公开(公告)号：US20130252426A1

公开(公告)日：2013-09-26

申请号：US13891064

申请日：2013-05-09

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yousuke HOSHI ,  Daisuke RYUZAKI ,  Naoyuki KOYAMA ,  Shigeru NOBE

IPC分类号： H01L21/306

CPC分类号： C09G1/02 ,  B24B37/044 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/76224

摘要： Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.

公开(公告)号：US20170009102A1

公开(公告)日：2017-01-12

申请号：US15274812

申请日：2016-09-23

申请人： Hitachi Chemical Company, Ltd.

发明人： Yousuke HOSHI ,  Daisuke RYUZAKI ,  Naoyuki KOYAMA ,  Shigeru NOBE

IPC分类号： C09G1/02 ,  H01L21/3105 ,  C09K3/14

CPC分类号： C09G1/02 ,  B24B37/044 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/76224

摘要： Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.

摘要翻译： 公开了一种抛光剂，其包括：水; 四价金属氢氧化物颗粒; 和添加剂，其中所述添加剂含有阳离子聚合物和阳离子多糖中的至少一种。 本发明可以提供一种抛光剂，其能够在平坦化绝缘膜的CMP技术中以高速抛光较少的抛光缺陷并且具有高的氧化硅膜和阻挡膜的抛光速率比的抛光剂 。 本发明还可以提供用于储存抛光剂的抛光剂组，以及使用该研磨剂研磨基材的方法。

公开(公告)号：US20150325431A1

公开(公告)日：2015-11-12

申请号：US14438744

申请日：2013-10-09

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yu AOKI ,  Shigeru NOBE ,  Hiroshi MATSUTANI ,  Kei KASUYA ,  Akitoshi TANIMOTO ,  Shingo TAHARA

IPC分类号： H01L21/027 ,  G03F7/40 ,  G03F7/038

CPC分类号： H01L21/0274 ,  C08F8/12 ,  C08F12/22 ,  C08F112/14 ,  C08F212/14 ,  C08F2800/10 ,  C08L25/18 ,  C09D125/18 ,  G03F7/0233 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/40 ,  H01L21/02118 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/5329 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05018 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2924/00014 ,  H01L2924/014 ,  C08F212/08 ,  C08L33/08 ,  C08F2220/1825 ,  C08F220/06 ,  C08F2220/1883 ,  C08F220/20 ,  C08F226/06 ,  C08F220/34

摘要： Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.

摘要翻译： 公开了一种感光性树脂组合物，其包含（A）具有下述式（1）所示的结构单元的碱溶性树脂，（B）通过光产生酸的化合物，（C）热交联剂和（C） D）具有由下式（2）表示的结构单元的丙烯酸树脂：其中R1表示氢原子或甲基; R 2表示碳原子数1〜10的烷基等。 a表示0〜3的整数，b表示1〜3的整数，a和b的合计为5以下，R 3表示氢原子或甲基。 R 4表示碳原子数2〜20的羟烷基。