAGE PROCESSING METHOD
    7.
    发明申请
    ULTRASONIC IMAGING DEVICE, TREATMENT SUPPORT SYSTEM, AND IMAGE PROCESSING METHOD 有权

    公开(公告)号：US20210378632A1

    公开(公告)日：2021-12-09

    申请号：US17416707

    申请日：2020-01-07

    Applicant: Hitachi, Ltd.

    Inventor： Tomohiko TANAKA ,  Ryo IMAI ,  Misaki HIROSHIMA ,  Kenichi KAWABATA ,  Hiroshi KURIBARA

    IPC: A61B8/12 ,  A61B8/00 ,  A61B8/08 ,  A61B17/34

    Abstract: In a transcatheter treatment support technique using a combination of a guide wire equipped with a photoacoustic technique and an ultrasonic imaging device, the ultrasonic imaging device estimates a front edge position of the guide wire using a difference between arrival times of photoacoustic waves arriving at an array of elements configuring an ultrasonic probe or a change of an image of the photoacoustic generation source, which depends on a distance of the photoacoustic generation source from an imaging region, and grasps a relationship between an imaging position and the front edge position of the guide wire using the estimation result. This enables visually grasping a relationship between a region (imaging region) from which an image is able to be obtained with reflective waves from a biological body with use of the ultrasonic probe and an insertion object present outside the region, particularly, the front edge of the guide wire.

    Guidewire Connector and Ultrasonic Imaging Apparatus
    8.
    发明申请
    Guidewire Connector and Ultrasonic Imaging Apparatus 有权

    公开(公告)号：US20210015369A1

    公开(公告)日：2021-01-21

    申请号：US16883335

    申请日：2020-05-26

    Applicant: Hitachi, Ltd.

    Inventor： Ryo IMAI ,  Tomohiko TANAKA

    IPC: A61B5/00 ,  G02B6/42 ,  G02B6/38

    Abstract: Provided is a guidewire connector that does not interfere with an introduction of another in-body insertion instrument and is capable of maintaining cleanliness of the guidewire when connecting a guidewire mounted with a photo-acoustic ultrasonic wave generator. The guidewire connector according to the present disclosure includes an adapter member detachably attached to an light emitting apparatus, and a wire fixing member attaching the guidewire to the adapter member, in which the wire fixing member has an outer diameter equal to or smaller than an outer diameter of the guidewire.

    ULTRASONIC EXAMINATION DEVICE AND ULTRASONIC PROBE
    9.
    发明申请
    ULTRASONIC EXAMINATION DEVICE AND ULTRASONIC PROBE 审中-公开

    公开(公告)号：US20190321000A1

    公开(公告)日：2019-10-24

    申请号：US16245605

    申请日：2019-01-11

    Applicant: HITACHI, LTD.

    Inventor： Taiichi TAKEZAKI ,  Hiroaki HASEGAWA ,  Shuntaro MACHIDA ,  Ryo IMAI ,  Tomohiko TANAKA

    IPC: A61B8/00 ,  B06B1/02 ,  H04R19/00

    Abstract: Performance of an ultrasonic examination device, which includes an ultrasonic sensor of a capacitance detection type including a cavity between electrodes and vibrating a membrane, is enhanced. A cell which is a capacitive type device provided with a lower electrode, a cavity, and an upper electrode in a membrane, which are stacked in a longitudinal direction, and a condenser provided with the lower electrode and an upper electrode which are stacked in the longitudinal direction, are formed in one semiconductor chip. The cell and the condenser are connected to each other in parallel, and, when ultrasonic waves are transmitted and received using the cell, connection between a DC bias power source and the semiconductor chip is blocked, and a direct current voltage is applied to the cell from the condenser.

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