公开(公告)号：US20120055700A1

公开(公告)日：2012-03-08

申请号：US13223509

申请日：2011-09-01

申请人： Hakaru Horiguchi ,  Noritsugu Daigaku ,  Takahiro Nonaka ,  Rie Kuwahara

发明人： Hakaru Horiguchi ,  Noritsugu Daigaku ,  Takahiro Nonaka ,  Rie Kuwahara

IPC分类号： H05K1/02 ,  B32B7/10

CPC分类号： C09J133/02 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  Y10T428/2848

摘要： Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.

摘要翻译： 提供一种双面粘合带，用于固定在低压下粘合之后具有优异的粘合力的柔性印刷电路板，以及在高温步骤处理之后的排斥电阻。 根据本发明的用于固定柔性印刷电路板的双面压敏粘合带具有180°的剥离粘合力，这通过将粘合带通过10g辊的一个往复运动在压力下粘合到不锈钢板上而​​确定 将其静置5分钟，以300mm /分钟的拉伸速度测定为6.5N / 20mm以上，回流后的终端间隔距离为2.5mm以下。

公开(公告)号：US20100209649A1

公开(公告)日：2010-08-19

申请号：US12656802

申请日：2010-02-17

申请人： Rie Kuwahara ,  Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

发明人： Rie Kuwahara ,  Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

IPC分类号： B32B27/32 ,  B32B33/00

CPC分类号： C09J133/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2457/08 ,  C09J7/22 ,  C09J7/385 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6835 ,  H05K3/0058 ,  Y10T428/14 ,  Y10T428/1452

摘要： Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 μm, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 μm or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component.

摘要翻译： 公开了一种双面压敏粘合片，其至少包括含有塑料基膜的压敏粘合剂单元，并且在其两面上存在压敏粘合剂层; 和存在于压敏粘合剂单元的两个表面上的非硅氧烷剥离衬垫。 压敏粘合剂层各自由丙烯酸类聚合物形成，所述丙烯酸类聚合物含有作为必需单体成分的烷基部分为碳原子数为2〜14的直链或支链烷基和极性基团的烷基（甲基）丙烯酸烷基酯， 含有单体。 压敏粘合剂单元具有60至160μm的厚度，并且压敏粘合单元的两个压敏粘合剂层中的每一个具有20μm以上的厚度。 粘合片在凸起附近的加工性和适配性优异，并且可用于固定柔性印刷电路板或固定硬盘驱动部件。

公开(公告)号：US20120111612A1

公开(公告)日：2012-05-10

申请号：US13382377

申请日：2010-06-23

申请人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

发明人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

IPC分类号： H05K1/00 ,  C09J133/08 ,  C08F220/10

CPC分类号： C09J161/14 ,  C08G8/36 ,  C08L33/08 ,  C08L61/14 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  H01L2924/00013 ,  H05K3/386 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)−(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.

摘要翻译： 本发明提供一种具有热固性粘合剂层的热固性粘合带或片材，其可以在室温下稳定地储存，并且当热固化时，可以在暴露于热和潮湿之后发挥优异的粘合性和高的热稳定性，因为树脂在 粘合剂在固化时迅速反应。 根据本发明的热固性粘合带或片材包括凝胶分数低于70％的热固性粘合剂层，在40℃下保存7天之前的凝胶分数之间的凝胶分数差异[（凝胶分数 在40℃下保存7天） - （在40℃下储存7天的凝胶分数）]为15％以下，在150℃下固化1小时后的凝胶分数为90％或 更多。

公开(公告)号：US20120009399A1

公开(公告)日：2012-01-12

申请号：US13067925

申请日：2011-07-07

申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Rie Kuwahara

发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Rie Kuwahara

IPC分类号： C09J7/02 ,  B32B33/00 ,  B32B27/08 ,  B32B7/10 ,  B32B37/12 ,  B32B37/14

CPC分类号： C09J133/00 ,  B32B5/022 ,  B32B7/06 ,  B32B7/10 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B29/002 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/546 ,  B32B2307/56 ,  B32B2307/732 ,  B32B2457/08 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  Y10T156/10 ,  Y10T428/24959

摘要： Disclosed is a double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which has silicone release liners, but is less polluting and excels in workability. The double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board includes at least a pressure-sensitive adhesive unit including a substrate and pressure-sensitive adhesive layers present on or above both sides of the substrate; and silicone release liners present on or above both surfaces of the pressure-sensitive adhesive unit, in which the pressure-sensitive adhesive layers each include an acrylic polymer based on, as an essential monomer component, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 1 to 14 carbon atoms, the pressure-sensitive adhesive unit has a thickness of 60 μm or less, and the adhesive sheet evolves siloxane gas, if any, in an amount of 1 ng/cm2 or less when heated at 120° C. for 10 minutes.

摘要翻译： 公开了一种用于固定具有硅氧烷剥离衬垫但具有污染性和可加工性优异的柔性印刷电路板的双面压敏粘合片。 用于固定柔性印刷电路板的双面压敏粘合片包括至少一个压敏粘合剂单元，其包括基材和存在于基材的两面上方的压敏粘合剂层; 和存在于压敏粘合剂单元的两个表面上方或上方的硅氧烷剥离衬垫，其中压敏粘合剂层各自包含基于作为必需单体组分的（甲基）丙烯酸烷基酯的丙烯酸类聚合物，其烷基部分为 具有1〜14个碳原子的直链或支链烷基，所述压敏粘合剂单元的厚度为60μm以下，并且所述粘合片以1ng / cm 2的量放出硅氧烷气体（如果有的话），或 在120℃加热10分钟时较少。

公开(公告)号：US20120052229A1

公开(公告)日：2012-03-01

申请号：US13216520

申请日：2011-08-24

申请人： Rie Kuwahara ,  Hakaru Horiguchi

发明人： Rie Kuwahara ,  Hakaru Horiguchi

IPC分类号： B32B33/00

CPC分类号： C09J133/18 ,  C09J7/385 ,  C09J7/403 ,  C09J179/08 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K3/386 ,  Y10T428/1476

摘要： Provided is a thermosetting adhesive tape or sheet resistant to deposition of foreign matter such as dust and dirt to the thermosetting adhesive layer surface.An adhesive tape or sheet for a flexible printed circuit board including a thermosetting adhesive layer, and a release liner on at least one surface of the thermosetting adhesive layer, wherein the arithmetic mean roughness (Ra) of the at least one surface of the release liner is 0.6 μm or more and less than 20 μm and the surface (at least one surface) of the release liner having an arithmetic mean roughness (Ra) of 0.6 μm or more and less than 20 μm is in contact with the surface of the thermosetting adhesive layer.

摘要翻译： 本发明提供一种热固性粘合带或薄片，其能够防止异物如灰尘和污垢沉积到热固性粘合剂层表面。 一种用于柔性印刷电路板的粘合带或片，其包括热固性粘合剂层和在热固性粘合剂层的至少一个表面上的剥离衬垫，其中所述剥离衬垫的至少一个表面的算术平均粗糙度（Ra） 为0.6μm以上且小于20μm，并且具有0.6μm以上且小于20μm的算术平均粗糙度（Ra）的剥离衬垫的表面（至少一个表面）与热固性材料的表面接触 粘合剂层。