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    Process for producing .alpha.-alumina fibers
    4.
    发明授权
    Process for producing .alpha.-alumina fibers 失效
    生产α-氧化铝纤维的方法

    公开(公告)号：US5573718A

    公开(公告)日：1996-11-12

    申请号：US248711

    申请日：1994-05-25

    申请人： Han-Chang Shih ,  Yuan-Horng Chiou ,  Mu-Tsuan Tsai

    发明人： Han-Chang Shih ,  Yuan-Horng Chiou ,  Mu-Tsuan Tsai

    IPC分类号： C04B35/622 ,  B28B1/00

    CPC分类号： C04B35/62236

    摘要： .alpha.-Alumina fibers are produced by a sol-gel process using aluminum nitrate as a starting material. A reaction mixture including aluminum nitrate, water and aluminum particles is refluxed until the aluminum particles are completely dissolved to obtain an aluminum hydroxide sol. The aluminum hydroxide sol is then aged to increase the viscosity thereof, spun, dried and sintered to obtain .alpha.-alumina crystalline fibers.

    摘要翻译： 通过使用硝酸铝作为起始材料的溶胶 - 凝胶法制备α-氧化铝纤维。 将包括硝酸铝，水和铝颗粒的反应混合物回流直至铝颗粒完全溶解，得到氢氧化铝溶胶。 然后将氢氧化铝溶胶老化以提高其粘度，纺丝，干燥和烧结以获得α-氧化铝晶体纤维。

    Synthesis of composite nanofibers for applications in lithium batteries
    5.
    发明授权
    Synthesis of composite nanofibers for applications in lithium batteries 有权
    用于锂电池的复合纳米纤维的合成

    公开(公告)号：US07323218B2

    公开(公告)日：2008-01-29

    申请号：US10419167

    申请日：2003-04-21

    申请人： Jin-Ming Chen ,  Chien-Te Hsieh ,  Hsiu-Wen Huang ,  Yue-Hao Huang ,  Hung-Hsiao Lin ,  Mao-Huang Liu ,  Shih-Chieh Liao ,  Han-Chang Shih

    发明人： Jin-Ming Chen ,  Chien-Te Hsieh ,  Hsiu-Wen Huang ,  Yue-Hao Huang ,  Hung-Hsiao Lin ,  Mao-Huang Liu ,  Shih-Chieh Liao ,  Han-Chang Shih

    IPC分类号： B05D7/22 ,  H05H1/24 ,  C23C16/00

    CPC分类号： D01F9/12 ,  Y10S977/89 ,  Y10S977/891 ,  Y10S977/892 ,  Y10S977/893

    摘要： Methods of fabricating one-dimensional composite nanofiber on a template membrane with porous array by chemical or physical process are disclosed. The whole procedures are established under a base concept of “secondary template”. First of all, tubular first nanofibers are grown up in the pores of the template membrane. Next, by using the hollow first nanofibers as the secondary templates, second nanofibers are produced therein. Finally, the template membrane is removed to obtain composite nanofibers. Showing superior performance in weight energy density, current discharge efficiency and irreversible capacity, the composite nanofibers are applied to extensive scopes like thin-film battery, hydrogen storage, molecular sieving, biosensor and catalyst support in addition to applications in lithium batteries.

    摘要翻译： 公开了通过化学或物理方法在具有多孔阵列的模板膜上制造一维复合纳米纤维的方法。 整个程序在“二级模板”的基本概念下建立。 首先，管状第一纳米纤维在模板膜的孔中长大。 接下来，通过使用中空的第一纳米纤维作为第二模板，在其中制造第二纳米纤维。 最后，除去模板膜，得到复合纳米纤维。 在体重能量密度，电流放电效率和不可逆容量方面表现出优异的性能，除了在锂电池中的应用之外，复合纳米纤维还应用于薄膜电池，储氢，分子筛，生物传感器和催化剂支持等广泛的范围。

    Method for the surface activation on the metalization of electronic devices
    6.
    发明申请
    Method for the surface activation on the metalization of electronic devices 审中-公开
    电子器件金属化表面活化方法

    公开(公告)号：US20060040065A1

    公开(公告)日：2006-02-23

    申请号：US10923057

    申请日：2004-08-19

    申请人： Han-Chang Shih ,  Jian-Hong Lin ,  Wei-Jen Hsieh ,  Yi-Ying Tsai ,  Uei-Shin Chen

    发明人： Han-Chang Shih ,  Jian-Hong Lin ,  Wei-Jen Hsieh ,  Yi-Ying Tsai ,  Uei-Shin Chen

    IPC分类号： C23C14/00 ,  H01L21/4763

    CPC分类号： C23C14/48 ,  C23C14/046 ,  C23C18/1879 ,  C23C18/38 ,  H01J37/32412 ,  H01L21/76859 ,  H01L21/76864 ,  H01L21/76874

    摘要： A method for surface activation on the metallization of electronic devices is provided. It uses plasma-immersion ion implantation and electroless plating to implant the seeds onto the diffusion barrier layer as catalyst for the electroless Cu plating to accomplish the ULSI interconnect metallization. It achieves electroless Cu plating in the deep 100 nm scaled line-width ULSI interconnect metallization by the Pd plasma implantation catalytic treatment. The method can fill the 100 nm line-width vias and trenches for gaining high quality electroless plated metal interconnects, and substitute for the traditional wet activation by SnCl2 and PdCl2 solution. For the plasma implanted seeds and electroless copper techniques, good Cu step coverage and gap-filling capability are observed in the trench and via metallization process with high adhesive strength. After thermal treatment, no obvious interfacial diffusion induced electric failure is found in the interface of the Cu/(implanted Pd)/TaN/FSG assembly. Good electric and interfacial structure reliability are observed in the process, too.

    摘要翻译： 提供了一种用于电子设备的金属化表面活化的方法。 它使用等离子体浸没离子注入和无电镀来将种子植入到扩散阻挡层上，作为化学镀铜的催化剂，以实现ULSI互连金属化。 它通过Pd等离子体注入催化处理在深度为100nm的线宽ULSI互连金属化中实现无电镀铜。 该方法可以填充100nm的线宽通孔和沟槽，以获得高质量的无电镀金属互连，并且替代传统的通过SnCl 2 2和PdCl 2 2溶液的湿活化 。 对于等离子体植入种子和无电铜技术，在沟槽和通过金属化过程中观察到良好的Cu台阶覆盖和间隙填充能力，具有高的粘合强度。 热处理后，在Cu /（注入Pd）/ TaN / FSG组件的界面处没有发现明显的界面扩散引起的电气故障。 在此过程中也观察到良好的电气和界面结构的可靠性。