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    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE
    1.
    发明申请
    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE 审中-公开
    缺陷检查方法和缺陷检查装置

    公开(公告)号：US20160161422A1

    公开(公告)日：2016-06-09

    申请号：US15042598

    申请日：2016-02-12

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Shunichi MATSUMOTO ,  Atsushi TANIGUCHI ,  Toshifumi HONDA ,  Yukihiro SHIBATA ,  Yuta URANO

    IPC: G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2201/126 ,  G01N2201/127 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A defect inspection method and device for irradiating a linear region on a surface-patterned sample mounted on a table, with illumination light from an inclined direction to the sample, next detecting in each of a plurality of directions an image of the light scattered from the sample irradiated with the illumination light, then processing signals obtained by the detection of the images of the scattered light, and thereby detecting a defect present on the sample; wherein the step of detecting the scattered light image in the plural directions is performed through oval shaped lenses in which elevation angles of the optical axes thereof are different from each other, within one plane perpendicular to a plane formed by the normal to the surface of the table on which to mount the sample and the longitudinal direction of the linear region irradiated with the irradiation light.

    Abstract translation: 一种缺陷检查方法和装置，用于将安装在台上的表面图案样品上的线性区域照射到具有来自倾斜方向的样品的照明光，并在多个方向上检测从所述多个方向散射的光的图像 用照射光照射的样品，然后处理通过检测散射光的图像获得的信号，从而检测样品上存在的缺陷; 其特征在于，通过椭圆形透镜，其光轴的仰角彼此不同，在垂直于由所述平面形成的法线形成的平面的一个平面内，通过椭圆形透镜来检测多个方向上的散射光图像的步骤 用于安装样品的台面和用照射光照射的线性区域的纵向方向。

    DEFECT INSPECTION DEVICE, PATTERN CHIP, AND DEFECT INSPECTION METHOD
    2.
    发明申请
    DEFECT INSPECTION DEVICE, PATTERN CHIP, AND DEFECT INSPECTION METHOD 审中-公开

    公开(公告)号：US20190107498A1

    公开(公告)日：2019-04-11

    申请号：US16080283

    申请日：2016-03-02

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuta URANO ,  Yukihiro SHIBATA ,  Toshifumi HONDA ,  Yasuhiro YOSHITAKE ,  Hideki FUKUSHIMA

    IPC: G01N21/956 ,  G01N21/88 ,  G01N21/47 ,  G06T7/00

    Abstract: In a defect inspection device that irradiates a surface of a sample or a surface of a pattern chip with an illumination light shaped to extend in a first direction, and detects a scattered light generated from the surface of the sample or the surface of the pattern chip by the illumination light to detect a defect on the surface of the sample, the pattern chip has a dot pattern area in which multiple dots are arrayed in multiple rows and multiple columns, a minimum interval between the dots corresponding to the lines aligned in the first direction among the multiple dots arrayed in the dot pattern area in a second direction orthogonal to the first direction is smaller than a width of the illumination light, and a minimum interval between the multiple dots arrayed in the dot pattern area is larger than a resolution of the detection optical system.

    Defect Inspection Method and Defect Inspection Device
    3.
    发明申请
    Defect Inspection Method and Defect Inspection Device 有权
    缺陷检查方法和缺陷检测装置

    公开(公告)号：US20150276623A1

    公开(公告)日：2015-10-01

    申请号：US14638305

    申请日：2015-03-04

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Yuta URANO ,  Toshifumi HONDA ,  Yukihiro SHIBATA

    IPC: G01N21/956 ,  G01N21/95 ,  G01N21/21

    CPC classification number: G01N21/956 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8848 ,  G01N2021/9513 ,  G01N2021/95638

    Abstract: To detect a bridge defect between lines of a line pattern formed on a sample at pitches narrower than the wavelength of inspection light, a defect inspection device is configured to comprise: a light source which emits laser; a vertical illumination unit which applies the laser to the sample from a vertical direction via an objective lens by converting the laser into linearly polarized light by using a polarization conversion unit in a state polarized in a direction orthogonal to the longitudinal direction of the line pattern; an oblique illumination unit which applies the laser to the sample from an oblique direction; a detection optical unit including an optical filter which selectively transmits a scattered light component from the defect by converting the polarization state of the reflected/scattered light; and a signal processing unit which detects the defect on the sample by processing a detection signal.

