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    Pedestal covers
    2.
    发明授权
    Pedestal covers 有权
    基座盖

    公开(公告)号：US08371567B2

    公开(公告)日：2013-02-12

    申请号：US13086010

    申请日：2011-04-13

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： B23Q3/00 ,  H01L21/306 ,  C23F1/00

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被新的盖子替代，而不需要整个装置的重大拆卸。

    Pedestal covers
    4.
    发明授权
    Pedestal covers 有权
    基座盖

    公开(公告)号：US08851463B2

    公开(公告)日：2014-10-07

    申请号：US13736410

    申请日：2013-01-08

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： H01B13/10 ,  G03F7/20

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被更换，而不需要整个装置的重大拆卸。

    PEDESTAL COVERS
    5.
    发明申请
    PEDESTAL COVERS 有权

    公开(公告)号：US20130122431A1

    公开(公告)日：2013-05-16

    申请号：US13736410

    申请日：2013-01-08

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： H01L21/683 ,  B23Q3/10

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被新的盖子替代，而不需要整个装置的重大拆卸。

    PEDESTAL COVERS
    6.
    发明申请
    PEDESTAL COVERS 有权

    公开(公告)号：US20120264051A1

    公开(公告)日：2012-10-18

    申请号：US13086010

    申请日：2011-04-13

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： G03C11/12 ,  H01L21/477 ,  B23Q3/00

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被更换，而不需要整个装置的重大拆卸。

    CMP APPARATUSES WITH POLISHING ASSEMBLIES THAT PROVIDE FOR THE PASSIVE REMOVAL OF SLURRY
    7.
    发明申请
    CMP APPARATUSES WITH POLISHING ASSEMBLIES THAT PROVIDE FOR THE PASSIVE REMOVAL OF SLURRY 有权
    带有抛光组件的CMP设备，用于无源拆卸浆料

    公开(公告)号：US20080318495A1

    公开(公告)日：2008-12-25

    申请号：US11768045

    申请日：2007-06-25

    申请人： Fergal O'Moore ,  Steve Schultz ,  Brian Severson

    发明人： Fergal O'Moore ,  Steve Schultz ,  Brian Severson

    IPC分类号： B24B1/00

    CPC分类号： B24B37/26

    摘要： Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that opens at the peripheral surface of the underlying member.

    摘要翻译： 提供了具有抛光组件的化学机械平面化设备，其提供被动去除浆料。 根据实施例，工件抛光组件包括抛光垫，抛光垫包括抛光表面和排出孔，其从抛光表面延伸穿过抛光垫并被构造成从抛光表面接收浆料。 下部构件设置在抛光垫下方并且包括外围表面。 底部构件包括与孔隙流体连通并且在底部构件的外围表面处开口的通道。

    Carrier head for workpiece planarization/polishing
    10.
    发明授权
    Carrier head for workpiece planarization/polishing 有权
    用于工件平面化/抛光的载体头

    公开(公告)号：US07335092B1

    公开(公告)日：2008-02-26

    申请号：US11553580

    申请日：2006-10-27

    申请人： Brian Severson ,  John Stumpf ,  Stephen C. Schultz

    发明人： Brian Severson ,  John Stumpf ,  Stephen C. Schultz

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30

    摘要： A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, and the foot portion abuts the mount plate proximate the aperture. A flexible bladder has first and second ribs that are received between the mount plate and the foot portion. An annular fastener is removably coupled to the leg portion, and engages the mount plate to cause the first and second ribs to be sealingly secured between the mount plate and the foot portion.

    摘要翻译： 提供了用于支撑工件的承载头。 载体头包括具有穿过其中的孔的安装板，以及具有从其延伸的脚部和第一腿部的夹紧环。 第一腿部分延伸穿过孔，并且脚部靠近孔的邻接安装板。 柔性气囊具有容纳在安装板和脚部之间的第一和第二肋。 环形紧固件可拆卸地联接到腿部，并且与安装板接合，以使第一和第二肋条密封地固定在安装板和脚部之间。