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1.发明申请公开(公告)号：US20170370752A1
公开(公告)日：2017-12-28
申请号：US15638171
申请日：2017-06-29
发明人： Shinobu TASHIRO , Keiji HANZAWA , Noboru TOKUYASU , Takeshi MORINO , Ryosuke DOI , Akira UENODAN
IPC分类号： G01F1/684 , G01F15/02 , G01F15/00 , G01F1/699 , F02D41/18 , G01F1/698 , G01F1/696 , G01F15/04 , G01F5/00
CPC分类号： G01F1/6842 , F02D41/187 , G01F1/6845 , G01F1/696 , G01F1/6965 , G01F1/698 , G01F1/699 , G01F5/00 , G01F15/006 , G01F15/02 , G01F15/04 , G01F15/043
摘要： Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter. The thermal flow meter includes a bypass passage through which a measurement target gas 30 flowing through a main passage flows, and a circuit package 400 which includes a measurement circuit for measuring a flow rate of the measurement target gas 30 flowing through the bypass passage and a temperature detecting portion 452 for detecting a temperature of the measurement target gas. The circuit package 400 includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion 424 molded by the resin. The temperature detecting portion 452 is provided in the leading end portion of the protrusion 424, and at least the leading end portion of the protrusion protrudes to the outside from a housing 302.
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公开(公告)号：US20170336232A1
公开(公告)日：2017-11-23
申请号：US15659309
申请日：2017-07-25
发明人： Shinobu TASHIRO , Keiji HANZAWA , Noboru TOKUYASU , Takeshi MORINO , Ryosuke DOI , Akira UENODAN
摘要： It is an object of the present invention to improve a measurement accuracy of a thermal flowmeter. A circuit package 401 is such that a measurement surface 430 and a backside of measurement surface 431 of a rear surface thereof are located in a bypass passage, and the bypass passage is configured to allow a measurement target gas 30 to flow upon dividing the measurement target gas 30 into a flow path 386 at a side of the measurement surface 430 of the circuit package and a flow path 387 at a side of the backside of measurement surface 431 of a rear surface of the measurement surface 430, and an inflow-side end surface of the circuit package for dividing the measurement target gas 30 has different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gas 30 is formed with a reference line 700 dividing the measurement target gas 30, and an end surface 701a at the side of the measurement surface with respect to the reference line and an end surface 701b at the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.
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公开(公告)号：US20160161312A1
公开(公告)日：2016-06-09
申请号：US14907118
申请日：2014-02-03
CPC分类号： G01F1/684 , G01F1/6842 , G01F1/692 , G01F5/00 , G01F15/14
摘要： An object of the present invention is to provide a thermal-type air flow meter with a high measurement accuracy by reducing influence of a thermal stress generated in a resistor in an LSI while securing a high positioning accuracy flow rate detection unit. Thus, a thermal-type air flow meter is provided with: a sensor assembly 100 including an LSI 3 having a resistor 7 and a flow rate detection unit 4a which are configured by insert molding so as to expose at least a part of the flow rate detection unit 4a, a housing 301 which has secondary passages 305i, 305o and 305s, and houses the sensor assembly 100 by allowing the flow rate detection unit 4a to be arranged in the secondary passage 305s, the sensor assembly 100 being molded using a first resin, and the housing 301 being molded using a second resin, the sensor assembly 100 being fixed to the housing 301 using the second resin; and resin structures 20 and 21 which cause a tensile stress in a direction parallel to a surface on which the flow rate detection unit 4a is exposed with respect to the sensor assembly 100.
摘要翻译： 本发明的目的是提供一种在确保高定位精度的流量检测单元的同时，通过减小在LSI中的电阻器中产生的热应力的影响来提供具有高测量精度的热式空气流量计。 因此，热式空气流量计设置有：传感器组件100，其包括具有电阻器7和流量检测单元4a的LSI 3，其通过嵌件成型构成，以暴露至少一部分流量 检测单元4a，具有次级通道305i，305o和305s的壳体301，并且通过允许流量检测单元4a布置在次通道305s中来容纳传感器组件100，传感器组件100使用第一树脂 并且壳体301使用第二树脂模制，传感器组件100使用第二树脂固定到壳体301; 以及在平行于流量检测单元4a相对于传感器组件100露出的表面的方向上引起拉伸应力的树脂结构20和21。
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公开(公告)号：US20170345776A1
公开(公告)日：2017-11-30
申请号：US15621053
申请日：2017-06-13
发明人： Shinobu TASHIRO , Keiji HANZAWA , Noboru TOKUYASU , Takeshi MORINO , Ryosuke DOI , Akira UENODAN
IPC分类号： H01L23/00 , G01F1/684 , H01L23/10 , G01M15/10 , G01F15/18 , G01F1/696 , G01F15/04 , F02D41/18 , G01F15/00 , G01F5/00 , G01F1/699 , G01F1/698 , G01F15/02 , G01F15/14
CPC分类号： H01L23/564 , F02D41/187 , G01F1/684 , G01F1/6842 , G01F1/6845 , G01F1/696 , G01F1/6965 , G01F1/698 , G01F1/699 , G01F5/00 , G01F15/006 , G01F15/02 , G01F15/04 , G01F15/043 , G01F15/14 , G01F15/185 , G01M15/10 , H01L23/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00 , H01L2924/00014
摘要： Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.