    Abstract translation: 为了以窄于检查光的波长的间距检测在样品上形成的线图案的线之间的桥缺陷，缺陷检查装置被配置为包括：发射激光的光源; 垂直照明单元，其通过使用偏振转换单元在与线图案的纵向方向正交的方向上偏振的状态下将激光转换成线偏振光，通过物镜将垂直方向的激光施加到样本; 倾斜照明单元，其从倾斜方向向样品施加激光; 检测光学单元，包括：滤光器，其通过转换所述反射/散射光的偏振状态来选择性地透射来自所述缺陷的散射光分量; 以及信号处理单元，其通过处理检测信号来检测样本上的缺陷。

    DEFECT INSPECTION APPARATUS AND PATTERN CHIP
    4.
    发明申请
    DEFECT INSPECTION APPARATUS AND PATTERN CHIP 审中-公开

    公开(公告)号：US20200182804A1

    公开(公告)日：2020-06-11

    申请号：US16628381

    申请日：2017-07-18

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Yuta URANO ,  Toshifumi HONDA ,  Akio YAZAKI ,  Yukihiro SHIBATA ,  Hideki FUKUSHIMA ,  Yasuhiro YOSHITAKE

    IPC: G01N21/956 ,  G01N21/47

    Abstract: As a technique to improve processing efficiency of defect inspection by quickly adjusting a position of a detection system, provided is a defect inspection apparatus including: a stage that moves with a sample and a pattern substrate placed thereon; an illumination optical system that irradiates an object on the stage from a direction inclined from the normal direction of the pattern substrate; a first detection optical system that detects scattered light in the normal direction; a second detection optical system that detects scattered light in a direction different from the scattered light detected by the first detection optical system; a signal processing unit that processes both scattered light signals; and a control unit. The control unit implements first adjustment processing of adjusting a focal position of the first or the second detection optical system and a three-dimensional position of each detector with respect to an illumination region by using a scattered light signal and second adjustment processing of adjusting a focal point by changing a position in an optical axis direction of a detector of the first or the second detection optical system and a position in a height direction of the stage, and implements the second adjustment processing at a higher frequency than the first adjustment processing.

    DEFECT INSPECTION METHOD AND DEVICE USING SAME
    7.
    发明申请
    DEFECT INSPECTION METHOD AND DEVICE USING SAME 审中-公开
    缺陷检查方法和使用相同的设备

    公开(公告)号：US20160305893A1

    公开(公告)日：2016-10-20

    申请号：US15132812

    申请日：2016-04-19

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Yukihiro SHIBATA ,  Hideki FUKUSHIMA ,  Yuta URANO ,  Toshifumi HONDA

    IPC: G01N21/956 ,  H04N5/225 ,  G06T7/00 ,  H04N5/247 ,  G01N21/95 ,  G01N21/47

    CPC classification number: G01N21/956 ,  G01N21/47 ,  G01N21/9501 ,  G01N2021/1765 ,  G01N2201/06113 ,  G01N2201/0636 ,  G06T7/001 ,  G06T7/32 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N5/247

    Abstract: A defect inspection device inspecting a sample includes a movable table on which the sample as an inspection object and a pattern chip are mounted, an illumination light irradiation unit which irradiates a surface of the sample or a surface of the pattern chip with linearly-formed illumination light, a detection optical system section where a plurality of detection optical systems are disposed at a plurality of positions above the table and which detect images of scattered light generated from the sample, and a signal processing unit which processes detected signals to detect a defect of the sample surface, and a plurality of repeating patterns for generating the scattered light according to positions of the objective lenses of the plurality of detection optical systems of the detection optical system section when the linearly-formed illumination light is irradiated by the illumination light irradiation unit are periodically formed in the pattern chip.

    Abstract translation: 检查样本的缺陷检查装置包括：作为检查对象的样本和图案芯片安装在其上的可移动台，照射光照射单元，其以线性形成的照射照射样品的表面或图案芯片的表面 光，检测光学系统部分，其中多个检测光学系统设置在工作台上方的多个位置处，并且检测从样本产生的散射光的图像;以及信号处理单元，其处理检测到的信号以检测缺陷 样品表面和多个重复图案，用于当由照明光照射单元照射线性形成的照明光时，根据检测光学系统部分的多个检测光学系统的物镜的位置产生散射光 周期性地形成在图案芯片中。

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