摘要:
A connector-type optical transceiver includes optical devices, a silicon-on-insulator (SOI) optical waveguide and a silicon bench whose upper surface is provided with a U-shaped recesses for receiving the optical devices and the SOI optical waveguide, while being aligned to form optical paths. The SOI optical waveguide includes a silicon substrate, a single crystalline silicon layer whose upper surface is provided with waveguide portions, and a silica thin layer interposed between the silicon substrate and the single crystalline silicon layer to prevent light passing through the waveguide portions from being diffused. The silicon bench has v-shaped grooves extending longitudinally along the silicon bench and receives guide pins adapted to guide an external connecting terminal to be connected to the silicon bench.
摘要:
A method for forming an electrochromic layer pattern includes forming a transparent electrode layer and a photoresist layer on a transparent substrate, forming a photoresist pattern by laser interference lithography, and depositing an electrochromic layer pattern on the transparent electrode through openings defined by the photoresist pattern by depositing an electrochromic layer on a front surface of the substrate and then lifting up the photoresist pattern. An insulation layer may be further formed between the transparent layer and the photoresist layer. Here, the electrochromic layer may be formed after an insulation layer pattern is formed using the photoresist pattern as an etching mask. In this case, the electrochromic layer pattern is formed in openings defined by the insulation layer pattern. As a result, a contact surface area between the electrochromic layer pattern and the ion conductive layer is increased to ensure a rapid response speed.
摘要:
A chuck assembly for high density plasma equipment includes: a chuck having an upper surface and a plurality of pin holes formed in an outer peripheral portion, wherein the chuck upper surface is configured to receive a semiconductor substrate thereon; a substrate guide disposed on an outer surface of the chuck, wherein the substrate guide is configured to prevent a semiconductor substrate positioned on the upper surface of the chuck from being separated from the chuck; a fixing plate disposed at a lower portion of the chuck; a plurality of lift pins secured to the fixing plate and extending in an upward direction from the fixing plate so that each lift pin is inserted into a respective one of the pin holes, wherein each lift pin has an upper surface that extends to a position adjacent to the upper surface of the chuck; and a chuck lifter penetrating the fixing plate and engaged with a lower portion of the chuck, wherein the chuck lifter is configured to move the chuck upward and downward.
摘要:
The present invention discloses a keyboard comprising light emitting devices, each respectively disposed below a key to lighten the top surface of the key; and a micro controller unit transmitting signals generated by each key to the computer, having switches for controlling the light emitting devices, and controlling switches according to signals transmitted from the computer, and a method of selecting the colors of the keys of the same.
摘要:
Provided are an aluminum alloy and a manufacturing method thereof. In the method, aluminum and a master alloy containing a calcium (Ca)-based compound are provided. A melt is prepared, in which the master alloy and the Al are melted. The aluminum alloy may be manufactured by casting the melt.
摘要:
Provided are an aluminum alloy and a manufacturing method thereof. In the method, aluminum and a magnesium (Mg) master alloy containing a calcium (Ca)-based compound are provided. A melt is prepared, in which the Mg master alloy and the Al are melted. The aluminum alloy may be manufactured by casting the melt.
摘要:
Batch-type deposition apparatus having a gland portion are provided. The apparatus include a reaction furnace, a gas nozzle located in the reaction furnace, a gas supply conduit located outside the reaction furnace and a gland portion for connecting the gas nozzle to the gas supply conduit. The gland portion includes a gas nozzle end extended from the gas nozzle toward an outside region of the reaction furnace and a gas supply conduit end extended from the gas supply conduit. The gas nozzle end is connected to the gas supply conduit end through a buffer member. The buffer member has an inclined inner wall for connecting an inner wall of the gas nozzle end to that of the gas supply conduit end.