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公开(公告)号：US20160011029A1
公开(公告)日：2016-01-14
申请号：US14771093
申请日：2014-01-27
CPC分类号： G01F1/6842 , B23K26/324 , B23K33/004 , B23K2103/30 , B29C65/1612 , B29C65/1635 , B29C65/1654 , B29C65/1677 , B29C66/12449 , B29C66/12469 , B29C66/242 , B29C66/244 , B29C66/3242 , B29C66/326 , B29C66/53462 , B29C66/71 , B29C66/7212 , B29C66/73161 , B29C66/73776 , B29C66/7392 , B29C66/73921 , B29C66/81267 , B29L2031/3481 , B29K2507/04 , B29K2309/08 , B29K2081/06 , B29K2079/08 , B29K2071/00 , B29K2069/00 , B29K2067/003 , B29K2067/00 , B29K2059/00 , B29K2055/02 , B29K2033/12 , B29K2027/18 , B29K2027/08 , B29K2027/06 , B29K2025/08 , B29K2025/06 , B29K2023/38 , B29K2023/12 , B29K2023/06
摘要： Provided are a laser-welded structure and a laser welding method for a cover and a housing ensuring high reliability and suppressing changes in characteristics due to burrs protruding into a subpassage of the flow sensor. To this end, this flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that there are projections provided on both ends of the joining section of the cover where the housing and the cover are laser-welded, and the height of the projection on the subpassage side is greater than the height of the projection on the side opposite of the subpassage.
摘要翻译： 本发明提供了一种用于盖子和壳体的激光焊接结构和激光焊接方法，其确保了高可靠性并且抑制了由于流入传感器的副通道中的毛刺引起的特性的变化。 为此，该流量传感器设置有壳体，盖子，密封在它们之间的电路室和壳体电子部件或布线，以及流体流过待检测的子通道，其特征在于，存在 设置在盖的接合部分的两端处的突起，其中壳体和盖被激光焊接，并且突出部在子通路侧的高度大于在突出部分的相对侧的突出部的高度。
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公开(公告)号：US20150377670A1
公开(公告)日：2015-12-31
申请号：US14769573
申请日：2014-02-07
CPC分类号： G01F1/6842 , B29C65/1612 , B29C65/1635 , B29C65/1654 , B29C65/1677 , B29C66/112 , B29C66/114 , B29C66/124 , B29C66/242 , B29C66/244 , B29C66/322 , B29C66/53462 , B29C66/652 , B29C66/71 , B29C66/7212 , B29C66/73772 , B29C66/73776 , B29C66/73921 , B29C66/73941 , B29C66/934 , B29K2105/0079 , B29L2031/3481 , G01F1/684 , G01F5/00 , B29K2067/006 , B29K2077/00 , B29K2081/04 , B29K2309/08 , B29K2025/06 , B29K2055/02 , B29K2079/085 , B29K2069/00 , B29K2033/12 , B29K2023/38 , B29K2081/06 , B29K2027/06 , B29K2027/08 , B29K2023/06 , B29K2023/12 , B29K2059/00 , B29K2067/003 , B29K2071/00 , B29K2027/18 , B29K2063/00 , B29K2025/08 , B29K2067/00
摘要： Provided is a low-cost flow sensor which improves productivity while maintaining high quality and high reliability. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be detected, and is characterized in that the welding width of a first welded portion forming the circuit chamber is greater than the welding width of a part of the second welded portion forming the subpassage unit.
摘要翻译： 提供了一种低成本流量传感器，其在保持高质量和高可靠性的同时提高生产率。 该流量传感器设置有壳体，盖子，密封在它们之间的电路室和壳体电子部件或布线，以及流体流过待检测的子通道，其特征在于，第一 形成电路室的焊接部分大于形成子通道部件的第二焊接部分的一部分的焊接宽度。
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7.发明申请Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 审中-公开流量传感器及其制造方法及其流程传感器模块及其制造方法公开(公告)号：US20140190273A1
公开(公告)日：2014-07-10
申请号：US14210787
申请日：2014-03-14
发明人： Tsutomu KONO , Keiji HANZAWA , Takeshi MORINO , Yuki OKAMOTO , Noboru TOKUYASU , Shinobu TASHIRO
IPC分类号： G01F1/38
CPC分类号： G01F1/383 , G01F1/34 , G01F1/6845 , G01F1/692 , G01F1/698 , G01F5/00 , H01L2224/48227 , H01L2224/73265 , H01L2924/10157 , H01L2924/15151 , H01L2924/15153
摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
摘要翻译： 提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中，在半导体芯片CHP1上形成的流量检测单元（FDU）露出的状态下，半导体芯片CHP1的外部被配置为被树脂（MR）覆盖。 由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。 此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。
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公开(公告)号：US20200240822A1
公开(公告)日：2020-07-30
申请号：US16848978
申请日：2020-04-15
发明人： Noboru TOKUYASU , Shinobu TASHIRO , Keiji HANZAWA , Takeshi MORINO , Ryosuke DOI , Akira UENODAN
摘要： The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).
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公开(公告)号：US20180274959A1
公开(公告)日：2018-09-27
申请号：US15995410
申请日：2018-06-01
发明人： Noboru TOKUYASU , Shinobu TASHIRO , Keiji HANZAWA , Takeshi MORINO , Ryosuke DOI
CPC分类号： G01F1/692 , F01N11/002 , F01N2560/07 , F02D41/187 , G01F1/684 , G01F5/00 , G01F15/04
摘要： A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.
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公开(公告)号：US20180252564A1
公开(公告)日：2018-09-06
申请号：US15971078
申请日：2018-05-04
发明人： Shinobu TASHIRO , Keiji HANZAWA , Noboru TOKUYASU , Takeshi MORINO , Ryosuke DOI
摘要： In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.
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